PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 Flash Memory Programming Specification 1.0 DEVICE OVERVIEW This document includes the programming specifications for the following devices: 2.1 These devices require one power supply for VDD, see Table 7-1 VDD, and one for VPP, see Table 7-1 VIHH. 2.2 • PIC12F615 • PIC12HV615 • PIC12F609 • PIC12HV609 • PIC12F617 • PIC16HV616 • PIC16F616 • PIC16HV610 Hardware Requirements Program/Verify Mode The Program/Verify mode for these devices allows programming of user program memory, user ID locations, Calibration Word and the Configuration Word. • PIC16F610 Note 1: All references to the PIC12F615 parts refer to the PIC12HV615 parts as well (unless otherwise specified). 2: All references to the PIC16F616 parts refer to the PIC16HV616 as well (unless otherwise specified). 3: All references to the PIC12F609 parts refer to the PIC12HV609 as well (unless otherwise specified). 4: All references to the PIC16F610 parts refer to the PIC16HV610 as well (unless otherwise specified). 5: Any references in this programming specification to PORTA and RAn refer to GPIO and GPn, respectively. 2.0 PROGRAMMING THE PIC12F609/12F615/12F617/ 16F610/16F616 AND PIC12HV609/12HV615/16HV610/ 16HV616 DEVICES The PIC12F609/12F615/12F617/16F610/16F616 and PIC12HV609/12HV615/16HV610/16HV616 devices are programmed using a serial method. The Serial mode will allow these devices to be programmed while in the user’s system. These programming specifications apply to all of the above devices in all packages. 2010 Microchip Technology Inc. DS41284E-page 1 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 8-Pin PDIP, SOIC, MSOP, DFN VDD 1 GP5 2 GP4 3 GP3/MCLR/VPP 4 14-Pin PDIP, SOIC, TSSOP PIC12F615/609 PIC12F617 8-PIN, 14-PIN, AND 16-PIN PROGRAMMING PINS DIAGRAM FOR PIC12F609/ 12F615/12F617/16F610/16F616(1) 8 VSS 7 GP0/ICSPDAT 6 GP1/ICSPCLK 5 GP2 1 14 VSS 2 13 RA0/ICSPDAT RA4 3 12 RA1/ICSPCLK RA3/MCLR/VPP 4 11 RA2 RC5 5 10 RC0 RC4 6 9 RC1 RC3 7 8 RC2 VDD NC NC VSS 16 6 PIC16F616/HV616 15 14 13 5 RC3 PIC16F616/610 VDD RA5 RC4 FIGURE 2-1: Note 1: TABLE 2-1: Pin Name GP1/RA1 GP0/RA0 RA3/MCLR/VPP 3 RC5 4 11 RA1/ICSPCLK 10 RA2 9 RC0 8 2 RA0/ICSPDAT 7 RA4 12 RC1 1 RC2 RA5 PIC16F610/HV610 16-Pin QFN Please see specific data sheets for alternate pin functionality. PIN DESCRIPTIONS IN PROGRAM/VERIFY MODE: PIC12F609/12F615/12F617/ 16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 During Programming Function Pin Type ICSPCLK I Pin Description Clock input – Schmitt Trigger input ICSPDAT I/O Data input/output – Schmitt Trigger input Program/Verify mode P(1) Program Mode Select VDD VDD P Power Supply VSS VSS P Ground MCLR Legend: I = Input, O = Output, P = Power Note 1: In the PIC12F609/12F615/12F617/16F610/16F616 and PIC12HV609/12HV615/16HV610/16HV616, the programming high voltage is internally generated. To activate the Program/Verify mode, voltage of VIHH and a current of IIHH (see Table 7-1) needs to be applied to MCLR input. DS41284E-page 2 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 3.0 MEMORY DESCRIPTION 3.1 Program Memory Map The user memory space extends from 0x0000 to 0x1FFF. In Program/Verify mode, the program memory space extends from 0x0000 to 0x3FFF, with the first half (0x0000-0x1FFF) being user program memory and the second half (0x2000-0x3FFF) being configuration memory. The Program Counter (PC) will increment from 0x0000 to 0x1FFF and wrap to 0x0000. If the PC is between 0x2000 to 0x3FFF it will wrap around to 0x2000 (not to 0x0000). Once in configuration memory, the highest bit of the PC stays a ‘1’, thus always pointing to the configuration memory. The only way to point to user program memory is to reset the part and reenter Program/Verify mode as described in Section 4.0 “Program/Verify Mode”. 3.3 Calibration Word For all of the devices covered in this document, the 4/8 MHz Internal Oscillator (INTOSC) module is factory calibrated. This value is stored in the Calibration Word (0x2008). See the applicable device data sheet for more information. The Calibration Word does not necessarily participate in the erase operation unless a specific procedure is executed. Therefore, the device can be erased without affecting the Calibration Word. This simplifies the erase procedure since these values do not need to be read and restored after the device is erased. For all of the devices covered in this document, the configuration memory space, 0x2000 to 0x2008, is physically implemented. However, only locations 0x2000 to 0x2003, 0x2007 and 0x2008 are available. Other locations are reserved. 