Le87402_Product Brief ( 245.67 kB )

Le87402
PLC Dual Channel Line Driver
Line Driver BD870 Series
Product Brief
Features
•
Designed for HPAV2 Standard
•
MIMO or SISO Operation
Version 1
April 2013
Document Number
146539
Ordering Information
28-pin QFN Green Pkg.
28-pin, 4x5 mm QFN Package
•
Low Power Operation
•
Class GH Operation
Independent Channel Enable/Disable Control
•
Capable of Driving Line Impedance Between
12 Ω to 100 Ω
•
Operations to 86 MHz
•
High Signal Level Operation
•
-54.5 dBm/Hz, 2 − 30 MHz
•
-85.0 dBm/Hz, 30 − 86 MHz
•
+12 V Operation
•
RoHS Compliant
VBPO
Supports HPAV2 Power Save Mode
•
GND
•
The green package is Halogen free and meets RoHS Directive
2002/95/EC of the European Council to minimize the environmental
impact of electrical equipment.
•
Tray
VBNI
Dual Channel Architecture
VBNO
•
VS
Best in Class Density
VBPI
•
Le87402MQC
Power Control Block
BSTEN
C0
IREF
Bias
Control
C1
+
VINA
A
VOUTA
B
VOUTB
C
VOUTC
D
VOUTD
–
Applications
EN1
•
Power Line Communications
•
Home Networking
•
HPNA
•
G.HN
–
Description
VINB
+
VINC
+
–
The Le87402 is a 2-channel line driver designed to
work in Home Plug Alliance HPAV2 systems, G.HN
and MOCA.
EN2
Each channel can be enabled independently allowing
multiple-in, multiple-out (MIMO) or single-in, single-out
(SISO) operations.
–
+
VIND
The Le87402 can drive a line impedance of 100 Ω
down to 12 Ω through a proper transformer and
delivers superior performance with power efficiency
using Class GH operation.
Figure 1 - Block Diagram
1
© 2013 Microsemi Corporation. All Rights Reserved.
Le87402
Product Brief
Applications
The Le87402 integrates two sets of high-power line driver amplifiers. The amplifiers are designed for low distortion
for signals up to 86 MHz. A typical PLC application is shown in Figure 2 (one Line Driver channel shown).
Power
Line
Power Line Communications
Wireless
Line Driver
+
POE
LAN/USB
Processor
–
AFE
–
+
LED
Driver
Le87402
Isolated
AC/DC
Power Supply
DC/DC
Power
Figure 2 - PLC Application Diagram
C0
VOUTA
EN1
VOUTB
BSTEN
VBPO
Pin Diagram
28
27
26
25
24
23
Top View
22
NC
2
21
VBPI
3
20
VS
19
VS
18
VS
17
GND
IREF
1
VINA
VINB
GND
4
GND
5
VINC
6
VIND
7
NC
8
28-pin QFN
12
13
14
GND
VBNO
VOUTD
11
VOUTC
10
EN2
9
C1
EXPOSED PAD
16
VBNI
15
NC
Figure 3 - Pin Diagram
The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected to a
copper plane through thermal vias for proper heat dissipation. It is electrically isolated and may be connected to GND.
2
© 2013 Microsemi Corporation. All Rights Reserved.
Le87402
Physical Dimensions
28-pin QFN
3
© 2013 Microsemi Corporation. All Rights Reserved.
Product Brief
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