MDC3105 Integrated Relay, Inductive Load Driver This device is intended to replace an array of three to six discrete components with an integrated SMT part. It is available in a SOT−23 package. It can be used to switch 3 to 6 Vdc inductive loads such as relays, solenoids, incandescent lamps, and small DC motors without the need of a free−wheeling diode. http://onsemi.com Relay, Inductive Load Driver Silicon SMALLBLOCKt Integrated Circuit Features • Provides a Robust Driver Interface between DC Relay Coil and • • • • • • • • • • Sensitive Logic Circuits Optimized to Switch Relays from a 3.0 V to 5.0 V Rail Capable of Driving Relay Coils Rated up to 2.5 W at 5.0 V Features Low Input Drive Current and Good Back−to−Front Transient Isolation Internal Zener Eliminates Need for Free−Wheeling Diode Internal Zener Clamp Routes Induced Current to Ground for Quieter System Operation Guaranteed Off State with No Input Connection Supports Large Systems with Minimal Off−State Leakage ESD Resistant in Accordance with the Class 1C Human Body Model Low Sat Voltage Reduces System Current Drain by Allowing Use of Higher Resistance Relay Coils Pb−Free Packages are Available MARKING DIAGRAMS SOT−23 CASE 318 STYLE 6 1 JW M G G 1 SC−74 CASE 318F STYLE 8 1 1 Applications JW M G G • Telecom: Line Cards, Modems, Answering Machines, FAX Machines, Feature Phone Electronic Hook Switch JW = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. • Computer and Office: Photocopiers, Printers, Desktop Computers • Consumer: TVs and VCRs, Stereo Receivers, CD Players, Cassette Recorders, TV Set Top Boxes • Industrial: Small Appliances, White Goods, Security Systems, Automated Test Equipment, Garage Door Openers • Automotive: 5.0 V Driven Relays, Motor Controls, Power Latches, Lamp Drivers ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. INTERNAL CIRCUIT DIAGRAMS Vout Vin (1) (3) Vout 1.0 k 6.6 V 33 k GND Vin (5) (3) 1.0 k 6.6 V 6.6 V 33 k 33 k GND CASE 318 December, 2005 − Rev. 5 Vout 1.0 k (2) © Semiconductor Components Industries, LLC, 2005 (6) (1) GND Vin (2) (4) CASE 318F 1 Publication Order Number: MDC3105/D MDC3105 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Power Supply Voltage Symbol Value Unit VCC 6.0 Vdc Input Voltage Vin(fwd) 6.0 Vdc Reverse Input Voltage Vin(rev) −0.5 Vdc Ezpk 50 mJ Output Sink Current − Continuous IO 500 mA Junction Temperature TJ 150 °C Operating Ambient Temperature Range TA −40 to +85 °C Storage Temperature Range Tstg −65 to +150 °C Repetitive Pulse Zener Energy Limit (Duty Cycle ≤ 0.01%) SOT−23 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Symbol Value Unit Total Device Power Dissipation (Note 1) Derate above 25°C Rating SOT−23 PD 225 1.8 mW mW/°C Total Device Power Dissipation (Note 1) Derate above 25°C SC−74 PD 380 1.5 mW mW/°C SOT−23 SC−74 RqJA 556 329 °C/W Thermal Resistance Junction−to−Ambient 1. FR−5 PCB of 1″ x 0.75″ x 0.062″, TA = 25°C ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit V(BRout) V(−BRout) 6.2 − 6.6 −0.7 7.0 − V V − − − − 0.1 30 − − 0.4 − 0.8 1.6 − 0.12 0.16 250 400 − OFF CHARACTERISTICS Output Zener Breakdown Voltage (@ IT = 10 mA Pulse) Output Leakage Current @ 0 Input Voltage (VO = 5.5 Vdc, Vin = O.C., TA = 25°C) (VO = 5.5 Vdc, Vin = O.C., TA = 85°C) mA IOO Guaranteed “OFF” State