3.2 User ID Locations A user may store identification information (user ID) in four designated locations. The user ID locations are mapped in 0x2000 to 0x2003. It is recommended that the user use only the seven Least Significant bits (LSbs) of each user ID location. The user ID locations read out normally, even after code protection is enabled. It is recommended that ID locations are written as ‘xx xxxx xbbb bbbb’ where ‘bbb bbbb’ is the user ID information. The 14 bits may be programmed, but only the 7 LSbs are read and displayed by MPLAB® IDE. 2010 Microchip Technology Inc. DS41284E-page 3 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 3-1: PIC12F615/HV615, PIC12F609/HV609, PIC16F610/HV610 PROGRAM MEMORY MAPPING 1 KW Implemented 03FF Program Memory 2000 User ID Location 2001 User ID Location 2002 User ID Location 2003 User ID Location 2004 Reserved 2005 Reserved 2006 Device ID 2007 Configuration Word 2008 Calibration Word 2009-203F DS41284E-page 4 Reserved Maps to 0-3FF 1FFF 2000 Implemented 2040 Maps to 2000-203F Configuration Memory 3FFF 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 3-2: PIC12F617/PIC16F616/HV616 PROGRAM MEMORY MAPPING 2 KW Implemented 07FF Program Memory 2000 User ID Location 2001 User ID Location 2002 User ID Location 2003 User ID Location 2004 Reserved 2005 Reserved 2006 Device ID 2007 Configuration Word 2008 Calibration Word 2009-203F 2009-206F(1) Note 1: Reserved Maps to 0-7FF 1FFF 2000 Implemented 2040 2070(1) Maps to 2000-203F 2000-206F(1) Configuration Memory 3FFF Applies to the PIC12F617 only. 2010 Microchip Technology Inc. DS41284E-page 5 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.0 PROGRAM/VERIFY MODE Two methods are available to enter Program/Verify mode. “VPP-first” is entered by holding ICSPDAT and ICSPCLK low while raising the MCLR pin from VIL to VIHH (high voltage), then applying VDD and data. This method can be used for any Configuration Word selection and must be used if the INTOSC and internal MCLR options are selected (FOSC<2:0> = 100 or 101 and MCLRE = 0). The VPP-first entry prevents the device from executing code prior to entering Program/ Verify mode. See the timing diagram in Figure 4-1. The second entry method, “VDD-first”, is entered by applying VDD, holding ICSPDAT and ICSPCLK low, then raising MCLR pin from VIL to VIHH (high voltage), followed by data. This method can be used for any Configuration Word selection except when INTOSC and internal MCLR options are selected (FOSC<2:0> = 100 or 101 and MCLRE = 0). This technique is useful when programming the device when VDD is already applied, for it is not necessary to disconnect VDD to enter Program/Verify mode. See the timing diagram in Figure 4-2. FIGURE 4-2: THLD0 To prevent a device configured with INTOSC and internal MCLR from executing after exiting Program/ Verify mode, VDD needs to power down before VPP. See Figure 4-3 for the timing. FIGURE 4-1: VPP-FIRST PROGRAM/ VERIFY MODE ENTRY TPPDP THLD0 VDD ICSPDAT ICSPCLK Note: VDD PROGRAM/VERIFY MODE EXIT THLD0 VPP VDD ICSPDAT ICSPCLK 4.1 Program/Erase Algorithms The PIC16F616/PIC12F617 program memory may be written in two ways. The fastest method writes four words at a time. However, one-word writes are also supported for backward compatibility with previous 8pin and 14-pin Flash devices. The four-word algorithm is used to program the program memory only. The oneword algorithm can write any available memory location (i.e., program memory, configuration memory and calibration memory). The PIC12F615, PIC12F609, PIC16F610 program memories must be written in one-word writes only. After writing the array, the PC may be reset and read back to verify the write. It is not possible to verify immediately following the write because the PC can only increment, not decrement. ICSPDAT ICSPCLK Note: This method of entry is valid if INTOSC and internal MCLR are not selected. FIGURE 4-3: Note: VPP TPPDP VPP Once in Program/Verify mode, the program memory and configuration memory can be accessed and programmed in serial fashion. ICSPDAT and ICSPCLK are Schmitt Trigger inputs in this mode. RA4 is tri-state regardless of fuse setting. The sequence that enters the device into the Program/ Verify mode places all other logic into the Reset state (the MCLR pin was initially at VIL). Therefore, all I/Os are in the Reset state (high-impedance inputs) and the PC is cleared. VDD-FIRST PROGRAM/ VERIFY MODE ENTRY This method of entry is valid, regardless of Configuration Word selected. DS41284E-page 6 A device Reset will clear the PC and set the address to ‘0’. The Increment Address command will increment the PC. The Load Configuration command will set the PC to 0x2000. The available commands are shown in Table 4-1. 