3 A Dual High-Speed MOSFET Drivers

NCP4423, NCP4424,
NCP4425
3 A Dual High-Speed
MOSFET Drivers
The NCP4423/4424/4425 are MOSFET drivers that are capable of
giving reliable service in demanding electrical environments.
Although primarily intended for driving power MOSFETs, these
drivers are well–suited for driving other loads (capacitive, resistive,
or inductive) which require a low impedance driver capable of high
peak currents and fast switching times. Applications such as heavily
loaded clock lines, coaxial cables, or piezoelectric transducers can all
be driven with the NCP4423/4424/4425. The only known limitation
on loading is that the total power dissipated of the driver must be kept
within the maximum power dissipation limits of the package.
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MARKING
DIAGRAM
16
SO–16
DW SUFFIX
CASE 751G
16
1
NCP442x
YYWWXZ
1
Features
•
•
•
•
•
•
•
•
•
•
High Peak Output Current (3 A)
Wide Operating Range (4.5 V to 18 V)
High Capacitive Load Drive Capability (1800 pF in 25 nsec)
Short Delay Times (40 nsec Typ)
Matched Rise/Fall Times
Low Supply Current
With Logic “1’’ Input (3.5 mA)
With Logic “0’’ Input (350 µA)
Low Output Impedance (3.5 Ω Typ)
Latch–Up Protected: Will Withstand 1.5 A Reverse Current
Logic Input Will Withstand Negative Swing Up to 5 V
ESD Protected (4 kV)
8
NCP442x
YYWWXZ
CO
PDIP–8
P SUFFIX
CASE 626
8
1
1
x
YY
WW
X
Z
CO
= Device Number (3, 4, or 5)
= Year
= Work Week
= Assembly ID Code
= Subcontractor ID Code
= Country of Origin
ORDERING INFORMATION
Device
FUNCTIONAL BLOCK DIAGRAM
VDD
INVERTING
300 mV
OUTPUT
INPUT
Package
Shipping
NCP4423DWR2
SO–16
1000 Tape & Reel
NCP4424DWR2
SO–16
1000 Tape & Reel
NCP4425DWR2
SO–16
1000 Tape & Reel
NCP4423P
PDIP–8
50 Units/Rail
NCP4424P
PDIP–8
50 Units/Rail
NCP4425P
PDIP–8
50 Units/Rail
NONINVERTING
4.7 V
NCP4423 DUAL INVERTING
NCP4424 DUAL NONINVERTING
NCP4425 ONE INV., ONE NONINV
GND
EFFECTIVE
INPUT C = 20 pF
(EACH INPUT)
NOTES:
1. NCP4425 has one inverting and one noninverting driver.
2. Ground any unused driver input.
 Semiconductor Components Industries, LLC, 2002
August, 2002 – Rev. 2
1
Publication Order Number:
NCP4423/D
NCP4423, NCP4424, NCP4425
PIN CONNECTIONS
16–Pin SO Wide
4423
4424
4425
8–Pin DIP
NC
1
16 NC
NC
NC
1
IN A
2
15 OUT A
OUT A
OUT A
2
NC
3
14 OUT A
OUT A
OUT A
3
GND
4
13 VDD
VDD
VDD
4
GND
5
12 VDD
VDD
VDD
NCP4423
NCP4424
NCP4425
NC
6
11 OUT B
OUT B
OUT B
IN B
7
10 OUT B
OUT B
OUT B
NC
8
9
NC
NC
NC
(Top View)
NC = NO CONNECTION
NOTE: Duplicate pins must both be connected for proper
operation.
