Download Datasheet

TS882
TS884
Rail-to-rail 1.1 V dual and quad nanopower comparators
Datasheet - production data
• Quad version available in SO14, TSSOP14
and QFN16 3 x 3 mm package
Related product
DFN8 (2 x 2 mm)
• See the TS881 datasheet for single operator
with smaller package.
MiniSO8
Applications
• Portable systems
• Signal conditioning
• Medical
SO14
TSSOP14
Description
QFN16 (3 x 3 mm)
Features
• Ultra-low current consumption: 220 nA typ./op.
• Propagation delay: 2 µs typ.
• Rail-to-rail inputs
The TS882 is a dual and the TS884 device a
quad comparator featuring ultra-low supply
current (220 nA typical per operator with output
high, VCC = 1.2 V, no load) with rail-to-rail input
and output capability. The performance of these
comparators allows them to be used in a wide
range of portable applications. The TS882 and
TS884 devices minimize battery supply leakage
and therefore enhance battery lifetime.
Operating from 1.1 to 5.5 V supply voltage, these
comparators can be used over a wide
temperature range (-40 to +125 °C) keeping the
current consumption at an ultra-low level.
• Push-pull outputs
• Supply operation from 1.1 V to 5.5 V
• Wide temperature range: -40 to +125 °C
• ESD tolerance: 8 kV HBM / 300 V MM
• Dual version available in MiniSO8 and DFN8
(2 x 2 mm) package
Table 1. Device summary
Order codes
Temperature range
TS882IST
Packages
Packaging
MiniSO8
-40 to +125 °C
Marking
K514
Tape and reel
TS882IQ2T
DFN8 2 x 2 mm
K56
TS884IDT
SO14
S884I
TS884IPT
-40 to +125 °C
TS884IQ4T
July 2014
This is information on a product in full production.
TSSOP14
QFN16 3 x 3 mm
DocID024119 Rev 3
Tape and reel
S884I
K514
1/26
www.st.com
Contents
TS882, TS884
Contents
1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5
2/26
4.1
DFN8 2 x 2 mm package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 17
4.2
MiniSO8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.3
SO14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.4
QFN16 3 x 3 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.5
TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DocID024119 Rev 3
TS882, TS884
1
Pin description
Pin description
Figure 1. Pin connections TS882 (top view)
TS882IDT/IST/IQ2T
MiniSO8/DFN8
Figure 2. Pin connections TS884 (top view)
SO14 / TSSOP14
287 287
,1
,1
,1
,1
9&&
9&&
1&
1&
,1
,1
,1
,1
287 287
QFN16
DocID024119 Rev 3
3/26
26
Absolute maximum ratings and operating conditions
2
TS882, TS884
Absolute maximum ratings and operating conditions
Table 2. Absolute maximum ratings
Symbol
VCC
Parameter
Value
Unit
6
V
±6
V
(VCC-) - 0.3 to (VCC+) + 0.3
V
Supply voltage(1)
VID
Differential input voltage
VIN
Input voltage range
(2)
Thermal resistance junction to ambient (TS882)(3)
MiniSO8
DFN8 2 x 2 mm
RTHJA
190
57
Thermal resistance junction to ambient (TS884)(3)
SO14
TSSOP14
QFN16 3 x 3 mm
°C/W
105
100
45
TSTG
Storage temperature
-65 to +150
°C
TJ
Junction temperature
150
°C
Lead temperature (soldering 10 seconds)
260
°C
8
kV
TLEAD
Human body model
ESD
Machine model
(HBM)(4)
(MM)(5)
300
V
Charged device model (CDM)(6)
1300
Latch-up immunity
200
mA
1. All voltage values, except differential voltages, are referenced to VCC-. VCC is defined as the difference
between VCC+ and VCC-.
