PIC16(L)F171X Memory Programming Specification

PIC16(L)F171X
PIC16(L)F171X Memory Programming Specification
This document includes the
programming specifications for the
following devices:
1.1.2
LOW-VOLTAGE ICSP
PROGRAMMING
• PIC16F1713
• PIC16LF1713
• PIC16F1716
• PIC16LF1716
• PIC16F1717
• PIC16LF1717
In Low-Voltage ICSP mode, the PIC16(L)F171X
devices can be programmed using a single VDD source
in the operating range. The MCLR/VPP pin does not
have to be brought to a different voltage, but can
instead be left at the normal operating voltage.
• PIC16F1718
• PIC16LF1718
1.1.2.1
• PIC16F1719
• PIC16LF1719
1.0
The LVP bit in Configuration Word 2 enables
single-supply (low-voltage) ICSP programming. The
LVP bit defaults to a ‘1’ (enabled) from the factory. The
LVP bit may only be programmed to ‘0’ by entering the
High-Voltage ICSP mode, where the MCLR/VPP pin is
raised to VIHH. Once the LVP bit is programmed to a ‘0’,
only the High-Voltage ICSP mode is available and only
the High-Voltage ICSP mode can be used to program
the device.
OVERVIEW
The device can be programmed using either the
high-voltage In-Circuit Serial Programming™ (ICSP™)
method or the low-voltage ICSP method.
1.1
Hardware Requirements
1.1.1
Single-Supply ICSP Programming
Note 1: The High-Voltage ICSP mode is always
available, regardless of the state of the
LVP bit, by applying VIHH to the MCLR/
VPP pin.
HIGH-VOLTAGE ICSP
PROGRAMMING
In High-Voltage ICSP mode, the device requires two
programmable power supplies: one for VDD and one for
the MCLR/VPP pin.
2: While in Low-Voltage ICSP mode, MCLR
is always enabled, regardless of the
MCLRE bit, and the port pin can no
longer be used as a general purpose
input.
1.2
Pin Utilization
Five pins are needed for ICSP programming. The pins
are listed in Table 1-1.
TABLE 1-1:
Pin Name
PIN DESCRIPTIONS DURING PROGRAMMING
During Programming
Function
Pin Type
Pin Description
ICSPCLK
ICSPCLK
I
ICSPDAT
ICSPDAT
I/O
Data Input/Output – Schmitt Trigger Input
Program/Verify mode
P(1)
Program Mode Select/Programming Power Supply
VDD
VDD
P
Power Supply
VSS
VSS
P
Ground
MCLR/VPP
Clock Input – Schmitt Trigger Input
Legend: I = Input, O = Output, P = Power
Note 1: The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage
needs to be applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any
significant current.
 2013 Microchip Technology Inc.
DS40001714C-page 1
PIC16(L)F171X
2.0
DEVICE PINOUTS
The pin diagrams for the PIC16L(F)1713/6/8 family are
shown in Figure 2-1 and Figure 2-2.
The pin diagrams for the PIC16L(F)1717/9 family are
shown in Figure 2-3, Figure 2-4 and Figure 2-5.
The pins that are required for programming are listed in
Table 1-1 and shown in bold lettering in the pin
diagrams.
FIGURE 2-1:
28-PIN DIAGRAM FOR PIC16L(F)1713/6/8
PDIP, SOIC, TSSOP
1
28
RB7/ICSPDAT
RA0
RA1
2
27
RB6/ICSPCLK
3
RB5
RA2
4
RA3
RA4
RA5
VSS
5
26
25
24
23
22
21
20
19
6
7
8
9
10
11
12
RA7
RA6
RC0
RC1
RC2
RC3
FIGURE 2-2:
PIC16L(F)1713/6/8
VPP/MCLR/RE3
18
17
RB4
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RC6
13
16
RC5
14
15
RC4
28-PIN PACKAGE DIAGRAM FOR PIC16L(F)1713/6/8
1
2
3
4
5
6
7
21
20
19
18
17
16
15
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RA2
RA3
RA4
RA5
VSS
RA7
RA6
8 P
IC
9
16
L(
10
F)
17
11
13
12
/6
/8
13
14
28
27
26
25
24
23
22
RA1
RA0
RE3/MCLR/VPP
RB7/ICSPDAT
RB6/ICSPCLK
RB5
RB4
(U)QFN
DS40001714C-page 2
 2013 Microchip Technology Inc.
PIC16(L)F171X
VPP/MCLR/RE3
1
40
RB7/ICSPDAT
RA0
RA1
2
39
RB6/ICSPCLK
3
38
RB5
RA2
4
37
RA3
RA4
RA5
RE0
5
36
RB4
RB3
6
35
7
34
8
33
RE1
RE2
VDD
VSS
9
RA7
13
RA6
RC0
RC1
14
27
RD5
RD4
15
26
RC7
16
25
RC2
RC3
RD0
RD1
17
24
18
23
19
22
20
21
RC6
RC5
RC4
RD3
RD2
10
11
12
RB2
RB1
RB0
VDD
32
VSS
RD7
RD6
31
30
29
28
40-PIN UQFN (5X5) PACKAGE DIAGRAM FOR PIC16L(F)1717/9
31
32
34
33
35
36
37
38
39
1
2
30
3
29
4
28
27
5
PIC16L(F)1717/9
6
26
7
25
8
24
23
9
20
19
18
17
16
15
14
13
22
21
RC0
RA6
RA7
VSS
VDD
RE2
RE1
RE0
RA5
RA4
RB3
RB4
RB5
ICSPCLK/RB6
ICSPDAT/RB7
VPP/MCLR/RE3
RA0
RA1
RA2
RA3
11
10
12
RC7
RD4
RD5
RD6
RD7
VSS
VDD
RB0
RB1
RB2
40
RC6
RC5
RC4
RD3
RD2
RD1
RD0
RC3
RC2
RC1
FIGURE 2-4:
40-PIN DIP DIAGRAM FOR PIC16L(F)1717/9
PIC16L(F)1717/9
FIGURE 2-3:
 2013 Microchip Technology Inc.
DS40001714C-page 3
PIC16(L)F171X
44-PIN TQFP (10X10) PACKAGE DIAGRAM FOR PIC16L(F)1717/9
44
43
42
41
40
39
38
37
36
35
34
RC6
RC5
RC4
RD3
RD2
RD1
RD0
RC3
RC2
RC1
NC
FIGURE 2-5:
PIC16L(F)1717/9
33
32
31
30
29
28
27
26
25
24
23
NC
RC0
RA6
RA7
VSS
VDD
RE2
RE1
RE0
RA5
RA4
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
10
11
NC
NC
RB4
RB5
ICSPCLK/RB6
ICSPDAT/RB7
VPP/MCLR/RE3
RA0
RA1
RA2
RA3
RC7
RD4
RD5
RD6
RD7
VSS
VDD
RB0
RB1
RB2
RB3
DS40001714C-page 4
 2013 Microchip Technology Inc.
PIC16(L)F171X
3.0
MEMORY MAP
The memory is broken into two sections: program
memory and configuration memory.
