MCDS - IH4B 140x130 Cu

Material Content Data Sheet
Umbrella Spec
Date
Revision
Construction element
chip
Base plate and substrate
including metallisation
wire
encapsulation
housing
lead, finish and plating
deviation
IH4B-IHM B 130 Cu
2013-10-23
5.0
RoHS compliant
valid from: date code 2014-01-01
Material group
Materials
CAS-Nr.
Average
if applicable mass [%]*
Sum [%]
inorganic material silicon
7440-21-3
0,5
0,5
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
polymers
7440-50-8
1344-28-1
7440-31-5
7439-92-1
7440-02-0
7440-22-4
7429-90-5
61,7
1,1
2,1
1,7
66,7
polymers
inorganic material
inorganic material
non noble metal
ferrous metal
non noble metal
non noble metal
<25%
Weight range of product
Fluctuation margin
copper
aluminium oxide
tin
lead
nickel
silver
aluminium
silicone gel
Polyamid (PA)
phoshorus
silicondioxide / glasfiber
copper
steel
zinc
nickel
8,0
0,1
3,5
7,1
2,7
11,4
Containing no
halogenated
compounds or
diantimony trioxide
classifications:
NF F16-101 fire &
smoke: I3 / F2
CEN/TS 45545:
R25: HL3 R24: HL3
R23: HL2
11,6
X
9,8
X
X
Sum in total
100,0
1275 g
<25%
*) related to component weight
**) Weight of particular product, see technical product information
Important Remarks:
1) This document provides full declaration of all materials present in Infineon products above a threshold of
0,1 % b.w. (1000 ppm).
2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent
substances-of-concern.
A list of substances-of-concern can be found at http://www.infineon.com/soc.
3) All statements are based on our present knowledge and are subject to change at any time due to technical
requirements and development.
Company
Address
Internet
Comment
X
X
X
11,4
7440-50-8
11121-90-7
7440-66-6
7440-02-0
Traces
no
Infineon Technologies
81726 München
www.infineon.com