Material Content Data Sheet Umbrella Spec Date Revision Construction element chip Base plate and substrate including metallisation wire encapsulation housing lead, finish and plating deviation IH7B-IHM B 190 Cu 2013-10-23 5.0 Material group RoHS compliant valid from: date code 2013-11-01 Materials Average CAS-Nr. Sum [%] if applicable mass [%]* inorganic material silicon 7440-21-3 0,4 0,4 non noble metal inorganic material non noble metal non noble metal non noble metal noble metal non noble metal polymers 7440-50-8 1344-28-1 7440-31-5 7439-92-1 7440-02-0 7440-22-4 7429-90-5 62,6 0,9 2,0 1,7 67,2 polymers inorganic material inorganic material non noble metal ferrous metal non noble metal non noble metal <25% Weight range of product Fluctuation margin copper aluminium oxide tin lead nickel silver aluminium silicone gel Polyamid (PA) phoshorus silicondioxide / glasfiber copper steel zinc nickel 7,6 0,1 3,3 7,1 2,8 11,5 Containing no halogenated compounds or diantimony trioxide classifications: NF F16-101 fire & smoke: I3 / F2 CEN/TS 45545: R25: HL3 R24: HL3 R23: HL2 11,0 9,9 X X Sum in total 100,0 1883 g <25% *) related to component weight **) Weight of particular product, see technical product information Important Remarks: 1) This document provides full declaration of all materials present in Infineon products above a threshold of 0,1 % b.w. (1000 ppm). 2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent substances-of-concern. A list of substances-of-concern can be found at http://www.infineon.com/soc. 3) All statements are based on our present knowledge and are subject to change at any time due to technical requirements and development. Company Address Internet Comment X X X 11,5 7440-50-8 11121-90-7 7440-66-6 7440-02-0 Traces no Infineon Technologies 81726 München www.infineon.com