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2
NCP4423
NCP4424
NCP4425
8
7
6
5
NCP4423, NCP4424, NCP4425
ABSOLUTE MAXIMUM RATINGS
Value
Unit
Supply Voltage
Rating
+22
V
Input Voltage, IN A or IN B (VDD + 0.3 V to GND – 5.0 V)
–5
V
+150
°C
–65 to +150
°C
Lead Temperature (Soldering, 10 sec)
+300
°C
Package Thermal Resistance
SOIC, RθJA
PDIP, RθJA
PDIP, RθJC
155
–125
–45
Operating Temperature Range
–40 to +85
°C
470
730
mW
mc
Maximum Chip Temperature
Storage Temperature Range, Tstg
°C/W
Package Power Dissipation (TA 70°C)
SOIC
PDIP
ELECTRICAL CHARACTERISTICS (TA = +25°C with 4.5 V VDD 18 V, unless otherwise specified.)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
Logic 1 High Input Voltage
VOH
–
2.4
–
–
V
Logic 0 Low Input Voltage
VIL
–
–
–
0.8
V
Input Current
IIN
0 V VIN VDD
–1.0
–
1.0
µA
VOH
–
VDD –0.025
–
–
V
Input
Output
High Output Voltage
Low Output Voltage
VOL
–
–
–
0.025
V
Output Resistance, High
ROH
IOUT = 10 mA,
VDD = 18 V
–
2.8
5.0
Ω
Output Resistance, Low
ROL
IOUT = 10 mA,
VDD = 18 V
–
3.5
5.0
Ω
Peak Output Current
IPK
–
–
3.0
–
A
Latch–Up Protection
Withstand Reverse Current
IREV
Duty Cycle 2%
t 300 µs
1.5
–
–
A
Rise Time
tR
Figure 1, CL = 1800 pF
–
23
35
nsec
Fall Time
tF
Figure 1, CL = 1800 pF
–
25
35
nsec
Delay Time 1
tD1
Figure 1, CL = 1800 pF
–
33
75
nsec
Delay Time 2
tD2
Figure 1, CL = 1800 pF
–
38
75
nsec
IS
VIN = 3.0 V (Both Inputs)
VIN = 0 V (Both Inputs)
–
–
1.5
0.15
2.5
0.25
mA
Switching Time (Note 1)
Power Supply
Power Supply Current
1. Switching times guaranteed by design.
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3
NCP4423, NCP4424, NCP4425
ELECTRICAL CHARACTERISTICS (Over operating temperature range with 4.5 V VDD 18 V, unless otherwise specified.)
Characteristic
Symbol
Test Conditions
Min
Typ
Max
Unit
Logic 1 High Input Voltage
VIH
–
2.4
–
–
V
Logic 0 Low Input Voltage
VIL
–
–
–
0.8
V
Input Current
IIN
0 V VIN VDD
–10
–
10
µA
High Output Voltage
VOH
–
VDD –0.025
–
–
V
Low Output Voltage
VOL
–
–
–
0.025
V
Output Resistance, High
RO
IOUT = 10 mA,
VDD = 18 V
–
3.7
8.0
Ω
Output Resistance, Low
RO
IOUT = 10 mA,
VDD = 18 V
–
4.3
8.0
Ω
Peak Output Current
IPK
–
–
3.0
–
A
Latch–Up Protection
Withstand Reverse Current
IREV
Duty Cycle 2%
t 300 µsec
1.5
–
–
A
tR
Figure 1, CL = 1800 pF
–
28
60
nsec
Fall Time
tF
Figure 1, CL = 1800 pF
–
32
60
nsec
Delay Time 1
tD1
Figure 1, CL = 1800 pF
–
32
100
nsec
Delay Time 2
tD2
Figure 1, CL = 1800 pF
–
38
100
nsec
IS
VIN = 3.0 V (Both Inputs)
VIN = 0 V (Both Inputs)
–
–
2.0
0.2
3.5
0.3
mA
Input
Output
Switching Time (Note 1)
