Le87402 PLC Dual Channel Line Driver Line Driver BD870 Series Product Brief Features • Designed for HPAV2 Standard • MIMO or SISO Operation Version 1 April 2013 Document Number 146539 Ordering Information 28-pin QFN Green Pkg. 28-pin, 4x5 mm QFN Package • Low Power Operation • Class GH Operation Independent Channel Enable/Disable Control • Capable of Driving Line Impedance Between 12 Ω to 100 Ω • Operations to 86 MHz • High Signal Level Operation • -54.5 dBm/Hz, 2 − 30 MHz • -85.0 dBm/Hz, 30 − 86 MHz • +12 V Operation • RoHS Compliant VBPO Supports HPAV2 Power Save Mode • GND • The green package is Halogen free and meets RoHS Directive 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment. • Tray VBNI Dual Channel Architecture VBNO • VS Best in Class Density VBPI • Le87402MQC Power Control Block BSTEN C0 IREF Bias Control C1 + VINA A VOUTA B VOUTB C VOUTC D VOUTD – Applications EN1 • Power Line Communications • Home Networking • HPNA • G.HN – Description VINB + VINC + – The Le87402 is a 2-channel line driver designed to work in Home Plug Alliance HPAV2 systems, G.HN and MOCA. EN2 Each channel can be enabled independently allowing multiple-in, multiple-out (MIMO) or single-in, single-out (SISO) operations. – + VIND The Le87402 can drive a line impedance of 100 Ω down to 12 Ω through a proper transformer and delivers superior performance with power efficiency using Class GH operation. Figure 1 - Block Diagram 1 © 2013 Microsemi Corporation. All Rights Reserved. Le87402 Product Brief Applications The Le87402 integrates two sets of high-power line driver amplifiers. The amplifiers are designed for low distortion for signals up to 86 MHz. A typical PLC application is shown in Figure 2 (one Line Driver channel shown). Power Line Power Line Communications Wireless Line Driver + POE LAN/USB Processor – AFE – + LED Driver Le87402 Isolated AC/DC Power Supply DC/DC Power Figure 2 - PLC Application Diagram C0 VOUTA EN1 VOUTB BSTEN VBPO Pin Diagram 28 27 26 25 24 23 Top View 22 NC 2 21 VBPI 3 20 VS 19 VS 18 VS 17 GND IREF 1 VINA VINB GND 4 GND 5 VINC 6 VIND 7 NC 8 28-pin QFN 12 13 14 GND VBNO VOUTD 11 VOUTC 10 EN2 9 C1 EXPOSED PAD 16 VBNI 15 NC Figure 3 - Pin Diagram The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected to a copper plane through thermal vias for proper heat dissipation. It is electrically isolated and may be connected to GND. 2 © 2013 Microsemi Corporation. All Rights Reserved. Le87402 Physical Dimensions 28-pin QFN 3 © 2013 Microsemi Corporation. All Rights Reserved. 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