Features • High Performance, Low Power AVR® 8-bit Microcontroller • Advanced RISC Architecture • • • • • • • • – 120 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation High Endurance, Non-volatile Memory Segments – 2K/4K/8K Bytes of In-System, Self-programmable Flash Program Memory • Endurance: 10,000 Write/Erase Cycles – 128/256/512 Bytes of In-System Programmable EEPROM • Endurance: 100,000 Write/Erase Cycles – 128/256/512 Bytes of Internal SRAM – Data Retention: 20 years at 85°C / 100 years at 25°C – Programming Lock for Self-programming Flash & EEPROM Data Security Peripheral Features – One 8-bit and One 16-bit Timer/Counter with Two PWM Channels, Each – 10-bit ADC • 8 Single-ended Channels • 12 Differential ADC Channel Pairs with Programmable Gain (1x / 20x) – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator – Universal Serial Interface Special Microcontroller Features – debugWIRE On-chip Debug System – In-System Programmable via SPI Port – Internal and External Interrupt Sources • Pin Change Interrupt on 12 Pins – Low Power Idle, ADC Noise Reduction, Standby and Power-down Modes – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit with Software Disable Function – Internal Calibrated Oscillator – On-chip Temperature Sensor I/O and Packages – Available in 20-pin QFN/MLF/VQFN, 14-pin SOIC, 14-pin PDIP and 15-ball UFBGA – Twelve Programmable I/O Lines Operating Voltage: – 1.8 – 5.5V Speed Grade: – 0 – 4 MHz @ 1.8 – 5.5V – 0 – 10 MHz @ 2.7 – 5.5V – 0 – 20 MHz @ 4.5 – 5.5V Industrial Temperature Range: -40°C to +85°C Low Power Consumption – Active Mode: • 210 µA at 1.8V and 1 MHz – Idle Mode: • 33 µA at 1.8V and 1 MHz – Power-down Mode: • 0.1 µA at 1.8V and 25°C 8-bit Microcontroller with 2K/4K/8K Bytes In-System Programmable Flash ATtiny24A ATtiny44A ATtiny84A Summary Rev. 8183FS–AVR–06/12 1. Pin Configurations Figure 1-1. Pinout of ATtiny24A/44A/84A PDIP/SOIC VCC (PCINT8/XTAL1/CLKI) PB0 (PCINT9/XTAL2) PB1 (PCINT11/RESET/dW) PB3 (PCINT10/INT0/OC0A/CKOUT) PB2 (PCINT7/ICP/OC0B/ADC7) PA7 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) PA6 1 2 3 4 5 6 7 14 13 12 11 10 9 8 GND PA0 (ADC0/AREF/PCINT0) PA1 (ADC1/AIN0/PCINT1) PA2 (ADC2/AIN1/PCINT2) PA3 (ADC3/T0/PCINT3) PA4 (ADC4/USCK/SCL/T1/PCINT4) PA5 (ADC5/DO/MISO/OC1B/PCINT5) NOTE Bottom pad should be soldered to ground. DNC: Do Not Connect Table 1-1. 6 7 8 9 10 15 14 13 12 11 PA7 (PCINT7/ICP/OC0B/ADC7) PB2 (PCINT10/INT0/OC0A/CKOUT) PB3 (PCINT11/RESET/dW) PB1 (PCINT9/XTAL2) PB0 (PCINT8/XTAL1/CLKI) UFBGA - Pinout ATtiny24A/44A/84A (top view) 1 A 2 1 2 3 4 5 Pin 16: PA6 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) Pin 20: PA5 (ADC5/DO/MISO/OC1B/PCINT5) DNC DNC GND VCC DNC (ADC4/USCK/SCL/T1/PCINT4) PA4 (ADC3/T0/PCINT3) PA3 (ADC2/AIN1/PCINT2) PA2 (ADC1/AIN0/PCINT1) PA1 (ADC0/AREF/PCINT0) PA0 20 19 18 17 16 PA5 DNC DNC DNC PA6 QFN/MLF/VQFN 2 3 4 PA5 PA6 PB2 B PA4 PA7 PB1 PB3 C PA3 PA2 PA1 PB0 D PA0 GND GND VCC ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 1.1 1.1.1 Pin Descriptions VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB3:PB0) Port B is a 4-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability except PB3 which has the RESET capability. To use pin PB3 as an I/O pin, instead of RESET pin, program (‘0’) RSTDISBL fuse. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B also serves the functions of various special features of the ATtiny24A/44A/84A as listed in Section 10.2 “Alternate Port Functions” on page 58. 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 20-4 on page 176. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 1.1.5 Port A (PA7:PA0) Port A is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A has alternate functions as analog inputs for the ADC, analog comparator, timer/counter, SPI and pin change interrupt as described in “Alternate Port Functions” on page 58. 3 8183FS–AVR–06/12 2. Overview ATtiny24A/44A/84A are low-power CMOS 8-bit microcontrollers based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny24A/44A/84A achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. Figure 2-1. Block Diagram VCC 8-BIT DATABUS INTERNAL OSCILLATOR INTERNAL CALIBRATED OSCILLATOR TIMING AND CONTROL GND PROGRAM COUNTER STACK POINTER WATCHDOG TIMER PROGRAM FLASH SRAM MCU CONTROL REGISTER INSTRUCTION REGISTER MCU STATUS REGISTER GENERAL PURPOSE REGISTERS TIMER/ COUNTER0 X Y Z INSTRUCTION DECODER TIMER/ COUNTER1 CONTROL LINES ALU STATUS REGISTER INTERRUPT UNIT ANALOG COMPARATOR + _ PROGRAMMING LOGIC EEPROM ISP INTERFACE DATA REGISTER PORT A DATA DIR. REG.PORT A ADC OSCILLATORS DATA REGISTER PORT B DATA DIR. REG.PORT B PORT A DRIVERS PORT B DRIVERS PA[7:0] PB[3:0] The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. 4 ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A The ATtiny24A/44A/84A provides the following features: 2K/4K/8K byte of In-System Programmable Flash, 128/256/512 bytes EEPROM, 128/256/512 bytes SRAM, 12 general purpose I/O lines, 32 general purpose working registers, an 8-bit Timer/Counter with two PWM channels, a 16-bit timer/counter with two PWM channels, Internal and External Interrupts, a 8-channel 10-bit ADC, programmable gain stage (1x, 20x) for 12 differential ADC channel pairs, a programmable Watchdog Timer with internal oscillator, internal calibrated oscillator, and four software selectable power saving modes. Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. ADC Noise Reduction mode minimizes switching noise during ADC conversions by stopping the CPU and all I/O modules except the ADC. In Power-down mode registers keep their contents and all chip functions are disbaled until the next interrupt or hardware reset. In Standby mode, the crystal/resonator oscillator is running while the rest of the device is sleeping, allowing very fast start-up combined with low power consumption. The device is manufactured using Atmel’s high density non-volatile memory technology. The onchip ISP Flash allows the Program memory to be re-programmed in-system through an SPI serial interface, by a conventional non-volatile memory programmer or by an on-chip boot code running on the AVR core. The ATtiny24A/44A/84A AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators and Evaluation kits. 5 8183FS–AVR–06/12 3. General Information 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. For I/O Registers located in the extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically, this means “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. Note that not all AVR devices include an extended I/O map. 3.3 Capacitive Touch Sensing Atmel QTouch Library provides a simple to use solution for touch sensitive interfaces on Atmel AVR microcontrollers. The QTouch Library includes support for QTouch® and QMatrix® acquisition methods. Touch sensing is easily added to any application by linking the QTouch Library and using the Application Programming Interface (API) of the library to define the touch channels and sensors. The application then calls the API to retrieve channel information and determine the state of the touch sensor. The QTouch Library is free and can be downloaded from the Atmel website. For more information and details of implementation, refer to the QTouch Library User Guide – also available from the Atmel website. 3.4 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 3.5 Disclaimer Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device has been characterized. 