FIGURE 3-1:
PIC16(L)F1713 PROGRAM MEMORY MAPPING
4 KW
0000h
0FFFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Revision ID
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
800Bh
Calibration Word 3
800Ch
Calibration Word 4
800Dh
Reserved
800Eh
Reserved
800Fh
Calibration Word 5
8010h
Calibration Word 6
Implemented
Maps to
0-0FFFh
7FFFh
8000h
Program Memory
Implemented
8200h
8011h-81FFh
 2013 Microchip Technology Inc.
Maps to
8000-81FF
Configuration Memory
FFFFh
Reserved
DS40001714C-page 5
PIC16(L)F171X
FIGURE 3-2:
PIC16(L)F1716/7 PROGRAM MEMORY MAPPING
8 KW
0000h
1FFFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Revision ID
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
800Bh
Calibration Word 3
800Ch
Calibration Word 4
800Dh
Reserved
800Eh
Reserved
800Fh
Calibration Word 5
8010h
Calibration Word 6
Implemented
Maps to
0-1FFFh
7FFFh
8000h
Program Memory
Implemented
8200h
8011h-81FFh
DS40001714C-page 6
Maps to
8000-81FF
Configuration Memory
FFFFh
Reserved
 2013 Microchip Technology Inc.
PIC16(L)F171X
FIGURE 3-3:
PIC16(L)F1718/9 PROGRAM MEMORY MAPPING
16 KW
0000h
3FFFh
8000h
User ID Location
8001h
User ID Location
8002h
User ID Location
8003h
User ID Location
8004h
Reserved
8005h
Revision ID
8006h
Device ID
8007h
Configuration Word 1
8008h
Configuration Word 2
8009h
Calibration Word 1
800Ah
Calibration Word 2
800Bh
Calibration Word 3
800Ch
Calibration Word 4
800Dh
Reserved
800Eh
Reserved
800Fh
Calibration Word 5
8010h
Calibration Word 6
Implemented
Maps to
0-1FFFh
7FFFh
8000h
Program Memory
Implemented
8200h
8011h-81FFh
 2013 Microchip Technology Inc.
Maps to
8000-81FF
Configuration Memory
FFFFh
Reserved
DS40001714C-page 7
PIC16(L)F171X
3.1
User ID Location
A user may store identification information (user ID) in
four designated locations. The user ID locations are
mapped to 8000h-8003h. Each location is 14 bits in
length. Code protection has no effect on these memory
locations. Each location may be read with code
protection enabled or disabled.
Note:
MPLAB® IDE only displays the seven
Least Significant bits (LSb) of each user
ID location; the upper bits are not read. It
is recommended that only the seven LSbs
be used if MPLAB IDE is the primary tool
used to read these addresses.
DS40001714C-page 8
 2013 Microchip Technology Inc.
PIC16(L)F171X
3.2
Device/Revision ID
The 14-bit device ID word is located at 8006h and the
14-bit revision ID is located at 8005h. These locations
are read-only and cannot be erased or modified.
REGISTER 3-1:
DEVICEID: DEVICE ID REGISTER(1)
R
R
R
R
R
R
DEV<13:8>
bit 13
R
R
bit 8
R
R
R
R
R
R
DEV<7:0>
bit 7
bit 0
Legend:
R = Readable bit
‘0’ = Bit is cleared
bit 13-0
x = Bit is unknown
‘1’ = Bit is set
DEV<13:0>: Device ID bits
Refer to Table 3-1 to determine what these bits will read on which device. A value of 3FFFh is invalid.
Note 1:
This location cannot be written.
REGISTER 3-2:
REVISIONID: REVISION ID REGISTER(1)
R
R
R
R
R
R
REV<13:8>
bit 13
R
R
bit 8
R
R
R
R
R
R
REV<7:0>
bit 7
bit 0
Legend:
R = Readable bit
‘0’ = Bit is cleared
bit 13-0
‘1’ = Bit is set
x = Bit is unknown
REV<13:0>: Revision ID bits
These bits are used to identify the device revision.
Note 1: This location cannot be written.
 2013 Microchip Technology Inc.
DS40001714C-page 9
PIC16(L)F171X
TABLE 3-1:
DEVICE ID VALUES
Device
Device ID
Revision ID
PIC16F1713
3049h
2xxxh
PIC16LF1713
304Bh
2xxxh
PIC16F1716
3048h
2xxxh
PIC16LF1716
304Ah
2xxxh
PIC16F1717
305Ch
2xxxh
PIC16LF1717
305Fh
2xxxh
PIC16F1718
305Bh
2xxxh
PIC16LF1718
305Eh
2xxxh
PIC16F1719
305Ah
2xxxh
PIC16LF1719
305Dh
2xxxh
DS40001714C-page 10
 2013 Microchip Technology Inc.
PIC16(L)F171X
3.3
Configuration Words
3.4
The device has two Configuration Words, Configuration
Word 1 (8007h) and Configuration Word 2 (8008h). The
individual bits within these Configuration Words are
used to enable or disable device functions such as the
Brown-out Reset, code protection and Power-up Timer.
REGISTER 3-3:
Calibration Words
The internal calibration values are factory calibrated
and stored in the Calibration Word locations. See
Figure 3-1 for address information.
The Calibration Words do not participate in erase
operations. The device can be erased without affecting
the Calibration Words.
