CM1630 LCD and Camera EMI Filter Array with ESD Protection Product Description The CM1630 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor UDFN 0.40 mm pitch packages. The CM1630 has component values of 8.5 pF − 100 WĂ- 8.5 pF per channel. The CM1630 has a cut-off frequency of 200 MHz and can be used in applications with data rates up to 80 Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15 kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easy-to-use pin assignments. In particular, the CM1630 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1630 is housed in space-saving, low-profile 8-, 12- and 16-lead UDFN packages with a 0.4 mm pitch and is available with lead-free finishing. This new small UDFN package provides up to 42% board space savings vs. the 0.50 mm pitch UDFN packages. http://onsemi.com Filter + ESDn* • • • • • • • Applications • • • • April, 2011 − Rev. 3 8.5 pF 8.5 pF 1 of 4, 6 or 8 EMI/RFI Filter Channels with Integrated ESD Protection * See Package/Pinout Diagrams for expanded pin information. MARKING DIAGRAM TE MG G P30E MG G 1 1 1 TE P30E P308E M G P308E MG G = CM1630−04DE = CM1630−06DE = CM1630−08DE = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† CM1630−04DE UDFN−8 (Pb−Free) UDFN−12 (Pb−Free) UDFN−16 (Pb−Free) 3000/Tape & Reel CM1630−06DE CM1630−08DE 3000/Tape & Reel 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • I/O Port Protection for Mobile Handsets, Notebook LCD and Camera Data Lines in Mobile Handsets LCD and Camera Modules Handheld PCs/PDAs Wireless Handsets © Semiconductor Components Industries, LLC, 2011 Filter + ESDn* 100 W GND • Four, Six and Eight Channels of EMI Filtering with Integrated • UDFN16 DE SUFFIX CASE 517BE ELECTRICAL SCHEMATIC Features ESD Protection Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) Network ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Greater than 25 dB Attenuation (Typical) at 1 GHz UDFN Package with 0.40 mm Lead Pitch: ♦ 4−ch. = 8−lead UDFN ♦ 6−ch. = 12−lead UDFN ♦ 8−ch. = 16−lead UDFN Tiny UDFN Package Size: ♦ 8−lead: 1.70 mm x 1.35 mm x 0.50 mm ♦ 12−lead: 2.50 mm x 1.35 mm x 0.50 mm ♦ 16−lead: 3.30 mm x 1.35 mm x 0.50 mm Increased Robustness against Vertical Impacts During Manufacturing Process These Devices are Pb−Free and are RoHS Compliant UDFN12 DE SUFFIX CASE 517BD UDFN8 DE SUFFIX CASE 517BC Computers, PDAs, etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers 1 Publication Order Number: CM1630/D CM1630 PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 5 Pin 1 Marking Bottom View (Pins Up View) 1 2 3 4 GND PAD TE Top View (Pins Down View) 12 11 10 9 8 7 Bottom View (Pins Up View) 1 2 3 4 5 6 P30E GND PAD Pin 1 Marking 1 2 3 4 5 6 12 11 10 9 8 7 CM1630−06DE 12 Lead UDFN Package 1 2 3 4 8 7 6 5 CM1630−04DE 8 Lead UDFN Package Pin 1 Marking Top View (Pins Down View) 16 15 14 13 12 11 10 9 Bottom View (Pins Up View) 1 2 3 4 5 6 7 8 P308E GND PAD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CM1630−08DE 16 Lead UDFN Package Table 1. PIN DESCRIPTIONS Device Pin(s) Device Pin(s) −04 −06 −08 −04 Name −06 −08 1 1 1 FILTER1 Name Filter + ESD Channel 1 8 12 16 FILTER1 Filter + ESD Channel 1 2 2 2 FILTER2 Filter + ESD Channel 2 7 11 15 FILTER2 Filter + ESD Channel 2 3 3 3 FILTER3 Filter + ESD Channel 3 6 10 14 FILTER3 Filter + ESD Channel 3 4 4 4 FILTER4 Filter + ESD Channel 4 5 9 13 FILTER4 Filter + ESD Channel 4 − 5 5 FILTER5 Filter + ESD Channel 5 − 8 12 FILTER5 Filter + ESD Channel 5 − 6 6 FILTER6 Filter + ESD Channel 6 − 7 11 FILTER6 Filter + ESD Channel 6 − − 7 FILTER7 Filter + ESD Channel 7 − − 10 FILTER7 Filter + ESD Channel 7 − − 8 FILTER8 Filter + ESD Channel 8 − − 9 FILTER8 Filter + ESD Channel 8 Device Ground − − − − GND PAD GND Description http://onsemi.com 2 Description CM1630 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol R Parameter Conditions Typ Max Units 80 100 120 W Total Channel Capacitance At 2.5 V DC Reverse Bias, 1 MHz, 30 mV AC 14 17 22 pF Capacitance C1 At 2.5 V DC Reverse Bias, 1 MHz, 30 mV AC 7.0 8.5 11.0 pF Stand−off Voltage IDIODE = 10 mA 6.0 ILEAK Diode Leakage Current (Reverse Bias) VDIODE = 3.3 V 0.1 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 CTOTAL C VDIODE RDYN fC A1GHz A800MHz − 6GHz Resistance Min (Note 2) 5.6 −0.4 6.8 −0.8 V 1.0 mA V kV ±30 ±15 Dynamic Resistance Positive Negative 2.3 0.9 W Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W Channel R = 100 W, Channel C = 8.5 pF Absolute Attenuation @ 1 GHz from 0 dB Level ZSOURCE = 50 W, ZLOAD = 50 W, DC Bias = 0 V (Notes 1 and 3) 30 dB Absolute Attenuation @ 800 MHz to 6 GHz from 0 dB Level ZSOURCE = 50 W, ZLOAD = 50 W, DC Bias = 0 V (Notes 1 