6 ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 4. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F (0x5F) SREG I T H S V N Z C Page 14 – – – – SP9 SP8 Page 13 SP1 SP0 0x3E (0x5E) SPH – – 0x3D (0x5D) SPL SP7 SP6 0x3C (0x5C) OCR0B 0x3B (0x5B) GIMSK – INT0 PCIE1 PCIE0 – – – – 0x3A (0x5A) GIFR – INTF0 PCIF1 PCIF0 – – – – Page 51 0x39 (0x59) TIMSK0 – – – – – OCIE0B OCIE0A TOIE0 Page 83 0x38 (0x58) TIFR0 – – – – – OCF0B OCF0A TOV0 Page 84 0x37 (0x57) SPMCSR – – RSIG CTPB RFLB PGWRT Timer/Counter0 – Output Compare Register A PGERS SPMEN Page 156 BODS PUD SE SM1 0x36 (0x56) OCR0A 0x35 (0x55) MCUCR SP5 SP4 SP3 SP2 Timer/Counter0 – Output Compare Register B Page 13 Page 83 Page 50 Page 83 SM0 BODSE ISC01 ISC00 Pages 36, 50, 66 0x34 (0x54) MCUSR – – – – WDRF BORF EXTRF PORF Page 44 0x33 (0x53) TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 Page 82 0x32 (0x52) TCNT0 0x31 (0x51) OSCCAL CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 Page 31 Timer/Counter0 Page 83 0x30 (0x50) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 Page 79 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 Page 106 ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 Page 108 0x2E (0x4E) TCCR1B 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High Byte Page 110 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low Byte Page 110 0x2B (0x4B) OCR1AH Timer/Counter1 – Compare Register A High Byte Page 110 0x2A (0x4A) OCR1AL Timer/Counter1 – Compare Register A Low Byte Page 110 0x29 (0x49) OCR1BH Timer/Counter1 – Compare Register B High Byte Page 110 0x28 (0x48) OCR1BL Timer/Counter1 – Compare Register B Low Byte Page 110 0x27 (0x47) DWDR 0x26 (0x46) CLKPR 0x25 (0x45) ICR1H DWDR[7:0] CLKPCE – – – Page 151 CLKPS3 CLKPS2 CLKPS1 CLKPS0 Timer/Counter1 - Input Capture Register High Byte 0x24 (0x44) ICR1L 0x23 (0x43) GTCCR TSM – Timer/Counter1 - Input Capture Register Low Byte 0x22 (0x42) TCCR1C FOC1A FOC1B – – – – 0x21 (0x41) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 0x20 (0x40) PCMSK1 – – – – PCINT11 PCINT10 PCINT9 – – – – Page 31 Page 111 Page 111 – PSR10 Page 114 – – Page 109 WDP1 WDP0 Page 44 PCINT8 Page 51 0x1F (0x3F) EEARH – – – – – – – EEAR8 Page 20 0x1E (0x3E) EEARL EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 Page 21 0x1D (0x3D) EEDR 0x1C (0x3C) EECR – – EEPM1 EEPM0 EERIE EEMPE EEPE EERE Page 23 0x1B (0x3B) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 Page 66 0x1A (0x3A) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 Page 66 0x19 (0x39) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 Page 67 0x18 (0x38) PORTB – – – – PORTB3 PORTB2 PORTB1 PORTB0 Page 67 0x17 (0x37) DDRB – – – – DDB3 DDB2 DDB1 DDB0 Page 67 0x16 (0x36) PINB – – – – PINB3 PINB2 PINB1 PINB0 Page 67 0x15 (0x35) GPIOR2 General Purpose I/O Register 2 Page 22 0x14 (0x34) GPIOR1 General Purpose I/O Register 1 Page 23 0x13 (0x33) GPIOR0 General Purpose I/O Register 0 0x12 (0x32) PCMSK0 0x11 (0x31)) Reserved – 0x10 (0x30) USIBR USI Buffer Register Page 127 0x0F (0x2F) USIDR USI Data Register Page 126 EEPROM Data Register PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 Page 21 Page 23 PCINT2 PCINT1 PCINT0 Page 52 0x0E (0x2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 0x0D (0x2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC Page 125 Page 123 0x0C (0x2C) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 Page 111 0x0B (0x2B) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 Page 112 0x0A (0x2A) Reserved 0x09 (0x29) Reserved 0x08 (0x28) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 Page 129 0x07 (0x27) ADMUX REFS1 REFS0 MUX5 MUX4 MUX3 MUX2 MUX1 MUX0 Page 