CONFIGURATION WORD 1
R/P-1
R/P-1
R/P-1
FCMEN
IESO
CLKOUTEN
R/P-1
R/P-1
BOREN<1:0>
—
bit 13
R/P-1
R/P-1
R/P-1
CP
MCLRE
PWRTE
U-1
bit 8
R/P-1
R/P-1
WDTE<1:0>
R/P-1
R/P-1
R/P-1
FOSC<2:0>
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared
‘1’ = Bit is set
n = Value when blank or after Bulk Erase
bit 13
FCMEN: Fail-Safe Clock Monitor Enable bit
1 = ON
Fail-Safe Clock Monitor is enabled
0 = OFF Fail-Safe Clock Monitor is disabled
bit 12
IESO: Internal External Switchover bit
1 = ON
Internal/External Switchover mode is enabled
0 = OFF Internal/External Switchover mode is disabled
bit 11
CLKOUTEN: Clock Out Enable bit
1 = OFF CLKOUT function is disabled. I/O or oscillator function on CLKOUT
0 = ON
CLKOUT function is enabled on CLKOUT
bit 10-9
BOREN<1:0>: Brown-out Reset Enable bits(1)
11 = ON
BOR enabled
10 = SLEEP
BOR enabled during operation and disabled in Sleep
01 = SBODEN
BOR controlled by SBOREN bit of the BORCON register
00 = OFF
BOR disabled
bit 8
Unimplemented: Read as ‘1’
bit 7
CP: Code Protection bit(2)
1 = OFF Program memory code protection is disabled
0 = ON
Program memory code protection is enabled
bit 6
MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1 (ON):
This bit is ignored.
If LVP bit = 0 (OFF):
1 = ON
MCLR/VPP pin function is MCLR; Weak pull-up enabled.
0 = OFF MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under
control of port pin’s WPU control bit.
bit 5
PWRTE: Power-up Timer Enable bit(1)
1 = OFF PWRT disabled
0 = ON
PWRT enabled
Note 1:
2:
Enabling Brown-out Reset does not automatically enable Power-up Timer.
The entire program memory will be erased when the code protection is turned off.
 2013 Microchip Technology Inc.
DS40001714C-page 11
PIC16(L)F171X
REGISTER 3-3:
CONFIGURATION WORD 1 (CONTINUED)
bit 4-3
WDTE<1:0>: Watchdog Timer Enable bit
11 = ON
WDT enabled
10 = SLEEP
WDT enabled while running and disabled in Sleep
01 = SWDTEN
WDT controlled by the SWDTEN bit in the WDTCON register
00 = OFF
WDT disabled
bit 2-0
FOSC<2:0>: Oscillator Selection bits
111 = ECH
External Clock, High-Power mode: CLKIN on OSC1/CLKIN
110 = ECM
External Clock, Medium-Power mode: CLKIN on OSC1/CLKIN
101 = ECL
External Clock, Low-Power mode: CLKIN on OSC1/CLKIN
100 = INTOSC
Internal HFINTOSC, I/O function on OSC1/CLKIN
011 = EXTRC
External RC oscillator, RC function on OSC1/CLKIN
010 = HS
High-speed crystal/resonator on OSC2/CLKOUT pin and OSC1/CLKIN
001 = XT
Crystal/resonator on OSC2/CLKOUT pin and OSC1/CLKIN
000 = LP
Low-power crystal on OSC2/CLKOUT pin and OSC1/CLKIN
Note 1:
2:
Enabling Brown-out Reset does not automatically enable Power-up Timer.
The entire program memory will be erased when the code protection is turned off.
DS40001714C-page 12
 2013 Microchip Technology Inc.
PIC16(L)F171X
REGISTER 3-4:
CONFIGURATION WORD 2
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
LVP
DEBUG
LPBOR
BORV
STVREN
PLLEN
bit 13
bit 8
R/P-1
U-1
U-1
U-1
U-1
R/P-1
ZCDDIS
—
—
—
—
PPS1WAY
R/P-1
R/P-1
WRT<1:0>
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared
‘1’ = Bit is set
n = Value when blank or after Bulk Erase
bit 13
LVP: Low-Voltage Programming Enable bit(1)
1 = ON
Low-voltage programming enabled
0 = OFF
MCLR/VPP must be used for programming high voltage
bit 12
DEBUG: In-Circuit Debugger Mode bit
1 = OFF
In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins
0 = ON
In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger
bit 11
LPBOR: Low-Power Brown-out Reset Enable bit
1 = OFF
Low-Power Brown-out Reset is disabled
0 = ON
Low-Power Brown-out Reset is enabled
bit 10
BORV: Brown-out Reset Voltage Selection bit(2)
1 = LOW
Brown-out Reset voltage (VBOR), low trip point selected
0 = HIGH Brown-out Reset voltage (VBOR), high trip point selected
bit 9
STVREN: Stack Overflow/Underflow Reset Enable bit
1 = ON
Stack Overflow or Underflow will cause a Reset
0 = OFF
Stack Overflow or Underflow will not cause a Reset
bit 8
PLLEN: PLL Enable bit
1 = ON
4xPLL enabled
0 = OFF
4xPLL disabled
bit 7
ZCDDIS: Zero-Cross Detect Disable bit
1 = ON
Zero-cross detection is disabled on POR. Zero-cross detection can be controlled by
software.
0 = OFF
Zero-cross detection is always enabled. Software cannot disable zero-cross detection.
bit 6-3
Unimplemented: Read as ‘1’
bit 2
PPS1WAY: PPSLOCK One-Way Set Enable bit
1 = ON
The PPSLOCK bit is permanently set after the first access sequence that sets it.
0 = OFF
The PPSLOCK bit can be set and cleared as needed by the PPSLOCK access sequence.
Note 1:
2:
The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
See VBOR parameter for specific trip point voltages.