Input Voltage (IO ≤ 100 mA) Vin(off) V ON CHARACTERISTICS Input Bias Current (HFE Limited) (IO = 250 mA, VO = 0.25 Vdc) Iin Output Saturation Voltage (IO = 250 mA, Iin = 1.5 mA) VO(sat) Output Sink Current − Continuous (VCE = 0.25 Vdc, Iin = 1.5 mA) IO(on) mAdc Vdc mA ORDERING INFORMATION Device MDC3105LT1 Package Shipping † SOT−23 MDC3105LT1G SOT−23 (Pb−Free) MDC3105DMT1 SC−74 3000 / Tape & Reel MDC3105DMT1G SC−74 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MDC3105 TYPICAL APPLICATION−DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS Characteristic Symbol Min Typ Max tPHL tPLH − − 55 430 − − High to Low Propagation Delay; Figures 1, 13 (3.0 V 74HC04) Low to High Propagation Delay; Figures 1, 13 (3.0 V 74HC04) tPHL tPLH − − 85 315 − − High to Low Propagation Delay; Figures 1, 14 (5.0 V 74LS04) Low to High Propagation Delay; Figures 1, 14 (5.0 V 74LS04) tPHL tPLH − − 55 2.4 − − tf tr − − 45 160 − − Fall Time; Figures 1, 13 (3.0 V 74HC04) Rise Time; Figures 1, 13 (3.0 V 74HC04) tf tr − − 70 195 − − Fall Time; Figures 1, 14 (5.0 V 74LS04) Rise Time; Figures 1, 14 (5.0 V 74LS04) tf tr − − 45 2.4 − − Propagation Delay Times: High to Low Propagation Delay; Figure 1 (5.0 V 74HC04) Low to High Propagation Delay; Figure 1 (5.0 V 74HC04) nS Transition Times: Fall Time; Figure 1 (5.0 V 74HC04) Rise Time; Figure 1 (5.0 V 74HC04) mS nS VCC Vin Units 50% GND tPLH tPHL VCC 90% 50% 10% Vout VZ GND tr tf Figure 1. Switching Waveforms http://onsemi.com 3 mS MDC3105 TYPICAL PERFORMANCE CHARACTERISTICS (ON CHARACTERISTICS) 5.0 450 400 25°C 350 300 250 −40°C 200 150 100 100 3.5 MC74HC04 @ 3.0 Vdc 2.5 2.0 MC68HC05C8 @ 3.3 Vdc MC14049B @ 4.5 Vdc 1.5 MC54LS04 +BAL99LT1 1000 0 0.5 TJ = 25°C VO = 0.25 V 1.0 1.5 IO, OUTPUT SINK CURRENT (mA) 3.0 2.5 3.5 4.0 Figure 3. Input V−I Requirement Compared to Possible Source Logic Outputs 500 50 Iin = 1.5 mA 40 Iout , OUTPUT CURRENT (mA) 45 OUTPUT CURRENT (mA) 2.0 INPUT CURRENT (mA) Figure 2. Transistor DC Current Gain TJ = 85°C 35 30 25°C 25 20 −40 °C 15 10 1.2 mA 1.0 mA 400 0.8 mA 300 0.6 mA 200 0.4 mA 0.2 mA 100 0.1 mA 5.0 0 0 0.01 0.02 0.03 0.04 0 0.05 0.06 0.07 0.08 0.09 0.1 0 Figure 4. Threshold Effects 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VO, OUTPUT VOLTAGE (Vdc) INPUT CURRENT (mA) Figure 5. Transistor Output V−I Characteristic 8.5 TJ = 25°C VZ , ZENER CLAMP VOLTAGE (VOLTS) Vout , OUTPUT VOLTAGE (Vdc) MDC3105LT1 Vin vs. Iin 3.0 0.5 0 0 10 MC68HC05C8 @ 5.0 Vdc 4.0 1.0 VO = 1.0 V VO = 0.25 V 50 1.0 MC74HC04 @ 4.5 Vdc 4.5 TJ = 85°C INPUT VOLTAGE (VOLTS) HFE , TRANSISTOR DC CURRENT GAIN 500 TJ = −40°C Iout = 500 mA 10 mA 0.04 0.1 50 mA 125 mA 175 mA 350 mA 8.0 7.5 7.0 TJ = 85°C 25°C 6.5 −40 °C 6.0 1.0 10 1.0 Iin, INPUT CURRENT (mA) 10 100 1000 IZ, ZENER CURRENT (mA) Figure 6. Output Saturation Voltage versus Iout/Iin Figure 7. Zener Clamp Voltage versus Zener Current http://onsemi.com 4 MDC3105 TYPICAL PERFORMANCE CHARACTERISTICS (OFF CHARACTERISTICS) 100 k 10,000 k TJ = 25°C VCC = 5.5 Vdc Vin = 0.5 Vdc OUTPUT LEAKAGE CURRENT (nA) OUTPUT LEAKAGE CURRENT (nA) 1000 k 100 k Vin = 0.35 Vdc 10 k 1.0 k 100 Vin = 0 Vdc 10 1.0 −55 −35 −15 5.0 45 25 TJ, JUNCTION TEMPERATURE (°C) 65 Vin = 0.5 Vdc 10 k 1.0 k 100 Vin = 0.35 Vdc 10 Vin = 0 Vdc 1.0 0 85 0 Figure 8. Output Leakage Current