2. The magnitude of input and output voltages must never exceed the supply rail ±0.3 V.
3. Short-circuits can cause excessive heating. These values are typical.
4. According to JEDEC standard JESD22-A114F.
5. According to JEDEC standard JESD22-A115A.
6. According to ANSI/ESD STM5.3.1.
Table 3. Operating conditions
Symbol
4/26
Parameter
Toper
Operating temperature range
VCC
Supply voltage
-40 °C < Tamb < +125 °C
VICM
Common mode input voltage range
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
DocID024119 Rev 3
Value
Unit
-40 to +125
°C
1.1 to 5.5
(VCC-) - 0.2 to (VCC+) + 0.2
(VCC-) to (VCC+) + 0.2
V
V
TS882, TS884
3
Electrical characteristics
Electrical characteristics
Table 4. VCC = +1.2 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1)
Symbol
Parameter
Test conditions
Input offset voltage(2)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
Input offset voltage drift
-40 °C < Tamb < +125 °C
Input hysteresis voltage(3)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
IIO
Input offset current(4)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
IIB
Input bias current(4)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
VIO
∆VIO
VHYST
ICC
6
3
4.2
1
220
1.0
1.7
Isource = 0.2 mA
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
VOL
Output voltage low
Isink = 0.2 mA
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
Common mode rejection ratio
0 < VICM < VCC
-40 °C < Tamb < +125 °C
f = 1 kHz, CL = 30 pF, RL = 1 MΩ
Overdrive = 10 mV
-40 °C < Tamb < +125 °C
Overdrive = 100 mV
-40 °C < Tamb < +125 °C
Propagation delay
(high to low)
Rise time (10% to 90%)
mV
mV
10
100
pA
10
100
pA
450
nA
Output voltage high
Propagation delay
(low to high)
Unit
µV/°C
2.4
1.5
No load, output high, VID = +0.1 V
-40 °C < Tamb < +125 °C
VOH
TR
-6
Supply current per operator
Source
Sink
TPHL
Max.
1
300
Short-circuit current
TPLH
Typ.
No load, output low, VID = -0.1 V
-40 °C < Tamb < +125 °C
ISC
CMRR
Min.
f = 1 kHz, CL = 30 pF, RL = 1 MΩ
Overdrive = 10 mV
-40 °C < Tamb < +125 °C
350
1.13
1.10
1.00
1.15
V
35
50
60
70
68
5.5
11
13
2.1
3.1
3.4
5.1
8
10
1.9
CL = 30 pF, RL = 1 MΩ
100
mV
dB
50
Overdrive = 100 mV
-40 °C < Tamb < +125 °C
DocID024119 Rev 3
mA
µs
µs
2.6
3.1
ns
5/26
26
Electrical characteristics
TS882, TS884
Table 4. VCC = +1.2 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1) (continued)
Symbol
TF
TON
Parameter
Fall time (90% to 10%)
Test conditions
CL = 30 pF, RL = 1 MΩ
Power-up time
Min.
Typ.
Max.
110
1.1
Unit
ns
1.7
ms
1. All values over the temperature range are guaranteed through correlation and simulation. No production test is performed
at the temperature range limits.
2. The offset is defined as the average value of positive and negative trip points (input voltage differences requested to
change the output state in each direction).
3. The hysteresis is a built-in feature of the TS882 device. It is defined as the voltage difference between the trip points.
4. Maximum values include unavoidable inaccuracies of the industrial tests.
6/26
DocID024119 Rev 3
TS882, TS884
Electrical characteristics
Table 5. VCC = +2.7 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1)
Symbol
Parameter
Test conditions
Input offset voltage(2)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
Input offset voltage drift
-40 °C < Tamb < +125 °C
Input hysteresis voltage(3)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
IIO
Input offset current(4)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
IIB
Input bias current(4)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
VIO
∆VIO
VHYST
ICC
-6
6
3
2.7
1.6
4.2
1
No load, output high, VID = +0.1 V
-40 °C < Tamb < +125 °C
220
10
13
Output voltage high
Isource = 2 mA
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
VOL
Output voltage low
Isink = 2 mA
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
Common mode rejection ratio
0 < VICM < VCC
-40 °C < Tamb < +125 °C
f = 1 kHz, CL = 30 pF, RL = 1 MΩ
Overdrive = 10 mV
-40 °C < Tamb < +125 °C
Overdrive = 100 mV
-40 °C < Tamb < +125 °C
Propagation delay
(high to low)
mV
mV
10
100
pA
10
100
pA
450
nA
VOH
Propagation delay
(low to high)
Unit
µV/°C
Supply current per operator
Source
Sink
TPHL
Max.
1
310
Short-circuit current
TPLH
Typ.
No load, output low, VID = -0.1 V
-40 °C < Tamb < +125 °C
ISC
CMRR
Min.
f = 1 kHz, CL = 30 pF, RL = 1 MΩ
Overdrive = 10 mV
-40 °C < Tamb < +125 °C
350
2.48
2.40
2.10
mA
2.51
V
130
210
230
310
74
dB
55
6.4
12
14
2.3
3.0
3.7
6.4
12
14
Overdrive = 100 mV
-40 °C < Tamb < +125 °C
2.2
mV
µs
µs
3.0
3.7
TR
Rise time (10% to 90%)
CL = 30 pF, RL = 1 MΩ
120
ns
TF
Fall time (90% to 10%)
CL = 30 pF, RL = 1 MΩ
130
ns
TON
Power-up time
1.1
1.7
ms
1. All values over the temperature range are guaranteed through correlation and simulation. No production test is performed
at the temperature range limits.