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.1.1 ONE-WORD PROGRAMMING The PIC12F615, PIC12F609, PIC16F616 and PIC16F610 program memories can be written one word at a time to allow compatibility with other 8-pin and 14-pin Flash PIC® devices. Configuration memory (>0x2000) must be written one word (or byte) at a time. The sequences for programming one word of program memory at a time is: 1. 2. 3. 4. 5. 6. Load a word at the current program memory address using the Load Data For Program Memory command. Issue a Begin Programming (externally timed) command. Wait TPROG1. Issue End Programming command. Issue an Increment Address command. Repeat this sequence as required to write program, calibration or configuration memory. See Figure 4-12 for more information. 4.1.2 FOUR-WORD PROGRAMMING The PIC16F616/PIC12F617 program memory can be written four words at a time using the four-word algorithm. Configuration memory (addresses >0x2000) and non-aligned (addresses modulo 4 not equal to zero) starting addresses must use the one-word programming algorithm. This algorithm writes four sequential addresses in program memory. The four addresses must point to a four-word block which address modulo 4 of 0, 1, 2 and 3. For example, programming address 4 through 7 can be programmed together. Programming addresses 2 through 5 will create an unexpected result. The sequence for programming four words of program memory at a time is: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Load a word at the current program memory address using the Load Data For Program Memory command. This location must be address modulo 4 equal to 0. Issue an Increment Address command to point to the next address in the block. Load a word at the current program memory address using the Load Data For Program Memory command. Issue an Increment Address command to point to the next address in the block. Load a word at the current program memory address using the Load Data For Programming Memory command. Issue and Increment Address command to point to the next address in the book. Load a word at the current program memory address using the Load Data For Programming Memory command. Issue a Begin Programming command externally timed. Wait TPROG1. Issue End Programming. Wait TDIS. Issue an Increment Address command to point to the start of the next block of addresses. Repeat steps 1 through 12 as required to write the desired range of program memory. See Figure 4-12 for more information. Note: 2010 Microchip Technology Inc. Only the PIC16F616 and PIC12F617 program memory can be written to using the four-word programming algorithm. DS41284E-page 7 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.1.3 ERASE ALGORITHMS The PIC12F609/12F615/12F617/16F610/16F616 and PIC12HV609/12HV615/16HV610/16HV616 devices will erase different memory locations depending on the PC and CP. The following sequences can be used to erase noted memory locations. To erase the program memory and Configuration Word (0x2007), the following sequence must be performed. Note the Calibration Word (0x2008) and User ID (0x2000-0x2003) will not be erased. 1. 2. Do a Bulk Erase Program Memory command. Wait TERA to complete erase. To erase the User ID (0x2000-0x2003), Configuration Word (0x2007) and program memory, use the following sequence. Note that the Calibration Word (0x2008) will not be erased. 1. 2. 3. Perform Load Configuration with dummy data to point the PC to 0x2000. Perform a Bulk Erase Program Memory command. Wait TERA to complete erase. 