PIC16F76/77 → PIC16CR76/77 Migration DEVICE MIGRATIONS This document is intended to describe the differences that are present when migrating from one device to the next. Table 1 and Table 2 list the differences in the electrical specifications. Note 1: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. 2: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading capacitor values and/or the Oscillator mode may be required. Oscillator Differences The functionality of the RC oscillator in both the PIC16F7X family and the PIC16CR7X family was designed to be equivalent, however, due to process variation and continuous improvement, the Frequency vs. VDD charts in Section 16 of the PIC16F7X may not represent current production devices. For a comparison of the PIC16F7X and the PIC16CR7X devices, please consult Figure 16-7 through Figure 16-9 in the PIC16CR7X Data Sheet (DS21993). RA4 Functionality The RA4 pin on the PIC16CR7X family of devices should never be taken higher than 5.5 volts. The RA4 pin retains the Open Drain configuration of the Flash device. MCLR Functionality The ESD protection that is present on the Flash PIC16F7X devices is also present on the PIC16CR7S ROM family. For this reason, Microchip recommends that the MCLR pin not be tied directly to VDD. The use of an RC network, as shown in Figure 1, is suggested. This pin should never be taken above 5.5 volts. FIGURE 1: RECOMMENDED MCLR CIRCUIT VDD PIC16CR7X R1 10 kΩ (or greater) MCLR R2 => 1KΩ R2 C1 0.1 μF (optional, not critical) © 2006 Microchip Technology Inc. DS21995A-page 1 Electrical Characteristics Differences TABLE 1: PIC16F76/77 → PIC16CR76/77 ELECTRICAL CHARACTERISTICS DIFFERENCES Characteristic Voltage on VDD with respect to VSS Voltage on MCLR with respect to VSS (Note 1) Voltage on RA4 with respect to VSS Note 1: PIC16F7X Data Sheet PIC16CR7X Data Sheet Units -0.3 to 6.5 -0.3 to 5.5 V 0 to 13.5 0 to 5.5 V 0 to 12 0 to 5.5 V It is not recommended to tie the MCLR pin directly to VDD (see Figure 1 in this document or Figure 12-5 in the PIC16CR7X Data Sheet (DS21993) for the recommended MCLR circuit). DS21995A-page 2 © 2006 Microchip Technology Inc. TABLE 2: PIC16F76/77 → PIC16CR76/77 DC CHARACTERISTICS DIFFERENCES Param Sym No. Characteristic PIC16F7X Data Sheet Min D005 BVDD Brown-out Reset Voltage D010 IDD Supply Current (Notes 3, 5) PIC16CR7X Data Sheet Conditions Typ† Max Units Typ† Max Units TBD TBD TBD V 3.65 4.0 4.35 V — 0.9 4 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 5.5V, (Note 5) — 1.1 4 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 5.5V, (Note 5) D013 — 5.2 15 mA HS osc configuration FOSC = 20 MHz, VDD = 5.5V — 6.3 15 mA HS osc configuration FOSC = 20 MHz, VDD = 5.5V D015* ΔIBOR Brown-out Reset Current (Note 6) — 25 200 μA BOR enabled, VDD = 5.0V — 30 200 μA Power-down Reset Current (Note 4, 7) — 5.0 42 μA VDD = 4.0V, WDT enabled, -40°C to +85°C — TBD 42 μA D021x — 0.1 19 μA VDD = 4.0V, WDT disabled, -40°C to +85°C — TBD 19 μA D021B — 1.5 42 μA VDD = 4.0V, WDT disabled, -40°C to +125°C — TBD 42 μA — — 12 V RA4 pin — — 5.5 V D020 IPD D150* VOD Open Drain High Voltage BOREN bit in Configuration Word enabled Conditions Min Currently being characterized Currently being characterized, however, expected to be the same or lower than the PIC16F7X family RA4 pin * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: For RC osc configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16CR76/77 be driven with external clock in RC mode. 2: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = External square wave, from-rail to-rail; all I/O pins tri-stated, pulled to VDD. MCLR = VDD; WDT enabled/disabled as specified. 4: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from characterization and is for design guidance only. This is not tested. 5: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 7: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and pulled to VDD and VSS. RC Oscillator Comparison Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. The Oscillator frequency is strongly influenced by VDD and Temperature Check the RC oscillator frequency across the applications expected temperature and voltage range. © 2006 Microchip Technology Inc. DS21995A-page 3 FIGURE 2: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R (RC MODE, C = 20 pF, 25°C) 5.0 4.5 Operation above 4 MHz is not recommended 4.0 3.5 Freq (MHz) 10KΩ (F7x) 3.0 10 kΩ 2.5 2.0 1.5 1.0 0.5 100 kΩ 0.0 2.5 3 3.5 4 4.5 5 5.5 5 5.5 V D D (V) FIGURE 3: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R (RC MODE, C = 100 pF, 25°C) 2.5 Freq (MHz) 2 5.1 kΩ 1.5 1 10KΩ (F7x) 10 kΩ 0.5 100 kΩ 0 2.5 3 3.5 4 4.5 V D D (V) DS21995A-page 4 © 2006 Microchip Technology Inc. FIGURE 4: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R (RC MODE, C = 300 pF, 25°C) 1 0.9 0.8 3.3KΩ Freq (MHz) 0.7 0.6 5.1KΩ 0.5 0.4 10KΩ (F7x) 10KΩ 0.3 0.2 0.1 100KΩ 0 2.5 3 3.5 4 4.5 5 5.5 V D D (V) © 2006 Microchip Technology Inc. DS21995A-page 5 NOTES: DS21995A-page 6 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. DS21995A-page 7 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 02/16/06 DS21995A-page 8 © 2006 Microchip Technology Inc.