PIC18F2420/2520/4420/4520 PIC18F2420/2520/4420/4520 Rev. B4 Silicon Errata The PIC18F2420/2520/4420/4520 Rev. B4 parts you have received conform functionally to the Device Data Sheet (DS39631E), except for the anomalies described below. Any Data Sheet Clarification issues related to the PIC18F2420/2520/4420/4520 will be reported in a separate Data Sheet errata. Please check the Microchip web site for any existing issues. The following silicon errata apply only to PIC18F2420/2520/4420/4520 devices with these Device/Revision IDs: Part Number Device ID Revision ID PIC18F2420 0001 0001 010 0 0111 PIC18F2520 0001 0001 000 0 0111 PIC18F4420 0001 0000 110 0 0111 PIC18F4520 0001 0000 100 0 0111 The Device IDs (DEVID1 and DEVID2) are located at addresses 3FFFFEh:3FFFFFh in the device’s configuration space. They are shown in binary in the format “DEVID2 DEVID1”. All of the issues listed here will be addressed in future revisions of the PIC18F2420/2520/4420/4520 silicon. 1. Module: MSSP When the SPI is using Timer2/2 as the clock source, a shorter than expected SCK pulse may occur on the first bit of the transmitted/received data (Figure 1). FIGURE 1: SCK PULSE VARIATION USING TIMER2/2 Write SSPBUF bit 0 = 1 bit 1 = 0 The updated specification is shown in bold in Table 1. Work around None. bit 2 = 1 . . . . SDO SCK Work around To avoid producing the short pulse, turn off Timer2 and clear the TMR2 register, load the SSPBUF with the data to transmit and then turn Timer2 back on. Refer to Example 1 for sample code. EXAMPLE 1: In SPI Slave mode with slave select enabled (SSPM<3:0> = 0100), the minimum time between the falling edge of the SS pin and first SCK edge is greater than specified in parameter 70 in Table 26-16 and Table 26-17 of the above referenced data sheet. AVOIDING THE INITIAL SHORT SCK PULSE LOOP BTFSS SSPSTAT, BF BRA MOVF MOVWF MOVF BCF CLRF MOVWF BSF LOOP SSPBUF, W RXDATA TXDATA, W T2CON, TMR2ON TMR2 SSPBUF T2CON, TMR2ON ;Data received? ;(Xmit complete?) ;No ;W = SSPBUF ;Save in user RAM ;W = TXDATA ;Timer2 off ;Clear Timer2 ;Xmit New data ;Timer2 on Date Codes that pertain to this issue: Date Codes that pertain to this issue: All engineering and production devices. All engineering and production devices. TABLE 1: Param No. 70 2. Module: MSSP (SPI Mode) EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING) Symbol Characteristic TSSL2SCH, SS to SCK or SCK Input TSSL2SCL 2009 Microchip Technology Inc. Min 3 TCY Max Units Conditions — ns DS80363C-page 1 PIC18F2420/2520/4420/4520 3. Module: Enhanced Universal Synchronous Receiver Transmitter (EUSART) Register 18-3, on page 204, will be changed as shown. Work around One bit has been added to the BAUDCON register and one bit has been renamed. The added bit is RXDTP and is in the location, BAUDCON<5>. The renamed bit is the TXCKP bit (BAUDCON<4>), which had been named SCKP. None required. Date Codes that pertain to this issue: All engineering and production devices. The TXCKP (BAUDCON<4>) and RXDTP (BAUDCON<5>) bits enable the TX and RX signals to be inverted (polarity reversed). REGISTER 18-3: BAUDCON: BAUD RATE CONTROL REGISTER R/W-0 R-1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ABDOVF: Auto-Baud Acquisition Rollover Status bit 1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode (must be cleared in software) 0 = No BRG rollover has occurred bit 6 RCIDL: Receive Operation Idle Status bit 1 = Receive operation is Idle 0 = Receive operation is Active bit 5 RXDTP: Receive Data Polarity Select bit Asynchronous mode: 1 = Receive data (RX) is inverted. Idle state is a low level. 0 = No inversion of receive data (RX). Idle state is a high level. Synchronous mode: 1 = Data (DT) is inverted. Idle state is a low level. 0 = No inversion of data (DT). Idle state is a high level. bit 4 TXCKP: Transmit/Clock Polarity Select bit Asynchronous mode: 1 = Transmit data (TX) is inverted. Idle state is a low level. 0 = No inversion of transmit data (TX). Idle state is a high level. Synchronous mode: 1 = Idle state for clock (CK) is a high level 0 = Idle state for clock (CK) is a low level bit 3 BRG16: 16-bit Baud Rate Register Enable bit 1 = 16-bit Baud Rate Generator – SPBRGH and SPBRG 0 = 8-bit Baud Rate Generator – SPBRG only (Compatible mode); SPBRGH value ignored bit 2 Unimplemented: Read as ‘0’ DS80363C-page 2 2009 Microchip Technology Inc. PIC18F2420/2520/4420/4520 REGISTER 18-3: BAUDCON: BAUD RATE CONTROL REGISTER (CONTINUED) bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = EUSART will continue to sample the RX pin with the interrupt generated on the falling edge; bit cleared in hardware on following rising edge 0 = RX pin is not monitored or rising edge detected Synchronous mode: Unused in this mode. bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Enable baud rate measurement on the next character. Requires reception of a Sync field (55h); cleared in hardware upon completion. 