MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS FLIP−CHIP−25 CSP CASE 499G−01 ISSUE B DATE 03 MAY 2005 A1 SCALE 4:1 D 4X Ç 0.10 C PIN A1 LOCATOR A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B DIM A A1 A2 D E b e D1 E1 E TOP VIEW 0.10 C C SEATING PLANE A 0.05 C MILLIMETERS MIN MAX −−− 0.700 0.210 0.270 0.380 0.430 2.650 BSC 2.650 BSC 0.290 0.340 0.500 BSC 2.000 BSC 2.000 BSC ÇÇ ÇÇ GENERIC MARKING DIAGRAM* A2 SIDE VIEW A1 D1 xxxxxxxxxx AYWW e E D b 25 X 0.05 C A B 0.03 C C E1 xxxxxx A Y WW B A 1 2 3 4 5 e = Specific Device Code = Assembly Location = Year = Work Week BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. DOCUMENT NUMBER: STATUS: 98AON13902D ON SEMICONDUCTOR STANDARD 1 Semiconductor Components Industries, LLC, 2002 November, 2002 − Rev. 0 NEW STANDARD: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except whenOrder stamped Publication Number: PMF3503DC/D “CONTROLLED COPY” in red. http://onsemi.com FLIP−CHIP−25 CSP, 0.265 *0.265 1 MM, 0.500 PITCH Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON13902D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY S. CHANG. 19 DEC 2003 A CHANGED DIM A WAS 0.280 MIN, 0.380 MAX. REQ. BY A. TAM. 13 JUL 2004 B CHANGED DIM A FROM 0.650 MAX TO 0.700 MAX. REQ. BY A. TAM. 03 MAY 2005 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Semiconductor Components Industries, LLC, 2005 May, 2005 − Rev. 01B Case Outline Number: 499G