4.1.4 SERIAL PROGRAM/VERIFY OPERATION The ICSPCLK pin is used as a clock input and the ICSPDAT pin is used for entering command bits and data input/output during serial operation. To input a command, ICSPCLK is cycled six times. Each command bit is latched on the falling edge of the clock with the LSb of the command being input first. The data input onto the ICSPDAT pin is required to have a minimum setup and hold time (see Table 7-1), with respect to the falling edge of the clock. Commands that have data associated with them (Read and Load) are specified to have a minimum delay of 1 s between the command and the data. After this delay, the clock pin is cycled 16 times with the first cycle being a Start bit and the last cycle being a Stop bit. During a read operation, the LSb will be transmitted onto the ICSPDAT pin on the rising edge of the second cycle. For a load operation, the LSb will be latched on the falling edge of the second cycle. A minimum 1 s delay is also specified between consecutive commands, except for the End Programming command, which requires a 100 s (TDIS). All commands and data words are transmitted LSb first. Data is transmitted on the rising edge and latched on the falling edge of the ICSPCLK. To allow for decoding of commands and reversal of data pin configuration, a time separation of at least 1 s (TDLY1) is required between a command and a data word. The commands that are available are described in Table 4-1. DS41284E-page 8 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 TABLE 4-1: COMMAND MAPPING FOR PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 Command Mapping (MSb … LSb) Load Configuration x x 0 0 Data 0 0, data (14), 0 0 Load Data for Program Memory x x 0 0 1 0 0, data (14), 0 Read Data from Program Memory x x 0 1 0 0 0, data (14), 0 Increment Address x x 0 1 1 0 Begin Programming x 1 1 0 0 0 End Programming x 0 1 0 1 0 Bulk Erase Program Memory x x 1 0 0 1 Internally Timed Row Erase Program Memory x 1 0 0 0 1 Internally Timed 4.1.4.1 Externally Timed Load Configuration The Load Configuration command is used to access the Configuration Word (0x2007), User ID (0x20000x2003) and Calibration Word (0x2008). This command sets the PC to address 0x2000 and loads the data latches with one word of data. To access the configuration memory, send the Load Configuration command. Individual words within the configuration memory can be accessed by sending Increment Address commands and using load or read data for program memory. After the 6-bit command is input, the ICSPCLK pin is cycled an additional 16 times for the Start bit, 14 bits of data and the Stop bit (see Figure 4-4). After the configuration memory is entered, the only way to get back to the program memory is to exit the Program/Verify mode by taking MCLR low (VIL). FIGURE 4-4: LOAD CONFIGURATION COMMAND TDLY2 1 2 3 4 5 0 0 X 6 1 2 3 4 5 15 16 ICSPCLK ICSPDAT 0 00 X TDLY1 strt_bit LSb MSb stp_bit TSET1 THLD1 2010 Microchip Technology Inc. DS41284E-page 9 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.1.4.2 Load Data For Program Memory After receiving this command, the chip will load in a 14-bit “data word” when 16 cycles are applied, as described in Section 4.1.4.1 “Load Configuration”. A timing diagram of this command is shown in Figure 4-5. FIGURE 4-5: LOAD DATA FOR PROGRAM MEMORY COMMAND 1 2 3 4 5 0 0 X 6 TDLY2 1 2 3 4 5 15 16 ICSPCLK 1 0 ICSPDAT TSET1 strt_bit X LSb MSb THLD1 4.1.4.3 stp_bit TSET1 TDLY1 THLD1 Read Data From Program Memory After receiving this command, the chip will transmit data bits out of the program memory (user or configuration) currently accessed, starting with the second rising edge of the clock input. The data pin will go into Output mode on the second rising clock edge, and it will revert to Input mode (high-impedance) after the 16th rising edge. If the program memory is code-protected (CP = 0), the data is read as zeros. A timing diagram of this command is shown in Figure 4-6. FIGURE 4-6: READ DATA FROM PROGRAM MEMORY COMMAND TDLY2 1 2 3 4 1 0 5 6 1 2 3 ICSPCLK ICSPDAT 5 15 16 TDLY3 1 0 0 X X strt_bit TSET1 THLD1 input DS41284E-page 10 4 MSb stp_bit LSb TDLY1 output input 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.1.4.4 Increment Address The PC is incremented when this command is received. A timing diagram of this command is shown in Figure 4-7. It is not possible to decrement the address counter. To reset this counter, the user should exit and re-enter Program/Verify mode. FIGURE 4-7: INCREMENT ADDRESS COMMAND (PROGRAM/VERIFY) TDLY2 1 2 3 4 5 Next Command 1 6 2 ICSPCLK 0 ICSPDAT 1 0 1 X X X 0 TSET1 THLD1 4.1.4.5 TDLY1 Begin Programming (Externally Timed) A Load command must be given before every Begin Programming command. Programming of the appropriate memory (program memory, configuration or calibration memory) will begin after this command is received and decoded. Programming requires (TPROG) time and is terminated