144 0x06 (0x26) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 Page 146 0x05 (0x25) ADCH ADC Data Register High Byte 0x04 (0x24) ADCL ADC Data Register Low Byte 0x03 (0x23) ADCSRB – – BIN ACME – ADLAR – Page 148 Page 148 ADTS2 ADTS1 ADTS0 Pages 130, 148 – 0x02 (0x22) Reserved 0x01 (0x21) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D Pages 131, 149 0x00 (0x20) PRR – – – – PRTIM1 PRTIM0 PRUSI PRADC Page 37 7 8183FS–AVR–06/12 Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions. 3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 8 ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 5. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 1 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 Relative Jump PC ← PC + k + 1 None 2 Indirect Jump to (Z) PC ← Z None 2 BRANCH INSTRUCTIONS RJMP k IJMP Relative Subroutine Call PC ← PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ← Z None 3 RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I if (Rd = Rr) PC ← PC + 2 or 3 None RCALL k 4 CPSE Rd,Rr Compare, Skip if Equal 1/2/3 CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 BIT AND BIT-TEST INSTRUCTIONS SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 9 8183FS–AVR–06/12 Mnemonics Operands Description Operation Flags #Clocks ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 1 SEC Set Carry C←1 C CLC Clear Carry C←0 C 1 SEN Set Negative Flag N←1 N 1 CLN Clear Negative Flag N←0 N 1 SEZ Set Zero Flag Z←1 Z 1 CLZ Clear Zero Flag Z←0 Z 1 SEI Global Interrupt Enable I←1 I 1 CLI Global Interrupt Disable I←0 I 1 1 SES Set Signed Test Flag S←1 S CLS Clear Signed Test Flag S←0 S 1 SEV Set Twos Complement Overflow. V←1 V 1 CLV Clear Twos Complement Overflow V←0 V 1 SET Set T in SREG T←1 T 1 CLT Clear T in SREG T←0 T 1 SEH CLH Set Half Carry Flag in SREG Clear Half Carry Flag in SREG H←1 H←0 H H 1 None 1 None 1 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers MOVW Rd, Rr Copy Register Word Rd ← Rr Rd+1:Rd ← Rr+1:Rr LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 2 LD Rd, Y Load Indirect Rd ← (Y) None LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 Load Program Memory R0 ← (Z) None 3 LPM LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 Store Program Memory (z) ← R1:R0 None SPM IN Rd, P In Port Rd ← P None OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 1 MCU CONTROL INSTRUCTIONS NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR BREAK Watchdog Reset Break (see specific descr. for WDR/Timer) For On-chip Debug Only None None 1 N/A 10 ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 6. Ordering Information 6.1 ATtiny24A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) ATtiny24A-SSU 14S1 ATtiny24A-SSUR 14P3 ATtiny24A-PU ATtiny24A-CCU Industrial (-40°C to +85°C) (5) 15CC1 ATtiny24A-CCUR ATtiny24A-MU 20M1 ATtiny24A-MUR ATtiny24A-MMH (4) 20M2 20 1.8 – 5.5V Industrial (-40°C to +105°C) (6) ATtiny24A-MMHR (4) ATtiny24A-SSN 14S1 ATtiny24A-SSNR ATtiny24A-SSF 14S1 ATtiny24A-SSFR Industrial (-40°C to +125°C) (7) ATtiny24A-MF 20M1 ATtiny24A-MFR ATtiny24A-MM8 20M2 ATtiny24A-MM8R Notes: 1. For speed vs. supply voltage, see section 20.3 “Speed” on page 174. 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS) 3. Code indicators: – H: NiPdAu lead finish – F, N, U: matte tin – R: tape & reel 4. Topside marking for ATtiny24A: T24 / Axx / manufacturing data 5. Also supplied in wafer form. Contact your local Atmel sales office for ordering information and minimum quantities. 6. For typical and electrical characteristics, see “Appendix A – ATtiny24A/44A Specification at 105°C”. 7. For typical and electrical characteristics, see “Appendix B – ATtiny24A/44A/84A Specification at 125°C”. Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 15CC1 15-ball (4 x 4 Array), 0.65 mm Pitch, 3.0 x 3.0 x 0.6 mm, Ultra Thin, Fine-Pitch Ball Grid Array Package (UFBGA) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No Lead / Micro Lead Frame Package (QFN/MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN) 11 8183FS–AVR–06/12 6.2 ATtiny44A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) ATtiny44A-SSU 14S1 ATtiny44A-SSUR 14P3 ATtiny44A-PU ATtiny44A-CCU Industrial (-40°C to +85°C) (5) 15CC1 ATtiny44A-CCUR ATtiny44A-MU 20M1 ATtiny44A-MUR 20 ATtiny44A-MMH (4) 1.8 – 5.5V 20M2 Industrial (-40°C to +105°C) (6) ATtiny44A-MMHR (4) ATtiny44A-SSN 14S1 ATtiny44A-SSNR ATtiny44A-SSF 14S1 ATtiny44A-SSFR Industrial (-40°C to +125°C) (7) ATtiny44A-MF 20M1 ATtiny44A-MFR Notes: 1. For speed vs. supply voltage, see section 20.3 “Speed” on page 174. 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Code indicators: – H: NiPdAu lead finish – F, N, U: matte tin – R: tape & reel 4. Topside marking for ATtiny44A: – 1st Line: T44 – 2nd Line: Axx – 3rd Line: manufacturing data 5. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 6. For typical and electrical characteristics, see “Appendix A – ATtiny24A/44A Specification at 105°C”. 7. For typical and electrical characteristics, see “Appendix B – ATtiny24A/44A/84A Specification at 125°C”. Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 15CC1 15-ball (4 x 4 Array), 0.65 mm Pitch, 3.0 x 3.0 x 0.6 mm, Ultra Thin, Fine-Pitch Ball Grid Array Package (UFBGA) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No Lead / Micro Lead Frame Package (QFN/MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN) 12 ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 6.3 ATtiny84A Speed (MHz) (1) Supply Voltage (V) Temperature Range Package (2) Ordering Code (3) ATtiny84A-SSU 14S1 ATtiny84A-SSUR 14P3 ATtiny84A-PU ATtiny84A-CCU Industrial (-40°C to +85°C) (5) 20 15CC1 ATtiny84A-CCUR ATtiny84A-MU 1.8 – 5.5V 20M1 ATtiny84A-MUR ATtiny84A-MMH (4) 20M2 Industrial (-40°C to +125°C) (7) Notes: ATtiny84A-MMHR (4) ATtiny84A-SSF 14S1 ATtiny84A-SSFR 1. For speed vs. supply voltage, see section 20.3 “Speed” on page 174. 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Code indicators: – H: NiPdAu lead finish – F, N, U: matte tin – R: tape & reel 4. Topside marking for ATtiny84A: – 1st Line: T84 – 2nd Line: Axx – 3rd Line: manufacturing data 5. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 6. For typical and electrical characteristics, see “Appendix A – ATtiny24A/44A Specification at 105°C”. 7. For typical and electrical characteristics, see “Appendix B – ATtiny24A/44A/84A Specification at 125°C”. Package Type 14S1 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14P3 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 15CC1 15-ball (4 x 4 Array), 0.65 mm Pitch, 3.0 x 3.0 x 0.6 mm, Ultra Thin, Fine-Pitch Ball Grid Array Package (UFBGA) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No Lead / Micro Lead Frame Package (QFN/MLF) 20M2 20-pad, 3 x 3 x 0.85 mm Body, Very Thin Quad Flat No Lead Package (VQFN) 13 8183FS–AVR–06/12 7. Packaging Information 7.1 14S1 1 E H E N L Top View End View e COMMON DIMENSIONS (Unit of Measure = mm/inches) b SYMBOL A1 A D Side View NOM MAX – 1.75/0.0688 NOTE 1.35/0.0532 A1 0.1/.0040 – 0.25/0.0098 b 0.33/0.0130 – 0.5/0.0200 5 D 8.55/0.3367 – 8.74/0.3444 2 E 3.8/0.1497 – 3.99/0.1574 3 H 5.8/0.2284 – 6.19/0.2440 L 0.41/0.0160 – 1.27/0.0500 e Notes: MIN A 4 1.27/0.050 BSC 1. This drawing is for general information only; refer to JEDEC Drawing MS-012, Variation AB for additional information. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusion and gate burrs shall not exceed 0.15 mm (0.006") per side. 3. Dimension E does not include inter-lead Flash or protrusion. Inter-lead flash and protrusions shall not exceed 0.25 mm (0.010") per side. 4. L is the length of the terminal for soldering to a substrate. 5. The lead width B, as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm (0.024") per side. 2/5/02 TITLE R 14 2325 Orchard Parkway San Jose, CA 95131 DRAWING NO. 14S1, 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14S1 REV. A ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 7.2 14P3 D PIN 1 E1 A SEATING PLANE A1 L B B1 e E COMMON DIMENSIONS (Unit of Measure = mm) C eC eB Notes: 1. This package conforms to JEDEC reference MS-001, Variation AA. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010"). MIN NOM MAX A – – 5.334 A1 0.381 – – D 18.669 – 19.685 E 7.620 – 8.255 E1 6.096 – 7.112 B 0.356 – 0.559 B1 1.143 – 1.778 L 2.921 – 3.810 C 0.203 – 0.356 eB – – 10.922 eC 0.000 – 1.524 SYMBOL e NOTE Note 2 Note 2 2.540 TYP 2010-10-20 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 14P3, 14-lead (0.300"/7.62 mm Wide) Plastic Dual Inline Package (PDIP) DRAWING NO. 14P3 REV. B 15 8183FS–AVR–06/12 7.3 15CC1 1 2 3 4 0.08 A Pin#1 ID B SIDE VIEW D C D b1 A1 E A A2 TOP VIEW E1 15-Øb e D e COMMON DIMENSIONS (Unit of Measure = mm) C D1 B SYMBOL A MIN NOM MAX A – – 0.60 A1 0.12 – – b 0.25 0.30 0.35 1 b1 0.25 – – 2 D 2.90 3.00 3.10 0.38 REF A2 A1 BALL CORNER 1 2 3 4 BOTTOM VIEW 1.95 BSC D1 E Note1: Dimension “b” is measured at the maximum ball dia. in a plane parallel E1 e to the seating plane. Note2: Dimension “b1” is the solderable surface defined by the opening of the solder resist layer. TITLE R 16 Package Drawing Contact: [email protected] 15CC1, 15-ball (4 x 4 Array), 3.0 x 3.0 x 0.6 mm package, ball pitch 0.65 mm, Ultra thin, Fine-Pitch Ball Grid Array Package (UFBGA) NOTE 3.00 2.90 3.10 1.95 BSC 0.65 BSC GPC CBC 07/06/10 DRAWING NO. REV. 15CC1 C ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 7.4 20M1 D 1 Pin 1 ID 2 SIDE VIEW E 3 TOP VIEW A2 D2 A1 A 0.08 1 2 Pin #1 Notch (0.20 R) 3 COMMON DIMENSIONS (Unit of Measure = mm) E2 b L e BOTTOM VIEW SYMBOL MIN A 0.70 0.75 0.80 A1 – 0.01 0.05 A2 b 0.18 D D2 E2 L MAX NOTE 0.23 0.30 4.00 BSC 2.45 2.60 2.75 4.00 BSC 2.45 e Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. NOM 0.20 REF E Note: C 2.60 2.75 0.50 BSC 0.35 0.40 0.55 10/27/04 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) DRAWING NO. 20M1 REV. B 17 8183FS–AVR–06/12 7.5 20M2 D C y Pin 1 ID E SIDE VIEW TOP VIEW A1 A D2 16 17 18 19 20 COMMON DIMENSIONS (Unit of Measure = mm) C0.18 (8X) 15 Pin #1 Chamfer (C 0.3) 14 2 e E2 13 3 12 4 11 5 MIN NOM MAX A 0.75 0.80 0.85 A1 0.00 0.02 0.05 b 0.17 0.22 0.27 SYMBOL 1 C b 10 9 8 7 6 K L BOTTOM VIEW 0.3 Ref (4x) NOTE 0.152 D 2.90 3.00 3.10 D2 1.40 1.55 1.70 E 2.90 3.00 3.10 E2 1.40 1.55 1.70 e – 0.45 – L 0.35 0.40 0.45 K 0.20 – – y 0.00 – 0.08 10/24/08 Package Drawing Contact: [email protected] 18 GPC TITLE 20M2, 20-pad, 3 x 3 x 0.85 mm Body, Lead Pitch 0.45 mm, ZFC 1.55 x 1.55 mm Exposed Pad, Thermally Enhanced Plastic Very Thin Quad Flat No Lead Package (VQFN) DRAWING NO. REV. 20M2 B ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A 8. Errata The revision letters in this section refer to the revision of the corresponding ATtiny24A/44A/84A device. 8.1 8.1.1 ATtiny24A Rev. H No known errata. 8.1.2 Rev. G Not sampled. 8.1.3 Rev. F Not sampled. 8.2 ATtiny44A 8.2.1 Rev. G No known errata. Yield improvement. 8.2.2 Rev. F No known errata. 8.2.3 Rev. E Not sampled. 8.3 8.3.1 ATtiny84A Rev. C No known errata. 