 2013 Microchip Technology Inc.
DS40001714C-page 13
PIC16(L)F171X
REGISTER 3-4:
bit 1-0
Note 1:
2:
CONFIGURATION WORD 2 (CONTINUED)
WRT<1:0>: Flash Memory Self-Write Protection bits
4 kW Flash memory: (PIC16(L)F1713):
11 = OFF Write protection off
10 = BOOT 000h to 1FFh write-protected, 200h to FFFh may be modified by PMCON control
01 = HALF 000h to 7FFh write-protected, 800h to FFFh may be modified by PMCON control
00 = ALL 000h to FFFh write-protected, no addresses may be modified by PMCON control
8 kW Flash memory: (PIC16(L)F1716/7)
11 = OFF Write protection off
10 = BOOT 0000h to 03FFh write-protected, 0400h to 1FFFh may be modified by PMCON
control
01 = HALF 0000h to 0FFFh write-protected, 1000h to 1FFFh may be modified by PMCON
control
00 = ALL 0000h to 1FFFh write-protected, no addresses may be modified by PMCON control
16 kW Flash memory: (PIC16(L)F1718/9)
11 = OFF Write protection off
10 = BOOT 0000h to 07FFh write-protected, 0800h to 3FFFh may be modified by PMCON
control
01 = HALF 0000h to 1FFFh write-protected, 2000h to 3FFFh may be modified by PMCON
control
00 = ALL 0000h to 3FFFh write-protected, no addresses may be modified by PMCON control
The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
See VBOR parameter for specific trip point voltages.
DS40001714C-page 14
 2013 Microchip Technology Inc.
PIC16(L)F171X
4.0
PROGRAM/VERIFY MODE
In Program/Verify mode, the program memory and the
configuration memory can be accessed and
programmed in serial fashion. ICSPDAT and
ICSPCLK are used for the data and the clock,
respectively. All commands and data words are
transmitted LSb first. Data changes on the rising edge
of the ICSPCLK and is latched on the falling edge. In
Program/Verify mode, both the ICSPDAT and
ICSPCLK are Schmitt Trigger inputs. The sequence
that enters the device into Program/Verify mode
places all other logic into the Reset state. Upon
entering Program/Verify mode, all I/Os are
automatically configured as high-impedance inputs
and the address is cleared.
4.1.3
PROGRAM/VERIFY MODE EXIT
To exit Program/Verify mode take MCLR to VDD or
lower (VIL). See Figures 8-3 and 8-4.
Note:
4.2
In systems where the VDD and MCLR/VPP
signals can be controlled independently
the VPP last method of exit should be used
to keep the device in Reset, thereby preventing any issues that may be caused by
program execution.
Low-Voltage Programming (LVP)
Mode
There are two different methods of entering Program/
Verify mode via high-voltage:
The Low-Voltage Programming mode allows the
PIC16(L)F171X devices to be programmed using VDD
only, without high voltage. When the LVP bit of the
Configuration Word 2 register is set to ‘1’, the
low-voltage ICSP programming entry is enabled. To
disable the Low-Voltage ICSP mode, the LVP bit must
be programmed to ‘0’. This can only be done while in
the High-Voltage Entry mode.
• VPP – First entry mode
• VDD – First entry mode
Entry into the Low-Voltage ICSP Program/Verify mode
requires the following steps:
4.1.1
1.
2.
4.1
High-Voltage Program/Verify Mode
Entry and Exit
VPP – FIRST ENTRY MODE
To enter Program/Verify mode via the VPP-first method,
the following sequence must be followed:
1.
2.
3.
Hold ICSPCLK and ICSPDAT low. All other pins
should be unpowered.
Raise the voltage on MCLR from 0V to VIHH.
Raise the voltage on VDD from 0V to the desired
operating voltage.
The VPP-first entry prevents the device from executing
code prior to entering Program/Verify mode. For
example, when the Configuration Word has MCLR
disabled (MCLRE = 0), the power-up time is disabled
(PWRTE = 0), the internal oscillator is selected
(FOSC = 100), and RA0 and RA1 are driven by the user
application, the device will execute code. Since this
may prevent entry, VPP-first entry mode is strongly
recommended. See the timing diagram in Figure 8-2.
4.1.2
VDD – FIRST ENTRY MODE
To enter Program/Verify mode via the VDD-first method,
the following sequence must be followed:
1.
2.
3.
Hold ICSPCLK and ICSPDAT low.
Raise the voltage on VDD from 0V to the desired
operating voltage.
Raise the voltage on MCLR from VDD or below
to VIHH.
MCLR is brought to VIL.
A 32-bit key sequence is presented on
ICSPDAT, while clocking ICSPCLK.
The key sequence is a specific 32-bit pattern, '0100
1101 0100 0011 0100 1000 0101 0000' (more
easily remembered as MCHP in ASCII). The device will
enter Program/Verify mode only if the sequence is
valid. The Least Significant bit of the Least Significant
nibble must be shifted in first.
Once the key sequence is complete, MCLR must be
held at VIL for as long as Program/Verify mode is to be
maintained.
For low-voltage programming timing, see Figures 8-8
and 8-9.
Exiting Program/Verify mode is done by no longer
driving MCLR to VIL. See Figures 8-8 and 8-9.
Note:
To enter LVP mode, the LSb of the Least
Significant nibble must be shifted in first.
This differs from entering the key
sequence on other parts.
The VDD-first method is useful when programming the
device when VDD is already applied, for it is not
necessary to disconnect VDD to enter Program/Verify
mode. See the timing diagram in Figure 8-1.
 2013 Microchip Technology Inc.
DS40001714C-page 15
PIC16(L)F171X
4.3
Program/Verify Commands
These devices implement 13 programming commands,
each six bits in length. The commands are summarized
in Table 4-1.
Commands that have data associated with them are
specified to have a minimum delay of TDLY between the
command and the data. After this delay, 16 clocks are
required to either clock in or clock out the 14-bit data
word. The first clock is for the Start bit and the last clock
is for the Stop bit.
TABLE 4-1:
COMMAND MAPPING
Mapping
Command
Binary (MSb … LSb)
Data/Note
Hex
Load Configuration
x
0
0
0
0
0
00h
0, data (14), 0
Load Data For Program Memory
x
0
0
0
1
0
02h
0, data (14), 0
Read Data From Program Memory
x
0
0
1
0
0
04h
0, data (14), 0
Increment Address
x
0
0
1
1
0
06h
—
Reset Address
x
1
0
1
1
0
16h
—
Begin Internally Timed Programming
x
0
1
0
0
0
08h
—
Begin Externally Timed Programming
x
1
1
0
0
0
18h
—
End Externally Timed Programming
x
0
1
0
1
0
0Ah
—
Bulk Erase Program Memory
x
0
1
0
0
1
09h
Internally Timed
Row Erase Program Memory
x
1
0
0
0
1
11h
Internally Timed
DS40001714C-page 16
 2013 Microchip Technology Inc.
PIC16(L)F171X
4.3.1
LOAD CONFIGURATION
The Load Configuration command is used to access
the configuration memory (User ID Locations,
Configuration Words, Calibration Words). The Load
Configuration command sets the address to 8000h and
loads the data latches with one word of data (see
Figure 4-1).