using an End Programming command. A timing diagram for this command is shown in Figure 4-8. The addressed locations are not erased before programming. FIGURE 4-8: BEGIN PROGRAMMING (EXTERNALLY TIMED) VIHH TPROG MCLR End Programming Command 1 2 3 0 0 0 4 5 6 1 2 ICSPCLK ICSPDAT 1 1 X X 0 TSET1 THLD1 2010 Microchip Technology Inc. DS41284E-page 11 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.1.4.6 End Programming After this command is performed, the write procedure will stop. A timing diagram of this command is shown in Figure 4-9. FIGURE 4-9: END PROGRAMMING (SERIAL PROGRAM/VERIFY) VIHH MCLR Next Command 1 2 3 0 1 0 4 5 1 6 2 ICSPCLK ICSPDAT 1 0 X X TDIS 0 TSET1 THLD1 4.1.4.7 Bulk Erase Program Memory After this command is performed, the entire program memory and Configuration Word (0x2007) is erased. The user ID and calibration memory may also be erased, depending on the value of the PC. See Section 4.1.3 “Erase Algorithms” for erase sequences. A timing diagram for this command is shown in Figure 4-10. FIGURE 4-10: BULK ERASE PROGRAM MEMORY COMMAND TERA 1 2 3 0 0 4 5 6 Next Command 1 2 ICSPCLK 1 ICSPDAT X X X 0 TSET1 TSET1 THLD1 DS41284E-page 12 1 THLD1 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 4.1.4.8 Row Erase Program Memory This command erases the 16-word row of program memory pointed to by PC<11:4>. If the program memory array is protected (CP = 0) or the PC points to the configuration memory (>0x2000), the command is ignored. To perform a Row Erase Program Memory, the following sequence must be performed. 1. 2. Execute a Row Erase Program Memory command. Wait TERA to complete a row erase. FIGURE 4-11: ROW ERASE PROGRAM MEMORY COMMAND TERA 1 2 3 1 0 0 4 5 Next Command 1 6 2 ICSPCLK ICSPDAT 2010 Microchip Technology Inc. 0 1 x x 0 DS41284E-page 13 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 4-12: ONE-WORD PROGRAMMING FLOWCHART (PIC12F61X/16F61X AND PIC12F609) Start Read and Store Calibration Memory Values (Figure 4-16) Bulk Erase Program Memory(1,2) Program Cycle Load Data for Program Memory One-word Program Cycle Begin Programming Command (Externally timed) Read Data from Program Memory Data Correct? No Report Programming Failure Wait TPROG Yes Increment Address Command No All Locations Done? End Programming Yes Program User ID/Config. bits Wait TDIS Read and Verify Calibration Memory Values (Figure 4-16) Done Note 1: 2: This step is optional if the device has already been erased or has not been previously programmed. If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 4-15. DS41284E-page 14 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 4-13: FOUR-WORD PROGRAMMING FLOWCHART (PIC12F617/PIC16F616) Program Cycle Start Load Data for Program Memory Read and Store Calibration Memory Values (Figure 4-16) Increment Address Command Bulk Erase Program Memory(1), (2) Increment Address Command No Load Data for Program Memory Four-word Program Cycle Increment Address Command All Locations Done? Load Data for Program Memory Yes Program User ID/Config. bits Increment Address Command Read and Verify Calibration Memory Values (Figure 4-16) Load Data for Program Memory Done Begin Programming Command (Externally timed) Wait TPROG End Programming Wait TDIS Note 1: 2: This step is optional if the device is erased or not previously programmed. If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 4-15. 2010 Microchip Technology Inc. DS41284E-page 15 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 4-14: PROGRAM FLOWCHART – CONFIGURATION MEMORY Start PROGRAM CYCLE Load Configuration Load Data for Program Memory One-word Program Cycle (User ID) Begin Programming Command (Externally timed) Read Data From Program Memory Command Wait TPROG Data Correct? No Report Programming Failure End Programming Yes Increment Address Command Wait TDIS No Address = 0x2004? Yes Increment Address Command Increment Address Command Increment Address Command One-word Program Cycle (Config. bits) Read Data From Program Memory Command Data Correct? No Report Programming Failure Yes Done DS41284E-page 16 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 4-15: PROGRAM FLOWCHART – ERASE FLASH DEVICE Start Read and Store Calibration Memory Values (Figure 4-16) Load Configuration Bulk Erase(1) Program Memory Read and Verify Calibration Memory Values (Figure 4-16) Done Note 1: See Section 4.1.4.7 “Bulk Erase Program Memory” for more information on the Bulk Erase procedure. 