versus Temperature 1.0 2.0 3.0 4.0 5.0 VCC, SUPPLY VOLTAGE (Vdc) 6.0 7.0 Figure 9. Output Leakage Current versus Supply Voltage 1.0 Iout(max) = 500 mA RCE(sat) *24 ms °PW = 7.0 ms DC = 5% °PW = 10 ms DC = 20% TA = 25°C ° = TRANSISTOR PC THERMAL LIMIT * = MAX L/R FROM ZENER PULSED ENERGY LIMIT (REFER TO FIGURE 11) °PW = 0.1 s DC = 50% *34 ms *90 ms °CONTINUOUS DUTY 0.1 *232 ms *375 ms VCC(max) = +6.0 Vdc TYPICAL IZ vs VZ 0.01 0.1 1.0 Vout (VOLTS) Figure 10. Safe Operating Area for MDC3105LT1 http://onsemi.com 5 10 MDC3105 100 k TA = 25°C Emax = 50 mJ L/R = 2 * Emax ÷ (Vzpk * Izpk) MAX L/R TIME CONSTANT (ms) 10 k 1.0 k 100 10 0.001 0.01 1.0 0.1 Izpk (AMPS) Figure 11. Zener Repetitive Pulse Energy Limit on L/R Time Constant for MDC3105LT1 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 D = 0.5 0.2 0.1 0.1 0.05 Pd(pk) 0.02 0.01 0.01 PW SINGLE PULSE t1 t2 PERIOD DUTY CYCLE = t1/t2 0.001 0.01 0.1 1.0 10 100 t1, PULSE WIDTH (ms) 1000 10,000 Figure 12. Transient Thermal Response for MDC3105LT1 http://onsemi.com 6 100,000 1,000,000 MDC3105 Using TTR Designing for Pulsed Operation Also note that these calculations assume a rectangular pulse shape for which the rise and fall times are insignificant compared to the pulse width. If this is not the case in a specific application, then the VO and IO waveforms should be multiplied together and the resulting power waveform integrated to find the total dissipation across the device. This then would be the number that has to be less than or equal to the Pd(pk) calculated above. A circuit simulator having a waveform calculator may prove very useful for this purpose. For a repetitive pulse operating condition, time averaging allows one to increase a device’s peak power dissipation rating above the average rating by dividing by the duty cycle of the repetitive pulse train. Thus, a continuous rating of 200 mW of dissipation is increased to 1.0 W peak for a 20% duty cycle pulse train. However, this only holds true for pulse widths which are short compared to the thermal time constant of the semiconductor device to which they are applied. For pulse widths which are significant compared to the thermal time constant of the device, the peak operating condition begins to look more like a continuous duty operating condition over the time duration of the pulse. In these cases, the peak power dissipation rating cannot be merely time averaged by dividing the continuous power rating by the duty cycle of the pulse train. Instead, the average power rating can only be scaled up a reduced amount in accordance with the device’s transient thermal response, so that the device’s max junction temperature is not exceeded. Figure 12 of the MDC3105 data sheet plots its transient thermal resistance, r(t) as a function of pulse width in ms for various pulse train duty cycles as well as for a single pulse and illustrates this effect. For short pulse widths near the left side of the chart, r(t), the factor, by which the continuous duty thermal resistance is multiplied to determine how much the peak power rating can be increased above the average power rating, approaches the duty cycle of the pulse train, which is the expected value. However, as the pulse width is increased, that factor eventually approaches 1.0 for