DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD128 BGA2022 MMIC mixer Product specification Supersedes data of 2000 Jun 06 2000 Dec 04 NXP Semiconductors Product specification MMIC mixer BGA2022 FEATURES PINNING Large frequency range: PIN DESCRIPTION – Cellular band (900 MHz) 1 LO - GND – PCS band (1900 MHz) 2 LO - signal – WLAN band (2.4 GHz) 3 VS High isolation 4 IF - out High linearity 5 RF - feedback High conversion gain. 6 RF - signal APPLICATIONS Receiver side of wireless systems that require high conversion gain and high linearity at low supply current, such as CDMA. RF-signal handbook, 4 columns RF-feedback 6 6 5 IF-out 5 4 2 3 4 BIAS CONTROL DESCRIPTION Silicon double poly MMIC mixer in a 6-lead SOT363 plastic package. 1 2 3 Top view 1 LO-GND LO-signal VS MBL255 Marking code: A2p. Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE DATA VS = 2.8 V; IS = 6 mA; PLO = 0 dBm; fRF = 1800 MHz; fLO = 2080 MHz; fIF = 280 MHz. SYMBOL PARAMETER MIN. TYP. MAX. UNIT Gconv conversion gain 4 6 8 dB NF noise figure (DSB) 12 dB IP3 output third order intercept point 7 dBm CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. 2000 Dec 04 2 NXP Semiconductors Product specification MMIC mixer BGA2022 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VS supply voltage 4 V IS supply current 10 mA PLO oscillator power note 1 10 dBm PRF RF power note 1 10 dBm Ptot total power dissipation Ts 100 C; note 2 40 mW Tstg storage temperature 65 +150 C Tj junction temperature 150 C Notes 1. LO and RF signals always AC coupled; 50 source; no external DC voltage supplied to pins 1, 2 and 6. 2. Ts is the temperature at the soldering point of the ground tab. THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to solder point VALUE UNIT 375 K/W CHARACTERISTICS VS = 2.8 V; IS = 6 mA; Tj = 25 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS IS supply current VS = 2.8 V Gconv(p) power conversion gain PRF = 25 dBm; PLO = 0 dBm IP3 VSWRLO 2000 Dec 04 TYP. MAX. UNIT 4 6 8 mA 880 MHz 5 dB 1800 MHz 4 6 8 dB 1950 MHz 5 dB 6 dB 880 MHz 9 dB 1800 MHz 12 dB 1950 MHz 9 dB 2450 MHz 9 dB 880 MHz 4 dBm 1800 MHz 7 dBm 1950 MHz 7 dBm 2450 MHz 10 dBm 2:1 2450 MHz NF MIN. noise figure intercept point third order input return losses at LO port DSB output referred PLO = 0 dBm; f = 0 to 3 GHz 3 NXP Semiconductors Product specification MMIC mixer BGA2022 APPLICATION INFORMATION See application note number AN00059. RF input handbook, full pagewidth C2 L1 C5 C1 C6 L3 IF output RF- signal RF- feedback IF- out 6 5 4 BGA2022 BIAS CONTROL R1 1 2 3 LO - GND LO - signal VS C4 C3 R2 LO input Vsupply L2 C7 C8 MGT575 Fig.2 Application diagram. List of components (see Fig.2) APPLICATION BOARD COMPONENT 880 MHz (IF = 80 MHz) 1800 MHz (IF = 280 MHz) 1950 MHz (IF = 80 MHz) 2450 MHz (IF = 280 MHz) R1 1.2 k 2.7 k 2.2 k 3.3 k R2 22 22 22 18 C1 12 pF 1.2 pF 1.5 pF 1.0 pF C2 390 pF 5.6 pF 1.5 nF 82 pF C3, C4 39 pF 6.8 pF 6.8 pF 2.7 pF C5 27 pF 2 pF 15 pF 2.2 pF C6 100 pF 100 pF 10 pF 100 pF C7 22 nF 22 nF 22 nF 22 nF C8 56 pF 8.2 pF 10 pF 6.8 pF L1 10 nH 2.7 nH 2.7 nH 1.8 nH L2 220 nH 110 nH 150 nH 220 nH L3 470 nH 120 nH 120 nH 2000 Dec 04 4 NXP Semiconductors Product specification MMIC mixer BGA2022 MGT576 400 −200 104 handbook, halfpage RRF jX (Ω) Z IF handbook, halfpage (Ω) MGT577 (Ω) −150 300 103 −jX jX −100 200 102 R −50 100 0 0 1000 R 10 0 3000 2000 0 100 200 300 400 f (MHz) 500 600 f (MHz) ZS = ZL = 50 ; VS = 2.8 V; PRF = 25 dBm; Tamb = 25 C. ZS = ZL = 50 ; AC coupled; no signal; Tamb = 25 C. Fig.3 Fig.4 RF input impedance as a function of frequency; typical values. IF output impedance as a function frequency; typical values. MGT579 MGT578 8 10 handbook, halfpage handbook, G halfpage C (dB) 6 IS (mA) 8 4 6 2 4 0 2 −2 −4 −20 −15 −10 −5 0 0 5 0 1 2 3 4 5 VS (V) PLO (dBm) ZS = ZL = 50 ; VS = 2.8 V; PRF = 0 dBm; f = 1800 MHz; Tamb = 25 C. ZS = ZL = 50 ; AC coupled; no signal; Tamb = 25 C. Fig.5 Fig.6 Conversion gain as a function of oscillator power; typical values. 2000 Dec 04 5 Supply current as a function of the supply voltage; typical values. NXP Semiconductors Product specification MMIC mixer BGA2022 PACKAGE OUTLINE Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 2000 Dec 04 REFERENCES IEC JEDEC JEITA SC-88 6 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 NXP Semiconductors Product specification MMIC mixer BGA2022 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. DEFINITIONS Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. DISCLAIMERS Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. 2000 Dec 04 7 NXP Semiconductors Product specification MMIC mixer BGA2022 Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 2000 Dec 04 8 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R77/06/pp9 Date of release: 2000 Dec 04