0 = Baud rate measurement disabled or completed Synchronous mode: Unused in this mode. 4. Module: 10-Bit Analog-to-Digital Converter When the AD clock source is selected as 2 TOSC or RC (when ADCS<2:0> = 000 or x11), in extremely rare cases, the EIL (Integral Linearity Error) and EDL (Differential Linearity Error) may exceed the data sheet specification at codes 511 and 512 only. Work around 6. Module: Enhanced Capture/Compare/ PWM (ECCP) With the ECCP configured for Half-Bridge PWM mode (CCP1M<3:0> = 1110), the output may be corrupted for particular duty cycle selections. Affected duty cycle values are 0 though 3, and every subsequent increment of 4 (i.e., 7, 11, 15, 19, etc.). Select the AD clock source as 4 TOSC, 8 TOSC, 16 TOSC, 32 TOSC or 64 TOSC and avoid selecting 2 TOSC or RC. Work around Date Codes that pertain to this issue: All engineering and production devices. None. Date Codes that pertain to this issue: All engineering and production devices. 5. Module: MSSP With MSSP in SPI Master mode, FOSC/64 or Timer2/2 clock rate, and CKE = 0, a write collision may occur if SSPBUF is loaded immediately after the transfer is complete. A delay may be required after the MSSP Interrupt Flag bit, SSPIF, is set or the Buffer Full bit, BF, is set and before writing SSPBUF. If the delay is insufficiently short, a write collision may occur as indicated by the WCOL bit being set. Work around Add a software delay of one SCK period after detecting the completed transfer and prior to updating the SSPBUF contents. Verify the WCOL bit is clear after writing SSPBUF. If the WCOL is set, clear the bit in software and rewrite the SSPBUF register. Date Codes that pertain to this issue: All engineering and production devices. 2009 Microchip Technology Inc. DS80363C-page 3 PIC18F2420/2520/4420/4520 7. Module: Resets (BOR) An unexpected Reset may occur if the Brown-out Reset module (BOR) is disabled, and then reenabled, when the High/Low-Voltage Detection module (HLVD) is not enabled (HLVDCON<4> = 0). 8. Module: Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) In rare situations when interrupts are enabled, unexpected results may occur if: This issue affects BOR modes: BOREN<1:0> = 10 and BOREN<1:0> = 01. In both of these modes, if the BOR module is re-enabled while the device is active, unexpected Resets may be generated. • The EUSART is disabled (the SPEN bit, RCSTA <7>, = 0) • The EUSART is re-enabled (RCSTA <7> = 1) • A two-cycle instruction is executed Work around If BOR is required, and power consumption is not an issue, use BOREN<1:0> = 11. For BOREN<1:0> = 10 mode, either switch to BOREN<1:0> = 11 mode or enable the HLVD (HLVDCON<4> = 1) prior to entering Sleep. If power consumption is an issue and low power is desired, Microchip does not recommend using BOREN<1:0> = 10 mode. Instead, use BOREN<1:0> = 01 and follow the steps below when entering and exiting Sleep. 1. 2. 3. 4. 5. 6. Disable BOR by clearing SBOREN (RCON<6> = 0). Enter Sleep mode (if desired). After exiting Sleep mode, enable the HLVD (HLVDCON<4> = 1). Wait for the internal reference voltage (TIRVST) to stabilize (typically 20 s). Re-enable BOR by setting SBOREN (RCON<6> = 1). Disable the HLVD by clearing HLVDEN (HLVDCON<4> = 0). Date Codes that pertain to this issue: All engineering and production devices. Work around Add a 2-TCY delay after re-enabling the EUSART. 1. 2. 3. 4. Disable Receive Interrupts (RCIE bit, PIE1<5>, = 0). Disable the EUSART (RCSTA <7>, = 0). Re-enable the EUSART (RCSTA <7> = 1). Re-enable Receive Interrupts (PIE1<5> = 1). (This is the first TCY delay.) 5. Execute a NOP instruction. (This is the second TCY delay.) Date Codes that pertain to this issue: All engineering and production devices. 9. Module: Master Synchronous Serial Port (MSSP) When configured for I2C™ slave reception, the MSSP module may not receive the correct data, in extremely rare cases. This occurs only if the Serial Receive/Transmit Buffer Register (SSPBUF) is not read after the SSPIF interrupt (PIR1<3>) has occurred, but before the first rising clock edge of the next byte being received. Work around The issue can be resolved in either of these ways: • Prior to the I2C slave reception, enable the clock stretching feature. This is done by (SSPCON2<0>). setting the SEN bit • Each time the SSPIF is set, read the SSPBUF before the first rising clock edge of the next byte being received. Date Codes that pertain to this issue: All engineering and production devices. DS80363C-page 4 2009 Microchip Technology Inc. PIC18F2420/2520/4420/4520 REVISION HISTORY Rev A Document (1/2008) Initial release of this document. Includes silicon issues 1 (MSSP), 2 (MSSP – SPI Mode), 3 (Enhanced Universal Synchronous Receiver Transmitter – EUSART) and 4 (10-Bit Analog-to-Digital Converter). Rev B Document (10/2008) Added silicon issues 5 (MSSP), 6 (Enhanced Capture/ Compare/PWM – ECCP) and 7 (Resets – BOR). Rev C Document (8/2009) Added silicon issues 8 (EUSART) and 9 (MSSP). 2009 Microchip Technology Inc. DS80363C-page 5 PIC18F2420/2520/4420/4520 NOTES: DS80363C-page 6 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2009 Microchip Technology Inc. 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