5 Pin Flip-Chip 1.028x1.190

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
5 PIN FLIP-CHIP
CASE 499AY-01
ISSUE O
DATE 06 JUN 2007
SCALE 4:1
E
4X
0.10 C
TERMINAL A1
LOCATOR
A
ÈÈ
ÈÈ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
D
DIM
A
A1
A2
b
D
E
e1
e2
A1
0.10 C
A2
0.05 C
A
C
MILLIMETERS
MIN
NOM MAX
0.475 0.530 0.585
0.170 0.200 0.230
0.305 0.330 0.355
0.220 0.250 0.270
1.028 BSC
1.190 BSC
0.250 BSC
0.410 BSC
SOLDERING FOOTPRINT*
SEATING
PLANE
0.82
e2
0.41
5X
b
0.05 C A B
0.05 C
1
2
0.50
3
e1
A
B
0.25
C
5X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON24677D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
5 PIN FLIP-CHIP, 1.028X1.190 1
October, DESCRIPTION:
2002 - Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON24677D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. LOFTS.
DATE
06 JUN 2007
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2007
June, 2007 - Rev. 01O
Case Outline Number:
499AY