2. The offset is defined as the average value of positive and negative trip points (input voltage differences requested to
change the output state in each direction).
3. The hysteresis is a built-in feature of the TS882. It is defined as the voltage difference between the trip points.
4. Maximum values include unavoidable inaccuracies of the industrial tests.
DocID024119 Rev 3
7/26
26
Electrical characteristics
TS882, TS884
Table 6. VCC = +5 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1)
Symbol
Parameter
Test conditions
Input offset voltage(2)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
Input offset voltage drift
-40 °C < Tamb < +125 °C
Input hysteresis voltage(3)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
IIO
Input offset current(4)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
IIB
Input bias current(4)
Tamb = +25 °C
-40 °C < Tamb < +125 °C
VIO
∆VIO
VHYST
ICC
Min.
-6
No load, output low, VID = -0.1 V
-40 °C < Tamb < +125 °C
350
No load, output high, VID = +0.1 V
-40 °C < Tamb < +125 °C
250
32
32
Output voltage low
Isink = 2 mA
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
Common mode rejection ratio
0 < VICM < VCC
-40 °C < Tamb < +125 °C
55
Supply voltage rejection
∆VCC = 1.2 V to 5 V
-40 °C < Tamb < +125 °C
65
f = 1 kHz, CL = 30 pF, RL = 1 MΩ
Overdrive = 10 mV
-40 °C < Tamb < +125 °C
Overdrive = 100 mV
-40 °C < Tamb < +125 °C
8/26
10
100
pA
400
VOL
TR
pA
nA
Isource = 2 mA
-40 °C < Tamb < +85 °C
-40 °C < Tamb < +125 °C
Propagation delay
(high to low)
Rise time (10% to 90%)
mV
500
Output voltage high
Propagation delay
(low to high)
mV
10
100
Supply current per operator
VOH
TPHL
4.2
1
Unit
µV/°C
3.1
1.6
Source
Sink
TPLH
6
3
Short-circuit current
SVR
Max.
1
ISC
CMRR
Typ.
f = 1 kHz, CL = 30 pF, RL = 1 MΩ
Overdrive = 10 mV
-40 °C < Tamb < +125 °C
4.86
4.75
4.60
4.88
V
90
130
170
280
78
8.3
dB
13
22
2.5
3.4
4.1
9.0
16
19
2.6
CL = 30 pF, RL = 1 MΩ
160
mV
dB
80
Overdrive = 100 mV
-40 °C < Tamb < +125 °C
DocID024119 Rev 3
mA
µs
µs
3.5
4.2
ns
TS882, TS884
Electrical characteristics
Table 6. VCC = +5 V, Tamb = +25 °C, VICM = VCC/2 (unless otherwise specified)(1) (continued)
Symbol
TF
TON
Parameter
Fall time (90% to 10%)
Test conditions
CL = 30 pF, RL = 1 MΩ
Power-up time
Min.
Typ.
Max.
150
1.1
Unit
ns
1.7
ms
1. All values over the temperature range are guaranteed through correlation and simulation. No production test is performed
at the temperature range limits.
2. The offset is defined as the average value of positive and negative trip points (input voltage differences requested to
change the output state in each direction).
3. The hysteresis is a built-in feature of the TS882 device. It is defined as the voltage difference between the trip points.
4. Maximum values include unavoidable inaccuracies of the industrial tests.
DocID024119 Rev 3
9/26
26
Electrical characteristics
TS882, TS884
Figure 3. Current consumption per operator vs. Figure 4.
supply voltage - output low
Current consumption per operator
vs. supply voltage - output high
Figure 5.
Current consumption per operator
vs. input common mode voltage at
VCC = 1.2 V
Figure 6.
Current consumption per operator
vs. input common mode voltage at
VCC = 5 V
Figure 7.
Current consumption per operator
vs. temperature
Figure 8.
Current consumption per operator
vs. toggle frequency
10/26
DocID024119 Rev 3
TS882, TS884
Figure 9.