Note:
The only way to get back to the program memory
(address 0) is to exit Program/Verify mode or issue the
Reset Address command after the configuration memory
has been accessed by the Load Configuration command.
After issuing the Load Configuration command, use the
Increment Address command until the proper address
to be programmed is reached. The address is then
programmed by issuing either the Begin Internally
Timed Programming or Begin Externally Timed
Programming command.
FIGURE 4-1:
Externally timed writes are not supported
for Configuration and Calibration bits. Any
externally timed write to the Configuration
or Calibration Word will have no effect on
the targeted word.
LOAD CONFIGURATION
1
2
5
4
3
6
2
1
16
15
TDLY
ICSPCLK
ICSPDAT
4.3.2
0
0
0
0
0
X
0
LSb
1
2
MSb 0
LOAD DATA FOR PROGRAM
MEMORY
The Load Data for Program Memory command is used to
load one 14-bit word into the data latches. The word
programs into program memory after the Begin Internally
Timed Programming or Begin Externally Timed
Programming command is issued (see Figure 4-2).
FIGURE 4-2:
LOAD DATA FOR PROGRAM MEMORY
1
2
3
4
5
6
15
16
TDLY
ICSPCLK
ICSPDAT
0
 2013 Microchip Technology Inc.
1
0
0
0
X
0
LSb
MSb 0
DS40001714C-page 17
PIC16(L)F171X
4.3.3
READ DATA FROM PROGRAM
MEMORY
The Read Data from Program Memory command will
transmit data bits out of the program memory map
currently accessed, starting with the second rising edge
of the clock input. The ICSPDAT pin will go into Output
mode on the first falling clock edge, and it will revert to
Input mode (high-impedance) after the 16th falling edge
of the clock. If the program memory is code-protected
(CP), the data will be read as zeros (see Figure 4-3).
FIGURE 4-3:
READ DATA FROM PROGRAM MEMORY
1
2
3
4
5
6
1
2
15
16
TDLY
ICSPCLK
ICSPDAT
(from Programmer)
0
0
1
0
0
X
ICSPDAT
(from device)
x
MSb
Input
Output
Input
4.3.4
LSb
INCREMENT ADDRESS
The address is incremented when this command is
received. It is not possible to decrement the address.
To reset this counter, the user must use the Reset
Address command or exit Program/Verify mode and
re-enter it.
If the address is incremented from address 7FFFh, it
will wrap-around to location 0000h. If the address is
incremented from FFFFh, it will wrap-around to location
8000h (see Figure 4-4).
FIGURE 4-4:
INCREMENT ADDRESS
Next Command
1
2
3
4
2
1
6
5
3
TDLY
ICSPCLK
ICSPDAT
0
1
1
0
0
Address
DS40001714C-page 18
X
X
X
X
Address + 1
 2013 Microchip Technology Inc.
PIC16(L)F171X
4.3.5
RESET ADDRESS
The Reset Address command will reset the address to
0000h, regardless of the current value. The address is
used in program memory or the configuration memory.
See Figure 4-5.
FIGURE 4-5:
RESET ADDRESS
Next Command
1
2
5
4
3
1
6
2
3
TDLY
ICSPCLK
0
ICSPDAT
1
1
0
X
X
X
X
0000h
N
Address
4.3.6
1
BEGIN INTERNALLY TIMED
PROGRAMMING
A Load Configuration or Load Data for Program
Memory command must be given before every Begin
Programming command. Programming of the
addressed memory will begin after this command is
received. An internal timing mechanism executes the
write. The user must allow for the program cycle time,
TPINT, in order for the programming to complete.
The End Externally Timed Programming command is
not needed when the Begin Internally Timed
Programming is used to start the programming.
The program memory address that is being
programmed is not erased prior to being programmed.
See Figure 4-6.
FIGURE 4-6:
BEGIN INTERNALLY TIMED PROGRAMMING
1
2
3
5
4
Next Command
2
1
3
6
TPINT
ICSPCLK
ICSPDAT
0
 2013 Microchip Technology Inc.
0
0
1
0
X
X
X
X
DS40001714C-page 19
PIC16(L)F171X
4.3.7
BEGIN EXTERNALLY TIMED
PROGRAMMING
A Load Configuration or Load Data for Program
Memory command must be given before every Begin
Programming command. Programming of the
addressed memory will begin after this command is
received. To complete the programming, the End
Externally Timed Programming command must be sent
in the specified time window defined by TPEXT. See
Figure 4-7.
Externally timed writes are not supported for
Configuration and Calibration bits. Any externally timed
write to the Configuration or Calibration Word will have
no effect on the targeted word.
FIGURE 4-7:
BEGIN EXTERNALLY TIMED PROGRAMMING
End Externally Timed Programming
Command
1
2
4
3
5
6
1
2
3
TPEXT
ICSPCLK
0
ICSPDAT
4.3.8
0
0
1
0
X
1
1
0
END EXTERNALLY TIMED
PROGRAMMING
This command is required after a Begin Externally
Timed Programming command is given. This
command must be sent within the time window
specified by TPEXT after the Begin Externally Timed
Programming command is sent.
After sending the End Externally Timed Programming
command, an additional delay (TDIS) is required before
sending the next command. This delay is longer than
the delay ordinarily required between other commands.
See Figure 4-8.
FIGURE 4-8:
END EXTERNALLY TIMED PROGRAMMING
1
2
5
4
3
Next Command
2
1
3
6
TDIS
ICSPCLK
ICSPDAT
DS40001714C-page 20
0
1
0
1
1
X
X
X
X
 2013 Microchip Technology Inc.
PIC16(L)F171X
4.3.9
BULK ERASE PROGRAM MEMORY
After receiving the Bulk Erase Program Memory
command, the erase will not complete until the time
interval, TERAB, has expired.
The Bulk Erase Program Memory command performs
two different functions, dependent on the current state
of the address.
Note:
Address 0000h-7FFFh:
Program Memory is erased
The code protection Configuration bit
(CP) has no effect on the Bulk Erase
Program Memory command.
Configuration Words are erased
Address 8000h-8008h:
Program Memory is erased
Configuration Words are erased
User ID Locations are erased
A Bulk Erase Program Memory command should not
be issued when the address is greater than 8008h.