2010 Microchip Technology Inc. DS41284E-page 17 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 FIGURE 4-16: CALIBRATION WORD VERIFICATION FLOWCHART Start Load Configuration Increment Address Command Address = 0x2008? No Yes Read and Store Calibration Word Calibration Word is Valid?(1,2) No Fail Yes Done Note 1: 2: This step is not required for the Read and Store Calibration Memory Values procedure. The device should not be used if verification of the Calibration Word locations fails. This information should be reported to the user through the user interface of the device programmer. DS41284E-page 18 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 5.0 CONFIGURATION WORD The PIC12F609/12F615/12F617/16F610/16F616 and PIC12HV609/12HV615/16HV610/16HV616 devices have several Configuration bits. These bits can be programmed (reads ‘0’) or left unchanged (reads ‘1’), to select various device configurations. REGISTER 5-1: CONFIG: CONFIGURATION WORD (ADDRESS: 2007h) U-1 U-1 U-1 U-1 R/P-1 R/P-1 R/P-1 — — — — BOREN1 BOREN0 IOSCFS R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 bit 13 bit 6 Legend: x = Bit is unknown P = Programmable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-10 Unimplemented: Read as ‘1’ bit 9-8 BOREN<1:0>: Brown-out Reset Enable bits 11 = BOR enabled 10 = BOR enabled while running and disabled in Sleep 0x = BOR disabled bit 7 IOSCFS: Internal Oscillator Frequency Select bit 1 = 8 MHz 0 = 4 MHz bit 6 CP: Code Protection bit 1 = Program memory is not code-protected 0 = Program memory is external read and write-protected bit 5 MCLRE: MCLR Pin Function Select bit 1 = MCLR pin is MCLR function and weak internal pull-up is enabled 0 = MCLR pin is alternate function, MCLR function is internally disabled bit 4 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC<2:0>: Oscillator Selection bits 000 = LP oscillator: Low-power crystal on RA5/GP5 and RA4/GP4 001 = XT oscillator: Crystal/resonator on RA5/GP5 and RA4/GP4 010 = HS oscillator: High-speed crystal/resonator on RA5/GP5 and RA4/GP4 011 = EC: I/O function on RA4/GP4, CLKIN on RA5/GP5 100 = INTOSCIO oscillator: I/O function on RA4/GP4, I/O function on RA5/GP5 101 = INTOSC oscillator: CLKOUT function on RA4/GP4, I/O function on RA5/GP5 110 = EXTRCIO oscillator: I/O function on RA4/GP4, RC on RA5/GP5 111 = EXTRC oscillator: CLKOUT function on RA4/GP4, RC on RA5/GP5 Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2010 Microchip Technology Inc. DS41284E-page 19 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 REGISTER 5-2: CONFIG: CONFIGURATION WORD (ADDRESS: 2007h) FOR PIC12F617 ONLY U-1 U-1 U-1 U-1 R/P-1 R/P-1 R/P-1 — — WRT1 WRT0 BOREN1 BOREN0 IOSCFS bit 13 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 bit 6 Legend: x = Bit is unknown P = Programmable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 13-12 Unimplemented: Read as ‘1’ bit 11-10 WRT<1:0>: Flash Program Memory Self Write Enable bit 11 =Write protection off 10 =000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON1 control 01 =000h to 3FFh write-protected, 400h to 7FFh may be modified by PMCON1 control 00 =000h to 7FFh write-protected, entire program memory is write-protected bit 9-8 BOREN<1:0>: Brown-out Reset Enable bit 11 =BOR enabled 10 =BOR disabled during Sleep and enabled during operation 0X =BOR disabled bit 7 IOSCFS: Internal Oscillator Frequency Select 1 = 8 MHz 0 = 4 MHz bit 6 CP: Code Protection 1 = Program memory is not code-protected 0 = Program memory is external read and write-protected bit 5 MCLRE: MCLR Pin Function Select 1 = MCLR pin is MCLR function and weak internal pull-up is enabled 0 = MCLR pin is alternate function, MCLR function is internally disabled bit 4 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer (PWRT). DS41284E-page 20 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 REGISTER 5-2: bit 2-0 FOSC<2:0>: Oscillator Selection bits 000 = LP oscillator: Low-power crystal on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT 001 = XT oscillator: Crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT 010 = HS oscillator: High-speed crystal/resonator on RA5/T1CKI/OSC1/CLKIN and RA4/AN3/T1G/OSC2/CLKOUT 011 = EC: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, CLKIN on RA5/T1CKI/OSC1/CLKIN 100 = INTOSCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/CLKIN 101 = INTOSC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, I/O function on RA5/T1CKI/OSC1/CLKIN 