MCDS - EconoPACK4

Material Content Data Sheet
Umbrella Spec
Date
Revision
Construction element
chip
Base plate and substrate
including metallisation
wire
encapsulation
housing
lead, finish and plating
smd (including thermistors,
resistors and shunts)
deviation
EconoPACKTM 4
2012-03-19
3.0
RoHS compliant
Material group
Materials
Average
CAS-Nr.
if applicable mass [%]*
Sum [%]
inorganic material silicon
7440-21-3
0,3
0,3
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
polymers
polymers
inorganic material
plastics
plastics
inorganic material
non noble metal
ferrous metal
non noble metal
non noble metal
noble metal
non noble metal
7440-50-8
1344-28-1
7440-31-5
7440-22-4
7440-02-0
7429-90-5
55,0
1,1
6,4
0,2
0,1
1,3
6,7
12,2
1,3
0,9
0,6
6,4
2,9
4,6
0,05
62,8
copper
aluminium oxid
tin
silver
nickel
aluminium
silicone gel
PBT
antimonytrioxide
brominated resin
chlorinated resin
silicondioxide / glasfiber
copper
steel
zinc
tin
silver
nickel
inorganic material lead oxide
non noble metal
copper
non noble metal
tin
noble metal
silver
<25%
Weight range of product
family **
Fluctuation
margin
1309-64-4
7440-50-8
7440-66-6
7440-31-5
7440-22-4
7440-02-0
1317-36-8
7440-50-8
7440-50-8
7440-31-5
7440-22-4
Yes
Traces
1,3
6,7
21,4
7,6
X
X
X
0,01
0,01
RoHS compliant
XX
X
X
Sum in total
100,0
385
<25%
*) related to component weight
**) Weight of particular product, see technical product information
Important Remarks:
1) This document provides full declaration of all materials present in Infineon products above a threshold of 0,1
% b.w. (1000 ppm).
2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent
substances-of-concern.
A list of substances-of-concern can be found at http://www.infineon.com/soc.
3) All statements are based on our present knowledge and are subject to change at any time due to technical
requirements and development.
Company
Address
Internet
Comment
Infineon Technologies AG
81726 München
www.infineon.com