FIGURE 4-9:
BULK ERASE PROGRAM MEMORY
1
2
4
3
5
Next Command
2
1
3
6
TERAB
ICSPCLK
ICSPDAT
4.3.10
1
0
0
0
1
X
X
X
X
ROW ERASE PROGRAM MEMORY
The Row Erase Program Memory command will erase
an individual row. Refer to Table 4-2 for row sizes of
specific devices and the PC bits used to address them.
If the program memory is code-protected, the Row
Erase Program Memory command will be ignored.
When the address is 8000h-8008h, the Row Erase
Program Memory command will only erase the user ID
locations regardless of the setting of the CP
Configuration bit.
After receiving the Row Erase Program Memory
command, the erase will not complete until the time
interval, TERAR, has expired. See Figure 4-10.
FIGURE 4-10:
ROW ERASE PROGRAM MEMORY
1
2
5
4
3
Next Command
2
1
3
6
TERAR
ICSPCLK
ICSPDAT
 2013 Microchip Technology Inc.
1
0
0
0
1
X
X
X
X
DS40001714C-page 21
PIC16(L)F171X
TABLE 4-2:
PROGRAMMING ROW AND LATCH SIZES
Devices
PC
Erase Row Size
(Number of 14-bit Words)
Write Row Size
(Number of 14-bit Latches)
<15:5>
32
32
PIC16F1713
PIC16F1716
PIC16F1717
PIC16F1718
PIC16F1719
PIC16LF1713
PIC16LF1716
PIC16LF1717
PIC16LF1718
PIC16LF1719
DS40001714C-page 22
 2013 Microchip Technology Inc.
PIC16(L)F171X
5.0
PROGRAMMING ALGORITHMS
The devices use internal latches to temporarily store
the 14-bit words used for programming. Refer to
Table 4-2 for specific latch information. The data
latches allow the user to write the program words with
a single Begin Externally Timed Programming or Begin
Internally Timed Programming command. The Load
Program Data or the Load Configuration command is
used to load a single data latch. The data latch will hold
the data until the Begin Externally Timed Programming
or Begin Internally Timed Programming command is
given.
The data latches are aligned with the LSbs of the
address. The PS address bits indicated in Table 4-2 at
the time the Begin Externally Timed Programming or
Begin Internally Timed Programming command is
given will determine which memory row is written.
Writes cannot cross a physical row boundary. For
example, attempting to write from address 0002h0021h in a 32-latch device will result in data being
written to 0020h-003Fh.
If more than the maximum number of latches are
written without a Begin Externally Timed Programming
or Begin Internally Timed Programming command, the
data in the data latches will be overwritten. The
following figures show the recommended flowcharts for
programming.
 2013 Microchip Technology Inc.
DS40001714C-page 23
PIC16(L)F171X
FIGURE 5-1:
DEVICE PROGRAM/VERIFY FLOWCHART
Start
Enter
Programming Mode
Bulk Erase
Device
Write Program
Memory(1)
Write User IDs
Verify Program
Memory
Verify User IDs
Write Configuration
Words(2)
Verify Configuration
Words
Exit Programming
Mode
Done
Note 1:
See Figure 5-2.
2:
See Figure 5-5.
DS40001714C-page 24
 2013 Microchip Technology Inc.
PIC16(L)F171X
FIGURE 5-2:
PROGRAM MEMORY FLOWCHART
Start
Bulk Erase
Program
Memory(1, 2)
Program Cycle(3)
Read Data
from
Program Memory
Data Correct?
No
Report
Programming
Failure
Yes
Increment
Address
Command
No
All Locations
Done?
Yes
Done
Note 1:
This step is optional if the device has already been erased or has not been previously programmed.
2:
If the device is code-protected or must be completely erased, then Bulk Erase the device per Figure 5-6.
3:
See Figure 5-3 or Figure 5-4.
 2013 Microchip Technology Inc.
DS40001714C-page 25
PIC16(L)F171X
FIGURE 5-3:
ONE-WORD PROGRAM CYCLE
Program Cycle
Load Data
for
Program Memory
Begin
Programming
Command
(Internally timed)
Wait TPINT
Begin
Programming
Command
(Externally timed)(1)
Wait TPEXT
End
Programming
Command
Wait TDIS
Note 1: Externally timed writes are not supported for Configuration and Calibration bits.
DS40001714C-page 26
 2013 Microchip Technology Inc.
PIC16(L)F171X
FIGURE 5-4:
MULTIPLE-WORD PROGRAM CYCLE
Program Cycle
Load Data
for
Program Memory
Latch 1
Increment
Address
Command
Load Data
for
Program Memory
Latch 2
Increment
Address
Command
Load Data
for
Program Memory
Latch 32
Begin
Programming
Command
(Internally timed)
Begin
Programming
Command
(Externally timed)
Wait TPINT
Wait TPEXT
End
Programming
Command
Wait TDIS
 2013 Microchip Technology Inc.
DS40001714C-page 27
PIC16(L)F171X
FIGURE 5-5:
CONFIGURATION MEMORY PROGRAM FLOWCHART
Start
Load
Configuration
Bulk Erase
Program
Memory(1)
One-word
Program Cycle(2)
(User ID)
Read Data
From Program
Memory Command
Data Correct?
No
Report
Programming
Failure
Yes
Increment
Address
Command
No
Address =
8004h?
Yes
Increment
Address
Command
Increment
Address
Command
Increment
Address
Command
One-word
Program Cycle(2)
(Config. Word 1)
Read Data
From Program
Memory Command
Data Correct?
No
Report
Programming
Failure
Yes
Increment
Address
Command
One-word
Program Cycle(2)
(Config. Word 2)
Read Data
From Program
Memory Command
Data Correct?
No
Report
Programming
Failure
Yes
Note
1:
This step is optional if the device is erased or not previously programmed.
2:
See Figure 5-3.
DS40001714C-page 28
Done
 2013 Microchip Technology Inc.
PIC16(L)F171X
FIGURE 5-6:
ERASE FLOWCHART
Start
Load Configuration
Bulk Erase
Program Memory
Done
Note:
This sequence does not erase the Calibration Words.