all duty cycles indicating that the pulse width is sufficiently long to appear as a continuous duty condition to this device. For the MDC3105LT1, this pulse width is about 100 seconds. At this and larger pulse widths, the peak power dissipation capability is the same as the continuous duty power capability. To use Figure 12 to determine the peak power rating for a specific application, enter the chart with the worst case pulse condition, that is the max pulse width and max duty cycle and determine the worst case r(t) for your application. Then calculate the peak power dissipation allowed by using the equation, Notes on SOA and Time Constant Limitations Figure 10 is the Safe Operating Area (SOA) for the MDC3105. Device instantaneous operation should never be pushed beyond these limits. It shows the SOA for the Transistor “ON” condition as well as the SOA for the Zener during the turn−off transient. The max current is limited by the Izpk capability of the Zener as well as the transistor in addition to the max input current through the resistor. It should not be exceeded at any temperature. The BJT power dissipation limits are shown for various pulse widths and duty cycles at an ambient temperature of 25°C. The voltage limit is the max VCC that can be applied to the device. When the input to the device is switched off, the BJT “ON” current is instantaneously dumped into the Zener diode where it begins its exponential decay. The Zener clamp voltage is a function of that BJT current level as can be seen by the bowing of the VZ versus IZ curve at the higher currents. In addition to the Zener’s current limit impacting this device’s 500 mA max rating, the clamping diode also has a peak energy limit as well. This energy limit was measured using a rectangular pulse and then translated to an exponential equivalent using the 2:1 relationship between the L/R time constant of an exponential pulse and the pulse width of a rectangular pulse having equal energy content. These L/R time constant limits in ms appear along the VZ versus IZ curve for the various values of IZ at which the Pd lines intersect the VCC limit. The L/R time constant for a given load should not exceed these limits at their respective currents. Precise L/R limits on Zener energy at intermediate current levels can be obtained from Figure 11. Pd(pk) = (TJmax − TAmax) ÷ (RqJA * r(t)) Pd(pk) = (150°C − TAmax) ÷ (556°C/W * r(t)) Thus for a 20% duty cycle and a PW = 40 ms, Figure 12 yields r(t) = 0.3 and when entered in the above equation, the max allowable Pd(pk) = 390 mW for a max TA = 85°C. http://onsemi.com 7 MDC3105 Designing with this Data Sheet 1. 2. 3. 4. 5. Determine the maximum inductive load current (at max VCC, min coil resistance and usually minimum temperature) that the MDC3105 will have to drive and make sure it is less than the max rated current. For pulsed operation, use the Transient Thermal Response of Figure 12 and the instructions with it to determine the maximum limit on transistor power dissipation for the desired duty cycle and temperature range. Use Figures 10 and 11 with the SOA notes above to insure that instantaneous operation does not push the device beyond the limits of the SOA plot. While keeping any VO(sat) requirements in mind, determine the max input current needed to achieve that output current from Figures 2 and 6. For levels of input current below 100 mA, use the input threshold curves of Figure 4 to verify that 6. 