NLU2G17 D

NLU2G17
Dual Non-Inverting
Schmitt-Trigger Buffer
The NLU2G17 MiniGatet is an advanced high−speed CMOS dual
non−inverting Schmitt−trigger buffer in ultra−small footprint.
The NLU2G17 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
The NLU2G17 can be used to enhance noise immunity or to square
up slowly changing waveforms.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
IN A1
1
6
OUT Y1
GND
2
5
VCC
3
1
1
OUT Y2
4
OUT Y1
IN A2
1
OUT Y2
AM
ULLGA6
1.2 x 1.0
CASE 613AE
AM
ULLGA6
1.45 x 1.0
CASE 613AF
AM
UDFN6
1.0 x 1.0
CASE 517BX
M
1
UDFN6
1.45 x 1.0
CASE 517AQ
R
IN A1
ULLGA6
1.0 x 1.0
CASE 613AD
5
Figure 1. Pinout (Top View)
1
AM
1
1
IN A2
UDFN6
1.2 x 1.0
CASE 517AA
M
1
M
Figure 2. Logic Symbol
= Date Code
PIN ASSIGNMENT
IN A1
ORDERING INFORMATION
2
1
GND
3
IN A2
See detailed ordering and shipping information on page 4 of
this data sheet.
4
OUT Y2
A
Y
5
VCC
6
OUT Y1
L
H
L
H
© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. 8
FUNCTION TABLE
1
Publication Order Number:
NLU2G17/D
NLU2G17
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
UL 94 V−0 @ 0.125 in
Latchup Performance Above VCC and Below GND at 125°C (Note 2)
mA
±500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
VOUT
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
5.5
V
−55
+125
°C
0
0
No Limit
No Limit
ns/V
NLU2G17
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Conditions
TA = +855C
TA = 25 5C
VCC
(V)
Min
Typ
Max
2.0
3.0
3.6
2.2
3.15
3.85
Min
VT+
Positive
Threshold
Voltage
3.0
4.5
5.5
VT−
Negative
Threshold
Voltage
3.0
4.5
5.5
0.9
1.35
1.65
1.5
2.3
2.9
1.65
2.46
3.05
0.9
1.35
1.65
VH
Hysteresis
Voltage
3.0
4.5
5.5
0.30
0.40
0.50
0.57
0.67
0.74
1.20
1.40
1.60
0.30
0.40
0.50
VOH
Minimum
High−Level
Output
Voltage
VIN w VT+MAX
IOH = −50 mA
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
VIN w VT+MAX
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
VIN v VT−MIN
IOL = 50 mA
2.0
3.0
4.5
VIN v VT−MIN
IOL = 4 mA
IOL = 8 mA
VOL
Maximum
Low−Level
Output
Voltage
0
0
0
Max
TA = −555C to
+1255C
Min
2.2
3.15
3.85
Max
Unit
2.2
3.15
3.85
V
0.9
1.35
1.65
1.20
1.40
1.60
0.30
0.40
0.50
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
V
1.20
1.40
1.60
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
IIN
Input
Leakage
Current
0 v VIN v 5.5 V
0 to
5.5
±0.1
±1.0
±1.0
mA
ICC
Quiescent
Supply
Current
VIN = 5.5 V or
GND
5.5
1.0
10
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPLH,
tPHL
Parameter
Propagation Delay,
Input A to Output Y
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 3)
VCC
(V)
Test
Condition
TA = +855C
TA = 25 5C
Min
Typ
Max
Min
TA = −555C to
+1255C
Max
Min
Max
Unit
ns
3.0 to
3.6
CL = 15 pF
7.0
12.8
1.0
15
1.0
17
CL = 50 pF
8.5
16.3
1.0
18.5
1.0
20.5
4.5 to
5.5
CL = 15 pF
4.0
8.6
1.0
10
1.0
11.5
CL = 50 pF
5.5
10.6
1.0
12
1.0
13.5
5.0
10
5.0
7.0
10
10
pF
pF
3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLU2G17
50%
RL
GND
tPLH
OUTPUT
INPUT
VCC
A or B
CL
tPHL
Y
50% VCC
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 4. Test Circuit
Figure 3. Switching Waveforms
VH
VCC
VT+
VT−
VIN
VCC
VH
VT+
VT−
VIN
GND
GND
VOH
VOH
VOUT
Vout
VOL
VOL
(a) A Schmitt−Trigger Squares Up Inputs With Slow Rise and Fall Times
(b) A Schmitt−Trigger Offers Maximum Noise Immunity
Figure 5. Typical Schmitt−Trigger Applications
ORDERING INFORMATION
Package
Shipping†
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLU2G17AMX1TCG
ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLU2G17BMX1TCG
ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLU2G17CMX1TCG
ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
NLU2G17AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLU2G17CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
NLU2G17MUTCG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU2G17
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
PIN ONE
REFERENCE
0.10 C
L1
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
A1
SIDE VIEW
MOLD CMPD
OPTIONAL
CONSTRUCTIONS
A
0.05 C
DIM
A
A1
A2
b
D
E
e
L
L1
DETAIL B
0.05 C
6X
A2
6X
C
6X
SEATING
PLANE
0.30
PACKAGE
OUTLINE
L
1.24
3
1
DETAIL A
6X
0.53
4
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
e
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
L
L
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
NLU2G17
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
NLU2G17
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE C
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
ÉÉ
L1
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
A3
DETAIL B
Side View
(Optional)
5X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
6X
0.42
C
A1
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOLD CMPD
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
http://onsemi.com
7
NLU2G17
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
C
A1
e
5X
L
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
5X
0.48
NOTE 4
3
1
6X
0.22
1.18
L1
0.53
6
4
6X
b
0.35
PITCH
DIMENSIONS: MILLIMETERS
0.10 C A B
BOTTOM VIEW
1
PKG
OUTLINE
0.05 C
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
NLU2G17
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE
ISSUE A
PIN ONE
REFERENCE
0.10 C
ÉÉ
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.05 C
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
C
A1
e
5X
L
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.35
0.45
5X
0.49
NOTE 4
3
1
1.24
L1
0.53
6
4
6X
b
0.10 C A B
BOTTOM VIEW
6X
0.26
0.05 C
NOTE 3
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
NLU2G17
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
PIN ONE
REFERENCE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
b
D
E
e
L
L1
TOP VIEW
0.10 C
0.05 C
A
6X
0.05 C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
SEATING
PLANE
SIDE VIEW
5X
C
A1
e
5X
L
MILLIMETERS
MIN
MAX
−−−
0.40
0.00
0.05
0.15
0.25
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
0.49
NOTE 4
3
1
1.24
L1
0.53
6
4
BOTTOM VIEW
6X
0.30
6X
b
0.10 C A B
0.05 C
NOTE 3
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
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NLU2G17/D