Rise Time
Power Supply
Power Supply Current
1. Switching times guaranteed by design.
Test Circuit
Test Circuit
VDD = 16 V
1 µF
WIMA
MKS–2
1 µF
WIMA
MKS–2
0.1 µF
CERAMIC
1
INPUT
VDD = 16 V
OUTPUT
1
INPUT
OUTPUT
CL = 1800 pF
INPUT: 100 kHz,
square wave,
tRISE = tFALL
≤ 10 ns
CL = 1800 pF
2
16 V
90%
INPUT
10%
tD1
tF
tD2
0V
tR
90%
OUTPUT
10%
10%
16 V
90%
OUTPUT
0V
NCP4424
(1/2 NCP4425)
+5 V
90%
INPUT
0V
2
INPUT: 100 kHz,
square wave,
tRISE = tFALL
≤ 10 ns
NCP4423
(1/2 NCP4425)
+5 V
0.1 µF
CERAMIC
10%
0V
Figure 1. Inverting Driver Switching Time
90%
tD1
tR
10%
90%
tD2
tF
10%
Figure 2. Noninverting Driver Switching Time
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NCP4423, NCP4424, NCP4425
TYPICAL ELECTRICAL CHARACTERISTICS
100
100
4700 pF
4700 pF
80
80
3300 pF
60
t FALL (nsec)
t RISE (nsec)
1000 pF
1500 pF
2200 pF
40
20
2200 pF
20
470 pF
4
6
8
10
12
14
16
0
18
6
8
10
12
14
16
VDD
Figure 3. Rise Time vs. Supply Voltage
Figure 4. Fall Time vs. Supply Voltage
18
100
5V
60
5V
80
t FALL (nsec)
80
t RISE (nsec)
4
VDD
100
10 V
15 V
40
60
10 V
15 V
40
20
20
0
100
1000
CLOAD (pF)
0
100
10000
1000
10000
CLOAD (pF)
Figure 5. Rise Time vs. Capacitive Load
Figure 6. Fall Time vs. Capacitive Load
32
100
CLOAD = 2200 pF
CLOAD = 2200 pF
VDD = 10 V
tFALL
30
80
DELAY TIME (ns)
28
TIME (ns)
1500 pF
40
470 pF
0
1000 pF
3300 pF
60
tRISE
26
24
tRISE
22
tFALL
20
18
–55
–35
–15
tD1
60
40
tD2
20
5
25
45
65
85
105
0
125
0
TA (°C)
1
2
3
4
5
6
7
8
9
10 11
12
INPUT (V)
Figure 7. Rise and Fall Times vs. Temperature
Figure 8. Propagation Delay vs. Input Amplitude
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5
NCP4423, NCP4424, NCP4425
TYPICAL ELECTRICAL CHARACTERISTICS
50
50
CLOAD = 2200 pF
45
CLOAD = 2200 pF
45
DELAY TIME (ns)
DELAY TIME (ns)
tD2
40
35
tD2
30
tD2
40
35
tD2
30
25
25
20
4
6
8
10
12
14
16
20
–55
18
–35
–15
5
VDD
Figure 9. Propagation Delay Time vs. Supply
Voltage
25
45
TA (°C)
65
85
105
125
105
125
Figure 10. Delay Time vs. Temperature
1.4
TA = +25°C
BOTH INPUTS = 1
1.2
I QUIESCENT (mA)
I QUIESCENT (mA)
1
BOTH INPUTS = 0
0.1
1.0
0.8
INPUTS = 1
0.6
0.4
0.2
0.01
4
6
8
10
12
14
16
INPUTS = 0
0.0
–55
18
–35
–15
5
VDD
Figure 11. Quiescent Current vs. Supply
Voltage
85
14
12
12
WORST CASE @ TJ = +150°C
WORST CASE @ TJ = +150°C
10
RDS(ON) ( Ω )
RDS(ON) ( Ω )
65
Figure 12. Quiescent Current vs. Temperature
14
8
6
4
2
25
45
TA (°C)
8
6
TYP @ TA = +25°C
4
TYP @ TA = +25°C
4
10
2
VDD
10
VDD
Figure 13. Output Resistance (Output High)
vs. Supply Voltage
Figure 14. Output Resistance (Output Low)
vs. Supply Voltage
6
8
10
12
14
16
18
4
6
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6
8
12
14
16
18
NCP4423, NCP4424, NCP4425
TYPICAL ELECTRICAL CHARACTERISTICS
60
60
VDD = 18 V
63.4 kHz
40
35.5 kHz
20 kHz
30
355 kHz
20
10
1000 pF
40
ISUPPLY (mA)
I SUPPLY (mA)
634 kHz
30
10,000 pF
20
100 pF
200 kHz
10
112.5 kHz
0
0
100
1000
CLOAD (pF)
10
10000
90
VDD = 12 V
80
60
ISUPPLY (mA)
ISUPPLY (mA)