and 3) 25 dB 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Attenuation / RF curves characterized by a network analyzer using microprobes. http://onsemi.com 3 200 MHz CM1630 PERFORMANCE INFORMATION Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND, CM1630−04DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND, CM1630−04DE) http://onsemi.com 4 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND, CM1630−04DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND, CM1630−04DE) http://onsemi.com 5 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 5. Insertion Loss vs. Frequency (FILTER1 Input to GND, CM1630−06DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 6. Insertion Loss vs. Frequency (FILTER2 Input to GND, CM1630−06DE) http://onsemi.com 6 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 7. Insertion Loss vs. Frequency (FILTER3 Input to GND, CM1630−06DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 8. Insertion Loss vs. Frequency (FILTER4 Input to GND, CM1630−06DE) http://onsemi.com 7 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 9. Insertion Loss vs. Frequency (FILTER5 Input to GND, CM1630−06DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 10. Insertion Loss vs. Frequency (FILTER6 Input to GND, CM1630−06DE) http://onsemi.com 8 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 11. Insertion Loss vs. Frequency (FILTER1 Input to GND, CM1630−08DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 12. Insertion Loss vs. Frequency (FILTER2 Input to GND, CM1630−08DE) http://onsemi.com 9 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 13. Insertion Loss vs. Frequency (FILTER3 Input to GND, CM1630−08DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 14. Insertion Loss vs. Frequency (FILTER4 Input to GND, CM1630−08DE) http://onsemi.com 10 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 15. Insertion Loss vs. Frequency (FILTER5 Input to GND, CM1630−08DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 16. Insertion Loss vs. Frequency (FILTER6 Input to GND, CM1630−08DE) http://onsemi.com 11 CM1630 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz 1 GHz 6 GHz FREQUENCY Figure 17. Insertion Loss vs. Frequency (FILTER7 Input to GND, CM1630−08DE) 0 dB −5 dB −10 dB INSERTION LOSS −15 dB −20 dB −25 dB −30 dB −35 dB −40 dB −45 dB −50 dB 3 MHz 10 MHz 100 MHz FREQUENCY 1 GHz 6 GHz Figure 18. Insertion Loss vs. Frequency (FILTER8 Input to GND, CM1630−08DE) http://onsemi.com 12 CM1630 PERFORMANCE INFORMATION (Cont’d) Capacitance (Normalized) Typical Diode Capacitance vs. Input Voltage DC Voltage Figure 19. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5 V DC and 255C) http://onsemi.com 13 CM1630 PACKAGE DIMENSIONS UDFN8, 1.7x1.35, 0.4P CASE 517BC−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÇÇ ÉÉ MOLD CMPD EXPOSED Cu A1 E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A3 DETAIL B ALTERNATE CONSTRUCTIONS TOP VIEW A DETAIL B 0.05 C 8X L L1 DETAIL A 0.05 C NOTE 4 SIDE VIEW DETAIL A 8X L (A3) L A1 C SEATING PLANE ALTERNATE TERMINAL CONSTRUCTIONS D2 1 8X K e e/2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.70 BSC 1.10 1.30 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 RECOMMENDED SOLDERING FOOTPRINT* E2 1.40 8 DIM A A1 A3 b D D2 E E2 e K L L1 8X 0.40 8X b 0.10 C A B 0.05 C NOTE 3 PACKAGE OUTLINE BOTTOM VIEW 1.55 0.50 8X 1 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 CM1630 PACKAGE DIMENSIONS UDFN12, 2.5x1.35, 0.4P CASE 517BD−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X L1 ÉÉÉ ÉÉÉ 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW A DETAIL B (A3) A1 0.05 C NOTE 4 12X A1 SIDE VIEW 6 1 K 12 C SEATING PLANE ÇÇ ÉÉ ÉÉ A3 DETAIL B OPTIONAL CONSTRUCTION DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 2.50 BSC 1.90 2.10 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 DETAIL A D2 L MOLD CMPD EXPOSED Cu 0.05 C 12X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L 7 e BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* E2 12X PACKAGE OUTLINE b 2.20 12X 0.40 0.10 C A B 0.05 C NOTE 3 1.55 0.50 12X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 CM1630 PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW K 1 8 16 9 e C SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L L1 MOLD CMPD ÇÇ ÉÉ ÉÉ A3 DETAIL B OPTIONAL CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 DETAIL A D2 L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L RECOMMENDED SOLDERING FOOTPRINT* E2 16X PACKAGE OUTLINE b BOTTOM VIEW 3.00 16X 0.40 0.10 C A B 0.05 C NOTE 3 1.55 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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