110 = EXTRCIO oscillator: I/O function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN 111 = EXTRC oscillator: CLKOUT function on RA4/AN3/T1G/OSC2/CLKOUT, RC on RA5/T1CKI/OSC1/CLKIN Note 1: 5.1 CONFIG: CONFIGURATION WORD (ADDRESS: 2007h) (CONTINUED)FOR Enabling Brown-out Reset does not automatically enable Power-up Timer (PWRT). Device ID Word The device ID word for the PIC12F609/12F615/ 12F617/16F610/16F616 and PIC12HV609/12HV615/ 16HV610/16HV616 is loaded at 2006h. This location can not be erased. TABLE 5-1: Device DEVICE ID VALUES Device ID Values Dev Rev PIC12F615 10 0001 100 x xxxx PIC12HV615 10 0001 101 x xxxx PIC12F617 01 0011 011 x xxxx PIC16F616 01 0010 010 x xxxx PIC16HV616 01 0010 011 x xxxx PIC12F609 10 0010 010 x xxxx PIC12HV609 10 0010 100 x xxxx PIC16F610 10 0010 011 x xxxx PIC16HV610 10 0010 101 x xxxx 2010 Microchip Technology Inc. DS41284E-page 21 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 6.0 CODE PROTECTION For PIC12F609/12F615/12F617/16F610/16F616 and PIC12HV609/12HV615/16HV610/16HV616, once the CP bit is programmed to ‘0’, all program memory locations read all ‘0’s. The user ID locations and the Configuration Word read out in an unprotected fashion. Further programming is disabled for the entire program memory. The user ID locations and the Configuration Word can be programmed regardless of the state of the CP bit. 6.1 Disabling Code Protection It is recommended to use the procedure in Figure 4-15 to disable code protection of the device. This sequence will erase the program memory, Configuration Word (0x2007) and user ID locations (0x2000-0x2003). The Calibration Word (0x2008) will not be erased. 6.2 Embedding Configuration Word and User ID Information in the Hex File To allow portability of code, the programmer is required to read the Configuration Word and user ID locations from the hex file when loading the hex file. If Configuration Word information was not present in the hex file, a simple warning message may be issued. Similarly, while saving a hex file, Configuration Word and user ID information must be included. An option to not include this information may be provided. Microchip Technology Incorporated feels strongly that this feature is important for the benefit of the end customer. DS41284E-page 22 6.3 6.3.1 Checksum Computation CHECKSUM Checksum is calculated by reading the contents of the program memory locations and adding up the opcodes up to the maximum user addressable location (e.g., 0x7FF for the PIC16F616). Any carry bits exceeding 16 bits are neglected. Finally, the Configuration Word (appropriately masked) is added to the checksum. The checksum computation for the PIC12F609/12F615/ 12F617/16F610/16F616 and PIC12HV609/12HV615/ 16HV610/16HV616 devices is shown in Table 6-1. The checksum is calculated by summing the following: • The contents of all program memory locations • The Configuration Word, appropriately masked • Masked user ID locations (when applicable) The Least Significant 16 bits of this sum is the checksum. Table 6-1 describes how to calculate the checksum for each device. Note that the checksum calculation differs depending on the code-protect setting. Since the program memory locations read out zeroes when codeprotected, the table describes how to manipulate the actual program memory values to simulate values that would be read from a protected device. When calculating a checksum by reading a device, the entire program memory can simply be read and summed. The Configuration Word and user ID locations can always be read regardless of code-protect setting. Note: Some older devices have an additional value added in the checksum. This is to maintain compatibility with older device programmer checksums. 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 TABLE 6-1: CHECKSUM COMPUTATIONS Device PIC12F615/HV615 PIC12F617 PIC12F609/HV609 PIC16F610/HV610 PIC16F616/HV616 Code Protect Checksum* Blank Value 0x25E6 at 0 and Max. Address CP = 1 SUM[0x000:0x03FF] + (CFGW & 0x03FF) 0xFFFF 0xCBCD CP = 0 (CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C CP = 1 SUM[0x000:0x07FF] + (CFGW & 0x03FF) 0xFBFF 0xC7CD CP = 0 (CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C CP = 1 SUM[0x000:0x03FF] + (CFGW & 0x03FF) 0xFFFF 0xCBCD CP = 0 (CFGW &0x03FF) + SUM_ID 0x03BE 0xCF8C CP = 1 SUM[0x000:0x03FF] + (CFGW & 0x03FF) 0xFFFF 0xCBCD CP = 0 (CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C CP = 1 