1000 pF
70
200 kHz
112.5 kHz
63.4 kHz
50
1.125 MHz
20 kHz
30
634 kHz
50
40
30
100 pF
10,000 pF
20
355 kHz
10
10
0
100
0
1000
CLOAD (pF)
0
10000
100
1000
FREQUENCY (kHz)
Figure 17. Supply Current vs. Capacitive Load
Figure 18. Supply Current vs. Frequency
120
120
4700 pF
VDD = 6 V
VDD = 6 V
100
100
10,000 pF
634 kHz
355 kHz
80
ISUPPLY (mA)
ISUPPLY (mA)
3300 pF
VDD = 12 V
80
2 MHz
60
20
1000
Figure 16. Supply Current vs. Frequency
90
40
100
FREQUENCY (kHz)
Figure 15. Supply Current vs. Capacitive Load
70
3300 pF
VDD = 18 V
50
50
112.5 kHz
20 kHz
60
355 kHz
40
80
60
2200 pF
1000 pF
100 pF
40
2 MHz
20
20
1.125 MHz
0
100
100 pF
1000
CLOAD (pF)
10000
0
10
Figure 19. Supply Current vs. Capacitive Load
100
FREQUENCY (kHz)
1000
Figure 20. Supply Current vs. Frequency
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7
NCP4423, NCP4424, NCP4425
TYPICAL ELECTRICAL CHARACTERISTICS
10–8
8
6
4
1400
1200
MAX. POWER (mA)
16 Pin SOIC
A • sec
2
10–9
8
6
4
2
1000
800
600
400
200
10–10
0
2
4
6
8
10
12
14
16
18
0
0
VIN
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Figure 21. NCP4423 Crossover Energy
Figure 22. Thermal Derating Curves
NOTE: The values on this graph represent the loss seen by both drivers
in a package during one complete cycle. For a single driver, divide the
stated values by 2. For a single transition of a single driver, divide the
stated value by 4.
Static–sensitive device. Unused devices must be stored in conductive
material. Protect devices from static discharge and static fields.
Stresses above those listed under Absolute Maximum Ratings (See
page 2) may cause permanent damage to the device. These are stress
ratings only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to Absolute Maximum Rating
Conditions for extended periods may affect device reliability.
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8
140
NCP4423, NCP4424, NCP4425
PACKAGE DIMENSIONS
PDIP–8
P SUFFIX
CASE 626–05
ISSUE K
8
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5
–B–
1
4
DIM
A
B
C
D
F
G
H
J
K
L
M
N
F
–A–
NOTE 2
L
C
J
–T–
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
--10
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
--10
0.030
0.040
N
SEATING
PLANE
D
M
K
G
H
0.13 (0.005)
M
T A
M
B
M
SO–16
DW SUFFIX
CASE 751G–03
ISSUE B
A
D
9
1
8
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
16X
M
14X
e
T A
S
B
h X 45 S
L
A
0.25
B
B
A1
H
E
0.25
8X
M
B
M
16
SEATING
PLANE
T
C
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9
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
10.15
10.45
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0
7
NCP4423, NCP4424, NCP4425
Notes
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10
NCP4423, NCP4424, NCP4425
Notes
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11
NCP4423, NCP4424, NCP4425
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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12
NCP4423/D