Electrical characteristics
Input offset voltage vs. input
common mode voltage at
VCC = 1.2 V
Figure 10. Input hysteresis voltage vs. input
common mode voltage at
VCC = 1.2 V
Figure 12. Input hysteresis voltage vs. input
Figure 11. Input offset voltage vs. input
common mode voltage at VCC = 5 V
common mode voltage at VCC = 5 V
Figure 13. Input offset voltage vs. temperature Figure 14. Input hysteresis voltage vs.
temperature
DocID024119 Rev 3
11/26
26
Electrical characteristics
TS882, TS884
Figure 15. Output voltage drop vs. sink current Figure 16. Output voltage drop vs. source
at VCC = 1.2 V
current at VCC = 1.2 V
Figure 17. Output voltage drop vs. sink current Figure 18. Output voltage drop vs. source
at VCC = 2.7 V
current at VCC = 2.7 V
Figure 19. Output voltage drop vs. sink current Figure 20. Output voltage drop vs. source
at VCC = 5 V
current at VCC = 5 V
12/26
DocID024119 Rev 3
TS882, TS884
Electrical characteristics
Figure 21. Propagation delay TPLH vs. input
Figure 22. Propagation delay TPHL vs. input
common mode voltage at VCC = 1.2 V
common mode voltage at VCC = 1.2 V
Figure 23. Propagation delay TPLH vs. input
Figure 24. Propagation delay TPHL vs. input
common mode voltage at VCC = 5 V
common mode voltage at VCC = 5 V
Figure 25. Propagation delay TPLH vs. input
signal overdrive at VCC = 1.2 V
Figure 26. Propagation delay TPHL vs. input
signal overdrive at VCC = 1.2 V
DocID024119 Rev 3
13/26
26
Electrical characteristics
TS882, TS884
Figure 27. Propagation delay TPLH vs. input
signal overdrive at VCC = 5 V
Figure 28. Propagation delay TPHL vs. input
signal overdrive at VCC = 5 V
Figure 29. Propagation delay TPLH vs. supply
voltage for signal overdrive 10 mV
Figure 30. Propagation delay TPHL vs. supply
voltage for signal overdrive 10 mV
Figure 31. Propagation delay TPLH vs. supply
voltage for signal overdrive 100 mV
14/26
Figure 32. Propagation delay TPHL vs. supply
voltage for signal overdrive 100 mV
DocID024119 Rev 3
TS882, TS884
Electrical characteristics
Figure 33. Propagation delay vs. temperature
for signal overdrive 10 mV
929 P9
9,&0 9&&
73/+
9&& 9
Figure 34. Propagation delay vs. temperature
for signal overdrive 100 mV
929 P9
9,&0 9&&
73+/
9&& 9
73
73
73/+
9&& 9
73+/
9&& 9
73/+
9&& 9
73+/
9&& 9
73/+
9&& 9
$0
DocID024119 Rev 3
73+/
9&& 9
$0
15/26
26
Package information
4
TS882, TS884
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
16/26
DocID024119 Rev 3
TS882, TS884
4.1
Package information
DFN8 2 x 2 mm package mechanical data
Figure 35. DFN8 2 x 2 mm package outline
4&"5*/( $
1-"/&
EEE
"
"
$
"
%
F
1*/*%
&
&
C
%
Table 7. DFN8 2 x 2 mm package mechanical data (pitch 0.5 mm)
Dimensions
Symbol
A
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
0.51
0.55
0.60
0.020
0.022
0.024
A1
0.05
A3
0.002
0.15
0.006
b
0.18
0.25
0.30
0.007
0.010
0.012
D
1.85
2.00
2.15
0.073
0.079
0.085
D2
1.45
1.60
1.70
0.057
0.063
0.067
E
1.85
2.00
2.15
0.073
0.079
0.085
E2
0.75
0.90
1.00
0.030
0.035
0.039
e
0.50
0.020
L
0.50
0.020
ddd
0.08
0.003
DocID024119 Rev 3
17/26
26
Package information
TS882, TS884
Figure 36. DFN8 2 x 2 mm footprint recommendation
PP
PP
PP
PP
PP
18/26
DocID024119 Rev 3
PP
TS882, TS884
4.2
Package information
MiniSO8 package information
Figure 37. MiniSO8 package outline
Table 8. MiniSO8 package mechanical data
Dimensions
Symbol
Millimeters
Min.
Typ.
A
Inches
Max.
Min.
Typ.
1.10
A1
0
A2
0.75
b
Max.
