Le87401_Product Brief ( 235.53 kB )

Le87401
PLC Single Channel Line Driver
Line Driver BD870 Series
Product Brief
Features
Version 2
•
Designed for HPAV2 Standard
•
MIMO or SISO Operation
•
Single Channel Operation
•
Small 16-pin, 4x4 mm Package
•
Low Power Operation
•
Class GH Operation
•
Supports HPAV2 Power Save Mode
Le87401NQC
-85.0 dBm/Hz, 30 − 86 MHz
•
+12 V Operation
•
RoHS Compliant
C0
IREF
Bias
Control
C1
+
•
Home Networking
•
HPNA
•
G.HN
A
VOUTA
B
VOUTB
–
Applications
Power Line Communications
GND
Power Control Block
BSTEN
VINA
•
Tray
VBNI
High Signal Level Operation
VBNO
•
VBPO
Operations to 86 MHz
VS
•
VBPI
Channel Enable/Disable Control
Capable of Driving Line Impedance Between
12 Ω to 100 Ω
•
16-pin QFN Green Pkg.
The green package is Halogen free and meets RoHS Directive
2002/95/EC of the European Council to minimize the environmental
impact of electrical equipment.
•
-54.5 dBm/Hz, 2 − 30 MHz
146538
Ordering Information
•
•
May 2013
Document Number
EN1
–
+
VINB
Description
The Le87401 is a single channel line driver designed
to work in Home Plug Alliance HPAV2 systems, G.HN
and MOCA.
Figure 1 - Block Diagram
This single channel device can be used for single-in,
single-out (SISO) operation. Potentially, two singlechannel devices can work together for multiple-in,
multiple-out (MIMO) operation.
The Le87401 can drive a line impedance of 100 Ω
down to 12 Ω through a proper transformer and
delivers superior performance with power efficiency
using Class GH operation.
1
© 2013 Microsemi Corporation. All Rights Reserved.
Le87401
Product Brief
Applications
The Le87401 integrates two high-power line driver amplifiers. The amplifiers are designed for low distortion for
signals up to 86 MHz. A typical PLC application is shown in Figure 2.
Power
Line
Power Line Communications
Wireless
Line Driver
+
POE
LAN/USB
Processor
–
AFE
–
+
LED
Driver
Le87401
Isolated
AC/DC
Power Supply
DC/DC
Power
Figure 2 - PLC Application Diagram
C0
VOUTA
BSTEN
VBPI
Pin Diagrams
16
15
14
13
Top View
IREF
1
VINA
2
12
VBPO
11
VS
10
GND
16-pin QFN
4
9
EXPOSED PAD
C1
5
6
7
8
VBNI
GND
EN1
3
VOUTB
VINB
VBNO
Figure 3 - 16-Pin QFN Diagram
The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected to a copper
plane through thermal vias for proper heat dissipation. It is electrically isolated and may be connected to GND.
2
© 2013 Microsemi Corporation. All Rights Reserved.
Le87401
Physical Dimensions
16-pin QFN
3
© 2013 Microsemi Corporation. All Rights Reserved.
Product Brief
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