 2013 Microchip Technology Inc.
DS40001714C-page 29
PIC16(L)F171X
6.0
CODE PROTECTION
Code protection is controlled using the CP bit in
Configuration Word 1. When code protection is
enabled, all program memory locations (0000h-7FFFh)
read as ‘0’. Further programming is disabled for the
program memory (0000h-7FFFh). Program memory
can still be programmed and read during program
execution.
The user ID locations and Configuration Words can be
programmed and read out regardless of the code
protection settings.
6.1
Program Memory
Code protection is enabled by programming the CP bit
in Configuration Word 1 register to ‘0’.
The only way to disable code protection is to use the
Bulk Erase Program Memory command.
7.0
HEX FILE USAGE
In the hex file there are two bytes per program word
stored in the Intel® INHX32 hex format. Data is stored
LSB first, MSB second. Because there are two bytes
per word, the addresses in the hex file are 2x the
address in program memory. (Example: The
Configuration Word 1 is stored at 8007h. In the hex file
this will be referenced as 1000Eh-1000Fh).
7.1
Configuration Word
To allow portability of code, it is strongly recommended
that the programmer is able to read the Configuration
Words and user ID locations from the hex file. If the
Configuration Words information was not present in the
hex file, a simple warning message may be issued.
Similarly, while saving a hex file, Configuration Words
and user ID information should be included.
7.2
7.3
Checksum Computation
The checksum is calculated by two different methods
dependent on the setting of the CP Configuration bit.
TABLE 7-1:
CONFIGURATION WORD
MASK VALUES
Config. Word 1
Mask
Config. Word 2
Mask
PIC16F1713
3EFFh
3F87h
PIC16LF1713
3EFFh
3F87h
PIC16F1716
3EFFh
3F87h
PIC16LF1716
3EFFh
3F87h
PIC16F1717
3EFFh
3F87h
PIC16LF1717
3EFFh
3F87h
PIC16F1718
3EFFh
3F87h
PIC16LF1718
3EFFh
3F87h
PIC16F1719
3EFFh
3F87h
PIC16LF1719
3EFFh
3F87h
Device
7.3.1
PROGRAM CODE PROTECTION
DISABLED
With the program code protection disabled, the
checksum is computed by reading the contents of the
PIC16(L)F171X program memory locations and adding
up the program memory data starting at address 0000h,
up to the maximum user addressable location
(e.g., FFFh for the PIC16F1713). Any Carry bits
exceeding 16 bits are ignored. Additionally, the relevant
bits of the Configuration Words are added to the
checksum. All unimplemented Configuration bits are
masked to ‘0’.
Device ID
If a device ID is present in the hex file at
1000Ch-1000Dh (8006h on the part), the programmer
should verify the device ID against the value read from
the part. On a mismatch condition, the programmer
should generate a warning message.
DS40001714C-page 30
 2013 Microchip Technology Inc.
PIC16(L)F171X
7.3.2
PROGRAM CODE PROTECTION
ENABLED
When the MPLAB® IDE check box for Configure->ID
Memory...-> Use Unprotected Checksum is checked,
then the 16-bit checksum of the equivalent
unprotected device is computed and stored in the user
ID. Each nibble of the unprotected checksum is stored
in the Least Significant nibble of each of the four user
ID locations. The Most Significant checksum nibble is
stored in the user ID at location 8000h, the second
Most Significant nibble is stored at location 8001h, and
so forth for the remaining nibbles and ID locations.
The protected checksums in Table 7-2 assume that
the Use Unprotected Checksum box is checked.
The checksum of a code-protected device is computed
in the following manner: the Least Significant nibble of
each user ID is used to create a 16-bit value. The Least
Significant nibble of user ID location 8000h is the Most
Significant nibble of the 16-bit value. The Least
Significant nibble of user ID location 8001h is the
second Most Significant nibble, and so forth for the
remaining user IDs and 16-bit value nibbles. The
resulting 16-bit value is summed with the Configuration
Words. All unimplemented Configuration bits are
masked to ‘0’.
TABLE 7-2:
CHECKSUMS
Config1
Config2
Checksum
Unprotected
Device
Unprotected Protected
Mask
Word
Mask
Blank
00AAh
First and
Last
Code-protected
Blank
00AAh
First and
Last
PIC16F1713
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
6E86h
EFDCh
EC8Ch
6DE2h
PIC16F1716
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
5E86h
DFDCh
DC8Ch
5DE2h
PIC16F1717
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
5E86h
DFDCh
DC8Ch
5DE2h
PIC16F1718
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
3E86h
BFDCh
BC8Ch
3DE2h
PIC16F1719
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
3E86h
BFDCh
BC8Ch
3DE2h
PIC16LF1713
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
6E86h
EFDCh
EC8Ch
6DE2h
PIC16LF1716
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
5E86h
DFDCh
DC8Ch
5DE2h
PIC16LF1717
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
5E86h
DFDCh
DC8Ch
5DE2h
PIC16LF1718
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
3E86h
BFDCh
BC8Ch
3DE2h
PIC16LF1719
3FFFh
3F7Fh
3EFFh
3FFFh
3F87h
3E86h
BFDCh
BC8Ch
3DE2h
 2013 Microchip Technology Inc.
DS40001714C-page 31
PIC16(L)F171X
8.0
ELECTRICAL SPECIFICATIONS
Refer to device specific data sheet for absolute
maximum ratings.
TABLE 8-1:
AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY
MODE
Standard Operating Conditions
Production tested at 25°C
AC/DC CHARACTERISTICS
Sym.
Characteristics
Min.
Typ.
Max.