SUM[0x000:0x07FF] + (CFGW & 0x03FF) 0xFBFF 0xC7CD CP = 0 (CFGW & 0x03FF) + SUM_ID 0x03BE 0xCF8C Legend: CFGW = Configuration Word. Example calculations assume Configuration Word is erased (all ‘1’s). SUM[a:b] = [Sum of locations a to b inclusive] SUM_ID = User ID locations masked by 0xF then made into a 16-bit value with ID0 as the Most Significant nibble. For example, ID0 = 0x1, ID1 = 0x2, ID3 = 0x3, ID4 = 0x4, then SUM_ID = 0x1234. The 4 LSb’s of the unprotected checksum is used for the example calculations. *Checksum = [Sum of all the individual expressions] MODULO [0xFFFF] + = Addition & = Bitwise AND 2010 Microchip Technology Inc. DS41284E-page 23 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 7.0 PROGRAM/VERIFY MODE ELECTRICAL CHARACTERISTICS TABLE 7-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY MODE AC/DC CHARACTERISTICS Sym. Characteristics Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +85°C Operating Voltage 4.5V VDD 5.5V Min. Typ. Max. Units Conditions/Comments 2.0 — 5.5 V PIC16F616/F610, PIC12F615/F617/F609 2.0 — 4.7(1) V PIC16HV616/HV610, PIC12HV615/HV609 2.0 — 5.25(2) V PIC16HV616/HV610, PIC12HV615/HV609 4.5 — 5.5 V PIC16F616/F610, PIC12F615/F617/F609 4.5 — 4.7(1) V PIC16HV616/HV610, PIC12HV615/HV609 4.5 — 5.25(2) V PIC16HV616/HV610, PIC12HV615/HV609 General VDD level for read/write operations, program and data memory VDD VDD level for Bulk Erase operations, program and data memory VIHH High voltage on MCLR for Program/Verify mode entry 10 — 13 V IIHH MCLR current during programming — 300 1000 A TVHHR MCLR rise time (VSS to VHH) for Program/Verify mode entry — — 1.0 s TPPDP Hold time after VPPchanges 5 — — s VIH1 (ICSPCLK, ICSPDAT) input high level 0.8 VDD — — V VIL1 (ICSPCLK, ICSPDAT) input low level 0.2 VDD — — V TSET0 ICSPCLK, ICSPDAT setup time before MCLR (Program/Verify mode selection pattern setup time) 100 — — ns THLD0 Hold time after VDD changes 5 — — s Data in setup time before clock 100 — — ns THLD1 Data in hold time after clock 100 — — ns TDLY1 Data input not driven to next clock input (delay required between command/data or command/ command) 1.0 — — s TDLY2 Delay between clockto clockof next command or data 1.0 — — s TDLY3 Clock to data out valid (during a Read Data command) — — 80 ns Serial Program/Verify TSET1 TERA Erase cycle time — 5 6 ms TPROG Programming cycle time 3 — — ms TDIS Time delay from program to compare (HV discharge time) 100 — — s Note 1: 2: 10°C TA +40°C Maximum VDD voltage when programming the device without a current limiting series resistor. Voltages above this level will cause the shunt regulator to draw excessive current and damage the device. Limiting the current through the shunt regulator to within max shunt current (device electrical characteristic SR02) with either a series resistor or with a current limited supply. DS41284E-page 24 2010 Microchip Technology Inc. PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 APPENDIX A: REVISION HISTORY Revision A (2/06) Original release. Revision B (11/06) Section 1.0 “Device Overview”Added devices. Section 2.1 “Hardware Requirements”Reworded. Section 2.2 “Program/Verify Mode”Deleted data memory. Figure 2-1 Added 16 pin and note 1. Figure 2-1 Reworded Note 1. Section 3.3 “Calibration Word”Changed to 8 MHz. Figure 3-1 Changed title. Section 4.1 “Program/Erase Algorithms”Added text under note. Section 4.1.3 “Erase Algorithms”Moved One word programming to section 4.1.1. Figure 4-12 Changed title. Figure 4-13 Changed title. Register Added GP4 and GP5, added note. Register 5.1 Bit 13 and bits 5-0 changed to unimplemented read as “1”. Section 6.3.1 “Checksum”Changed Lease to Least. Changed CARRY to lowercase. Revision C (05/07) Changed device family name Section 2.1 Revised Section 2.1 Section 3.1 Changed 0x000 to 0x0000 Table 6-1 Changed 1FFF to 0x03FF Table 7-1 Revised VDD section Revised Note 1 and Added Note 2 Revision D (12/09) Updated sections 2.2, 3.3, 4.1.3, 4.1.4.1; Updated Figures 4-11, 4-12, 4-13, 4-14; Added Figure 4-15. Revision E (04/10) Added PIC12F617 part number; minor edits. This document replaces DS41396. 2010 Microchip Technology Inc. DS41284E-page 25 PIC12F609/12F615/12F617/16F610/16F616 AND PIC12HV609/12HV615/16HV610/16HV616 NOTES: DS41284E-page 26 2010 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-165-9 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2010 Microchip Technology Inc. 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