7. 8. 9. there will be adequate input current available to turn on the MDC3105 at all temperatures. For levels of input current above 100 mA, enter Figure 3 using that max input current and determine the input voltage required to drive the MDC3105 from the solid Vin versus Iin line. Select a suitable drive source family from those whose dotted lines cross the solid input characteristic line to the right of the Iin, Vin point. Using the max output current calculated in step 1, check Figure 7 to insure that the range of Zener clamp voltage over temperature will satisfy all system and EMI requirements. Using Figures 8 and 9, insure that “OFF” state leakage over temperature and voltage extremes does not violate any system requirements. Review circuit operation and insure none of the device max ratings are being exceeded. APPLICATIONS DIAGRAMS +3.0 ≤ VDD ≤ +3.75 Vdc +4.5 ≤ VCC ≤ +5.5 Vdc + + AROMAT TX2−L2−5 V Vout (6) Vout (3) MDC3105DMT1 74HC04 OR EQUIVALENT Vin (5) Vin (2) GND (1) GND (4) Figure 13. A 200 mW, 5.0 V Dual Coil Latching Relay Application with 3.0 V−HCMOS Level Translating Interface http://onsemi.com 8 74HC04 OR EQUIVALENT MDC3105 Max Continuous Current Calculation for TX2−5V Relay, R1 = 178 W Nominal @ RA = 25°C Assuming ±10% Make Tolerance, R1 = 178 W * 0.9 = 160 W Min @ TA = 25°C − − TC for Annealed Copper Wire is 0.4%/°C AROMAT JS1E−5V R1 = 160 W * [1+(0.004) * (−40°−25°)] = 118 W Min @ −40°C IO Max = (5.5 V Max − 0.25V) /118 W = 45 mA +4.5 TO +5.5 Vdc + + + + +4.5 TO +5.5 Vdc + AROMAT JS1E−5V AROMAT TX2−5V AROMAT JS1E−5V − − Vout (3) − Vout (3) MDC3105LT1 74LS04 AROMAT JS1E−5V MDC3105LT1 74HC04 OR EQUIVALENT BAL99LT1 Vin (1) GND (2) Figure 14. A 140 mW, 5.0 V Relay with TTL Interface Figure 15. A Quad 5.0 V, 360 mW Coil Relay Bank http://onsemi.com 9 MDC3105 4.5 225 3.5 175 IC (mA) V in (VOLTS) TYPICAL OPERATING WAVEFORMS 2.5 125 1.5 75 500 M 25 10 30 50 TIME (ms) 70 90 10 9 172 7 132 5 52 1 12 30 50 TIME (ms) 70 70 90 92 3 10 50 TIME (ms) Figure 17. 20 Hz Square Wave Response IZ (mA) Vout (VOLTS) Figure 16. 20 Hz Square Wave Input 30 90 10 Figure 18. 20 Hz Square Wave Response 30 50 TIME (ms) 70 90 Figure 19. 20 Hz Square Wave Response http://onsemi.com 10 MDC3105 PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AN NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. D SEE VIEW C 3 HE E c 1 2 b DIM A A1 b c D E e L L1 HE 0.25 e q A L A1 L1 VIEW C MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR SOLDERING FOOTPRINT* 0.95 0.037 0.95 0.037 2.0 0.079 0.9 0.035 SCALE 10:1 0.8 0.031 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 MDC3105 PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03 OBSOLETE. NEW STANDARD 318F−04. D 6 5 4 2 3 E HE 1 b DIM A A1 b c D E e L HE q e 0.05 (0.002) q C A L A1 MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° STYLE 8: PIN 1. EMITTER 1 2. BASE 2 3. COLLECTOR 2 4. EMITTER 2 5. BASE 1 6. COLLECTOR 1 SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SMALLBLOCK is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 12 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MDC3105/D