Units
Conditions/Comments
Programming Supply Voltages and Currents
VDD
Supply Voltage
(VDDMIN(2), VDDMAX)
PIC16LF171X
1.80
2.50
—
3.60
3.60
V
V
FOSC 16 MHz
FOSC >16 MHz
PIC16F171X
2.30
2.50
—
5.50
5.50
V
V
FOSC 16 MHz
FOSC >16 MHz
VPEW
Read/Write and Row Erase operations
VDDMIN
—
VDDMAX
V
VBE
Bulk Erase operations
2.7
—
VDDMAX
V
IDDI
Current on VDD, Idle
—
—
1.0
mA
IDDP
Current on VDD, Programming
—
—
3.0
mA
VPP
IPP
Current on MCLR/VPP
—
—
600
A
VIHH
High voltage on MCLR/VPP for
Program/Verify mode entry
8.0
—
9.0
V
TVHHR
MCLR rise time (VIL to VIHH) for
Program/Verify mode entry
—
—
1.0
s
0.8 VDD
—
—
V
I/O pins
VIH
(ICSPCLK, ICSPDAT, MCLR/VPP) input high level
VIL
(ICSPCLK, ICSPDAT, MCLR/VPP) input low level
ICSPDAT output high level
VOH
—
—
0.2 VDD
V
VDD-0.7
VDD-0.7
VDD-0.7
—
—
V
IOH = 3.5 mA, VDD = 5V
IOH = 3 mA, VDD = 3.3V
IOH = 2 mA, VDD = 1.8V
—
—
VSS+0.6
VSS+0.6
VSS+0.6
V
IOH = 8 mA, VDD = 5V
IOH = 6 mA, VDD = 3.3V
IOH = 3 mA, VDD = 1.8V
—
2.70
—
V
PIC16(L)F171X
—
—
2.40
1.90
—
—
V
V
PIC16F171X
PIC16LF171X
ICSPDAT output low level
VOL
Brown-out Reset Voltage:
BORV = 0 (high trip)
VBOR
BORV = 1 (low trip)
Programming Mode Entry and Exit
TENTS
Programming mode entry setup time: ICSPCLK,
ICSPDAT setup time before VDD or MCLR
100
—
—
ns
TENTH
Programming mode entry hold time: ICSPCLK,
ICSPDAT hold time after VDD or MCLR
250
—
—
s
TCKL
Clock Low Pulse Width
100
—
—
ns
TCKH
Clock High Pulse Width
100
—
—
ns
Serial Program/Verify
TDS
Data in setup time before clock
100
—
—
ns
TDH
Data in hold time after clock
100
—
—
ns
TCO
Clock to data out valid (during a
Read Data command)
0
—
80
ns
TLZD
Clock to data low-impedance (during a
Read Data command)
0
—
80
ns
DS40001714C-page 32
 2013 Microchip Technology Inc.
PIC16(L)F171X
TABLE 8-1:
AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY
MODE (CONTINUED)
Standard Operating Conditions
Production tested at 25°C
AC/DC CHARACTERISTICS
Sym.
Characteristics
Min.
Typ.
Max.
Units
0
—
80
ns
—
s
ms
Conditions/Comments
THZD
Clock to data high-impedance (during a
Read Data command)
TDLY
Data input not driven to next clock input (delay
required between command/data or command/
command)
1.0
—
TERAB
Bulk Erase cycle time
—
—
5
TERAR
Row Erase cycle time
—
—
2.5
ms
TPINT
Internally timed programming operation time
—
—
—
—
2.5
5
ms
ms
Program memory
Configuration Words
TPEXT
Externally timed programming pulse
1.0
—
2.1
ms
Note 1
TDIS
Time delay from program to compare
(HV discharge time)
300
—
—
s
TEXIT
Time delay when exiting Program/Verify mode
1
—
—
s
Note 1:
2:
8.1
Externally timed writes are not supported for Configuration and Calibration bits.
Bulk-erased devices default to brown-out enabled. VDDMIN is 2.85 volts when performing low-voltage programming on a
bulk-erased device, to ensure that the device is not held in Brown-out Reset.
AC Timing Diagrams
FIGURE 8-1:
PROGRAMMING MODE
ENTRY – VDD FIRST
TENTS
FIGURE 8-3:
PROGRAMMING MODE
EXIT – VPP LAST
TEXIT
TENTH
VIHH
VIHH
VPP
VPP
VIL
VDD
VIL
VDD
ICSPDAT
ICSPDAT
ICSPCLK
ICSPCLK
FIGURE 8-2:
PROGRAMMING MODE
ENTRY – VPP FIRST
TENTS
FIGURE 8-4:
TEXIT
TENTH
VIHH
VIHH
VPP
VIL
VDD
ICSPDAT
ICSPCLK
 2013 Microchip Technology Inc.
PROGRAMMING MODE
EXIT – VDD LAST
VPP
VIL
VDD
ICSPDAT
ICSPCLK
DS40001714C-page 33
PIC16(L)F171X
FIGURE 8-5:
CLOCK AND DATA
TIMING
TCKL
TCKH
ICSPCLK
TDS TDH
ICSPDAT
as
input
TCO
ICSPDAT
as
output
TLZD
ICSPDAT
from input
to output
THZD
ICSPDAT
from output
to input
FIGURE 8-6:
WRITE COMMAND – PAYLOAD TIMING
TDLY
1
2
3
4
5
X
X
X
X
X
2
1
6
15
16
ICSPCLK
ICSPDAT
0 LSb
X
Command
FIGURE 8-7:
MSb
0
Next
Command
Payload
READ COMMAND – PAYLOAD TIMING
TDLY
1
2
3
4
5
X
ICSPDAT
(from Programmer)
X
X
X
X
2
1
6
15
16
ICSPCLK
x
ICSPDAT
(from Device)
Command
DS40001714C-page 34
X
LSb
MSb
Payload
0
Next
Command
 2013 Microchip Technology Inc.
PIC16(L)F171X
FIGURE 8-8:
LVP ENTRY (POWERING UP)
VDD
MCLR
TENTS
TENTH
33 clocks
TCKH
TCKL
ICSPCLK
TDH
ICSPDAT
FIGURE 8-9:
LSb of Pattern
0
TDS
1
2
...
MSb of Pattern
31
LVP ENTRY (POWERED)
VDD
MCLR
TENTH
33 Clocks
TCKH
TCKL
ICSPCLK
TDH
ICSPDAT
Note:
LSb of Pattern
0
TDS
1
2
...
MSb of Pattern
31
Sequence matching can start with no edge on MCLR first.
 2013 Microchip Technology Inc.
DS40001714C-page 35
PIC16(L)F171X
APPENDIX A:
REVISION HISTORY
Revision A (06/2013)
Initial release of this document.
Revision B (08/2013)
Updated pin diagrams.
Revision C (12/2013)
Changed the family name to PIC16(L)F171X; Added
PIC16(L)F1717, PIC16(L)F1718 and PIC16(L)F1719;
Updated Table 8-1 in Chapter 8.0 (Electrical
Specifications); Other minor corrections.
DS40001714C-page 36
 2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620777152
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS40001714C-page 37
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DS40001714C-page 38
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10/28/13
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