0.043
0.15
0
0.95
0.030
0.22
0.40
0.009
0.016
c
0.08
0.23
0.003
0.009
D
2.80
3.00
3.20
0.11
0.118
0.126
E
4.65
4.90
5.15
0.183
0.193
0.203
E1
2.80
3.00
3.10
0.11
0.118
0.122
e
L
0.85
0.65
0.40
0.60
0.006
0.033
0.026
0.80
0.016
0.024
L1
0.95
0.037
L2
0.25
0.010
k
ccc
0°
0.037
8°
0.10
DocID024119 Rev 3
0°
0.031
8°
0.004
19/26
26
Package information
4.3
TS882, TS884
SO14 package information
Figure 38. SO14 package outline
Table 9. SO14 package mechanical data
Dimensions(1)
Millimeters
Inches
Symbol
Note
Min.
Typ.
Max.
Min.
Typ.
Max.
A
1.35
1.75
0.05
0.068
A1
0.10
0.25
0.004
0.009
A2
1.10
1.65
0.04
0.06
B
0.33
0.51
0.01
0.02
C
0.19
0.25
0.007
0.009
D
8.55
8.75
0.33
0.34
E
3.80
4.0
0.15
0.15
e
1.27
0.05
H
5.80
6.20
0.22
0.24
L
0.40
1.27
0.015
0.05
k
0°
8°
0°
8°
ddd
(2)
0.10
0.004
1. Drawing dimensions include “Single” and “Matrix” versions.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm per side.
20/26
DocID024119 Rev 3
TS882, TS884
4.4
Package information
QFN16 3 x 3 package information
Figure 39. QFN16 3 x 3 mm (pitch 0.5 mm) package outline
6($7,1*
3/$1(
&
GGG&
$
$
$
'
3,1,'
& '
H
(
H
E
(
(
/
E
/
'
%277209,(:
DocID024119 Rev 3
21/26
26
Package information
TS882, TS884
Table 10. QFN16 3 x 3 mm (pitch 0.5 mm) package mechanical data
Dimensions
Symbol
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
0.80
0.90
1.00
0.031
0.035
0.039
A1
0.02
0.05
0.001
0.002
A3
0.20
A
0.008
b
0.18
0.25
0.30
0.007
0.010
0.012
D
2.85
3.00
3.15
0.112
0.118
0.124
D1
1.50
0.059
D2
See exposed pad variation
See exposed pad variation
E
2.85
3.00
3.15
0.112
0.118
0.124
E1
1.50
0.059
E2
See exposed pad variation
See exposed pad variation
e
0.45
0.50
0.55
0.018
0.020
0.022
L
0.30
0.40
0.50
0.012
0.016
0.020
ddd
22/26
Millimeters
0.08
DocID024119 Rev 3
0.003
TS882, TS884
Package information
Figure 40. QFN16 3 x 3 mm (pitch 0.5 mm) footprint recommendation
%
DocID024119 Rev 3
$
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26
Package information
4.5
TS882, TS884
TSSOP14 package information
Figure 41. TSSOP14 package outline
(
'
$ $ $
DDD&
E
F
6($7,1*
3/$1(
PP
*$*(3/$1(
&
(
3,1,'(17,),&$7,21
/
N
/
H
76623
Table 11. TSSOP14 package mechanical data
Dimensions
Symbol
Millimeters
Min.
Typ.
A
Max.
Min.
Typ.
1.20
A1
0.05
A2
0.80
b
Max.
0.047
0.15
0.002
0.004
0.006
1.05
0.031
0.039
0.041
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.0089
D
4.90
5.00
5.10
0.193
0.197
0.201
E
6.20
6.40
6.60
0.244
0.252
0.260
E1
4.30
4.40
4.50
0.169
0.173
0.176
e
L
k
aaa
1.00
0.65
0.45
L1
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Inches
0.60
0.0256
0.75
0.018
1.00
0°
0.024
0.030
0.039
8°
0.10
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0°
8°
0.004
TS882, TS884
5
Revision history
Revision history
Table 12. Document revision history
Date
Revision
Changes
18-Jan-2013
1
Initial release.
02-May-2013
2
Added TS884 device to header, Description, and Table 1: Device
summary.
Updated title (added “quad” comparator).
Updated Features and Table 2 (ESD tolerance: “6 kV” HBM replaced
by “8 kV” HBM).
Updated Description in accordance with added TS884 device.
Added SO14, TSSOP14 and QFN16 3 x 3 mm package to Features,
figure on page 1, Section 4: Package information. and Table 1:
Device summary.
Moved Figure 1: Pin connections TS882 (top view) to page 3.
Added Figure 2: Pin connections TS884 (top view).
Updated Table 2: Absolute maximum ratings (added TS884 device
RTHJA values).
Minor corrections throughout document.
14-Jul-2014
3
Updated Table 1: Device summary on page 1
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TS882, TS884
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