19 8183FS–AVR–06/12 9. Datasheet Revision History 9.1 Rev. 8183F – 06/12 1. Updated: – Table 16-1 on page 138 – Figure 16-7 on page 137 – “Ordering Information” on page 11 9.2 Rev. 8183E – 01/12 1. Updated: – Production status for ATtiny24A and ATtiny84A – “Start Condition Detector” on page 122 – “Ordering Information” on page 11, 12, and 13 9.3 Rev. 8183D – 04/11 1. Added errata for ATtiny44A rev. G in Section 8. “Errata” on page 19 9.4 Rev. 8183C – 03/11 1. Added: – ATtiny84A, including typical characteristics plots – Section 3.3 “Capacitive Touch Sensing” on page 6 – Table 6-8, “Capacitance of Low-Frequency Crystal Oscillator,” on page 28 – Analog Comparator Offset plots for ATtiny24A (Figure 21.2.10 on page 208) and ATtiny44A (Figure 21.3.11 on page 236) – Extended temperature part numbers in Section 6. “Ordering Information” on page 11 2. Updated: – Bit syntax throughout the datasheet, e.g. from CS02:0 to CS0[2:0] – Section 6.4 “Clock Output Buffer” on page 30, changed CLKO to CKOUT – Table 16-4, “Single-Ended Input channel Selections,” on page 145, added note for Internal 1.1V Reference – Table 19-16, “High-voltage Serial Programming Instruction Set for ATtiny24A/44A/84A,” on page 170, adjusted notes – Table 20-1, “DC Characteristics. TA = -40°C to +85°C,” on page 173, adjusted notes 9.5 Rev. 8183B – 03/10 1. Updated template. 2. Added UFBGA package (15CC1) in: “Features” on page 1, “Pin Configurations” on page 2, Section 6. “Ordering Information” on page 11, and Section 7.3 “15CC1” on page 16. 3. Separated typical characteristic plots, added Section 21.2 “ATtiny24A” on page 183. 4. Updated sections: – Section 14.5.4 “USIBR – USI Buffer Register” on page 127, header updated 20 ATtiny24A/44A/84A 8183FS–AVR–06/12 ATtiny24A/44A/84A – Section 6. “Ordering Information” on page 11, added tape & reel and topside marking, updated notes 5. Updated Figures: – Figure 4-1 “Block Diagram of the AVR Architecture” on page 7 – Figure 8-1 “Reset Logic” on page 38 – Figure 14-1 “Universal Serial Interface, Block Diagram” on page 116, USIDB -> USIBR – Figure 19-5 “High-voltage Serial Programming Waveforms” on page 169 6. Updated Tables: – Table 19-11, “Minimum Wait Delay Before Writing the Next Flash or EEPROM Location,” on page 164, updated value for tWD_ERASE 9.6 Rev. 8183A – 12/08 1. Initial revision. Created from document 8006H. 2. Updated "Ordering Information" on page 19 and page 19. Pb-plated packages are no longer offered and there are no separate ordering codes for commercial operation range, the only available option now is industrial. Also, updated some order codes to reflect changes in leadframe composition and added VQFN package option. 3. Updated data sheet template. 4. Removed all references to 8K device. 5. Updated characteristic plots of section “Typical Characteristics”, starting on page 182. 6. Added characteristic plots: – “Bandgap Voltage vs. Supply Voltage” on page 233 – “Bandgap Voltage vs. Temperature” on page 233 7. Updated sections: – “Features” on page 1 – “Power Reduction Register” on page 35 – “Analog Comparator” on page 128 – “Features” on page 132 – “Operation” on page 133 – “Starting a Conversion” on page 134 – “ADC Voltage Reference” on page 139 – “Speed” on page 174 8. Updated Figures: – “Program Memory Map” on page 15 – “Data Memory Map” on page 16 9. Update Tables: – “Device Signature Bytes” on page 161 – “DC Characteristics. TA = -40°C to +85°C” on page 173 – “Additional Current Consumption for the different I/O modules (absolute values)” on page 182 – “Additional Current Consumption (percentage) in Active and Idle mode” on page 183 21 8183FS–AVR–06/12 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. 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Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 8183FS–AVR–06/12