PIC16F76/77 - PIC16CR76/77 Migration

PIC16F76/77 → PIC16CR76/77 Migration
DEVICE MIGRATIONS
This document is intended to describe the differences that are present when migrating from one device to the next.
Table 1 and Table 2 list the differences in the electrical specifications.
Note 1: This device has been designed to perform to the parameters of its data sheet. It has been tested to an
electrical specification designed to determine its conformance with these parameters. Due to process
differences in the manufacture of this device, this device may have different performance characteristics
than its earlier version. These differences may cause this device to perform differently in your application
than the earlier version of this device.
2: The user should verify that the device oscillator starts and performs as expected. Adjusting the loading
capacitor values and/or the Oscillator mode may be required.
Oscillator Differences
The functionality of the RC oscillator in both the PIC16F7X family and the PIC16CR7X family was designed to be
equivalent, however, due to process variation and continuous improvement, the Frequency vs. VDD charts in Section
16 of the PIC16F7X may not represent current production devices. For a comparison of the PIC16F7X and the
PIC16CR7X devices, please consult Figure 16-7 through Figure 16-9 in the PIC16CR7X Data Sheet (DS21993).
RA4 Functionality
The RA4 pin on the PIC16CR7X family of devices should never be taken higher than 5.5 volts. The RA4 pin retains the
Open Drain configuration of the Flash device.
MCLR Functionality
The ESD protection that is present on the Flash PIC16F7X devices is also present on the PIC16CR7S ROM family. For
this reason, Microchip recommends that the MCLR pin not be tied directly to VDD. The use of an RC network, as shown
in Figure 1, is suggested. This pin should never be taken above 5.5 volts.
FIGURE 1:
RECOMMENDED MCLR CIRCUIT
VDD
PIC16CR7X
R1
10 kΩ (or greater)
MCLR
R2 => 1KΩ
R2
C1
0.1 μF
(optional, not critical)
© 2006 Microchip Technology Inc.
DS21995A-page 1
Electrical Characteristics Differences
TABLE 1:
PIC16F76/77 → PIC16CR76/77 ELECTRICAL CHARACTERISTICS DIFFERENCES
Characteristic
Voltage on VDD with respect to VSS
Voltage on MCLR with respect to VSS (Note 1)
Voltage on RA4 with respect to VSS
Note 1:
PIC16F7X Data Sheet
PIC16CR7X Data Sheet
Units
-0.3 to 6.5
-0.3 to 5.5
V
0 to 13.5
0 to 5.5
V
0 to 12
0 to 5.5
V
It is not recommended to tie the MCLR pin directly to VDD (see Figure 1 in this document or Figure 12-5 in
the PIC16CR7X Data Sheet (DS21993) for the recommended MCLR circuit).
DS21995A-page 2
© 2006 Microchip Technology Inc.
TABLE 2:
PIC16F76/77 → PIC16CR76/77 DC CHARACTERISTICS DIFFERENCES
Param
Sym
No.
Characteristic
PIC16F7X Data Sheet
Min
D005
BVDD
Brown-out
Reset Voltage
D010
IDD
Supply Current
(Notes 3, 5)
PIC16CR7X Data Sheet
Conditions
Typ† Max Units
Typ†
Max Units
TBD
TBD
TBD
V
3.65
4.0
4.35
V
—
0.9
4
mA
XT, RC osc
configuration
FOSC = 4 MHz,
VDD = 5.5V, (Note 5)
—
1.1
4
mA
XT, RC osc
configuration
FOSC = 4 MHz,
VDD = 5.5V, (Note 5)
D013
—
5.2
15
mA
HS osc configuration
FOSC = 20 MHz,
VDD = 5.5V
—
6.3
15
mA
HS osc configuration
FOSC = 20 MHz,
VDD = 5.5V
D015* ΔIBOR Brown-out
Reset Current
(Note 6)
—
25
200
μA
BOR enabled,
VDD = 5.0V
—
30
200
μA
Power-down
Reset Current
(Note 4, 7)
—
5.0
42
μA
VDD = 4.0V,
WDT enabled,
-40°C to +85°C
—
TBD
42
μA
D021x
—
0.1
19
μA
VDD = 4.0V,
WDT disabled,
-40°C to +85°C
—
TBD
19
μA
D021B
—
1.5
42
μA
VDD = 4.0V,
WDT disabled,
-40°C to +125°C
—
TBD
42
μA
—
—
12
V
RA4 pin
—
—
5.5
V
D020
IPD
D150* VOD
Open Drain
High Voltage
BOREN bit in
Configuration Word
enabled
Conditions
Min
Currently being
characterized
Currently being
characterized,
however, expected
to be the same or
lower than the
PIC16F7X family
RA4 pin
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: For RC osc configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16CR76/77 be driven with external clock in RC mode.
2: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current
consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = External square wave, from-rail to-rail; all I/O pins tri-stated, pulled to VDD.
MCLR = VDD; WDT enabled/disabled as specified.
4: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from characterization and
is for design guidance only. This is not tested.
5: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2REXT (mA) with REXT in kΩ.
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
7: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and pulled to VDD and VSS.
RC Oscillator Comparison
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
The Oscillator frequency is strongly influenced by VDD and Temperature Check the RC oscillator frequency
across the applications expected temperature and voltage range.
© 2006 Microchip Technology Inc.
DS21995A-page 3
FIGURE 2:
AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R
(RC MODE, C = 20 pF, 25°C)
5.0
4.5
Operation above 4 MHz is not recommended
4.0
3.5
Freq (MHz)
10KΩ (F7x)
3.0
10 kΩ
2.5
2.0
1.5
1.0
0.5
100 kΩ
0.0
2.5
3
3.5
4
4.5
5
5.5
5
5.5
V D D (V)
FIGURE 3:
AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R
(RC MODE, C = 100 pF, 25°C)
2.5
Freq (MHz)
2
5.1 kΩ
1.5
1
10KΩ (F7x)
10 kΩ
0.5
100 kΩ
0
2.5
3
3.5
4
4.5
V D D (V)
DS21995A-page 4
© 2006 Microchip Technology Inc.
FIGURE 4:
AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R
(RC MODE, C = 300 pF, 25°C)
1
0.9
0.8
3.3KΩ
Freq (MHz)
0.7
0.6
5.1KΩ
0.5
0.4
10KΩ (F7x)
10KΩ
0.3
0.2
0.1
100KΩ
0
2.5
3
3.5
4
4.5
5
5.5
V D D (V)
© 2006 Microchip Technology Inc.
DS21995A-page 5
NOTES:
DS21995A-page 6
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
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© 2006 Microchip Technology Inc.
DS21995A-page 7
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DS21995A-page 8
© 2006 Microchip Technology Inc.