Data Sheet

NXQ1TXA5
One-chip 5 V Qi wireless transmitter
Rev. 1.2 — 10 September 2015
Product short data sheet
1. General description
The NXQ1TXA5 is a controller/driver IC for a 5 V Qi-certified/compliant low-power
wireless charger. It offers a fully integrated solution that includes a 5 V full-bridge power)
stage, as defined in Wireless Power Consortium (WPC) 5 V Qi standards A5, A11, A12
and A16.
The NXQ1TXA5 uses dedicated analog ping circuitry to detect devices, according to the
Qi standard, achieving extremely low standby power consumption. If a Qi-compliant
receiver is detected, the NXQ1TXA5 starts to communicate with it. If the receiver is
recognized, it safely initiates wireless power transfer from the transmitter to the receiver,
while monitoring for fault conditions such as overheating or interference from metal
objects. The device is optimized to operate from a USB power supply and uses Smart
Power Limiting (SPL) to adjust the output power automatically to compensate for
power-limited supplies. The device supports Foreign Object Detection (FOD).
LED outputs and a buzzer output are available for the user interface. The LED outputs
feature a number of blinking modes. Static Power Reduction (SPR) allows multiple
NXQ1TXA5-based transmitters to operate from a single USB power supply by limiting
power consumption per device.
The NXQ1TXA5 is available in a 5 mm  5 mm, 32-pin HVQFN package.
2. Features and benefits
 One-chip WPC 1.1.2 Qi-compliant device for A5/A11/A12/A16 5 V single-coil
low-power transmitter
 Operates from 5 V supply
 Integrated high-efficiency full-bridge power stage with low EMI radiation meeting
EN55022 radiated and conducted emission limits
 Very few external components required, minimizing cost and board space
 Extremely low-power receiver detection circuitry; standby power 10 mW (typical)
 Power stage fully protected against overcurrents and overtemperature
 Fully integrated accurate coil current measurement
 Demodulates and decodes communication packages from Qi-compliant receivers
 PID regulation for closed-loop power drive and control
 Internal 1.8 V digital supply generation
 LED (2) and buzzer outputs
 NTC input for external temperature check and protection
 On-chip thermal protection
 Small HVQFN 32-pin package (5  5 mm) with 0.5 mm pitch
NXQ1TXA5
NXP Semiconductors
One-chip 5 V Qi wireless transmitter
 FOD with automatic switching between V1.1 and V1.0 for legacy receiver support
 FOD levels can be adjusted using external resistors to compensate for application
differences to meet Qi certification requirements
 Smart Power Limiting (SPL) function to adapt to power-limited 5 V supplies
 Static Power Reduction (SPR) function to limit power consumption
 Supports Near Field Communication (NFC) TAG applications with delayed start-up
3. Applications
 Wireless Power Consortium (WPC) certified/compliant Qi wireless power transmitters
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDP
IDDP
power supply voltage
on pins VDDP1 and VDDP2
3.5
-
5.25
V
power supply current
on pins VDDP1 and VDDP2
Ping mode (average current)
-
2
2.8
mA
Power_Transfer mode (no load)
-
15
-
mA
Power_Transfer mode (with load)
-
-
5
A
5. Ordering information
Table 2.
Ordering information
Type number
NXQ1TXA5
Package
Name
Description
Version
HVQFN32
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5  5  0.85 mm
SOT617-3
5.1 Ordering options
Table 3.
Ordering options
Type number
Orderable part
number
Package
Packing method
Minimum
Temperature
ordering quantity
NXQ1TXA5
NXQ1TXA5/404J
HVQFN32
reel 7" Q1/T1,
*standard mark SMD
non-dry-pack
1500
NXQ1TXA5_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
Tamb = 20 C to +85 C
© NXP Semiconductors N.V. 2015. All rights reserved.
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NXP Semiconductors
One-chip 5 V Qi wireless transmitter
6. Block diagram
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NXQ1TXA5_SDS
Product short data sheet
Block diagram
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
7. Pinning information
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For enhanced thermal and electrical performance the exposed die-pad, and pins GNDP. GNDD
must be connected to top layer board ground, and exposed die-pad must also be connected to
bottom layer board ground with plated-through vias (see Section 12.4)
Fig 2.
Pin configuration
7.2 Pin description
Table 4.
NXQ1TXA5_SDS
Product short data sheet
Pin description[1]
Symbol
Pin
Type Description
SPR1
1
I
static power reduction 1
SPR2
2
I
static power reduction 2
SDA
3
I/O
I2C-bus data input/output; should be left open or grounded under
normal operating conditions (I2C-bus included for test purposes)
SCL
4
I
I2C-bus clock input; should be left open or grounded under normal
operating conditions (I2C-bus included for test purposes)
BUZZER
5
O
buzzer output
NFC_FD
6
I
NFC field detect input (active LOW)
LED_G
7
O
green LED output
LED_R
8
O
red LED output
FOD1
9
I
FOD level configuration
FOD2
10
I
FOD loss configuration 1
FOD3
11
I
FOD loss configuration 2
CONFIG
12
I
LED and buzzer configuration
NTC
13
I
temperature measurement using NTC
STBY
14
I
standby function; connect to ground when not used
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
Table 4.
Pin description[1] …continued
Symbol
Pin
VDDP2
15, 16 P
power supply pin 2
OUT2
17, 18 O
transmitter output 2
GNDP[1]
19, 20, P
21, 22
power ground
OUT1
23, 24 O
transmitter output 1
VDDP1
25, 26 P
power supply pin 1
GNDD[1]
27
P
digital ground
CDEC
28
P
decoupling connection for internal LDO
XTAL_IN
29
I
crystal input
XTAL_OUT 30
O
crystal output
TEST
31
I/O
test pin; connect to ground
NFC_DIS
32
O
NFC disable function
[1]
Type Description
For enhanced thermal and electrical performance, the exposed die-pad, and pins GNDP. GNDD must be
connected to top layer board ground. The exposed die-pad must also be connected to bottom layer board
ground with plated-through vias (see Section 12.4).
8. Functional description
8.1 Device operation
The NXQ1TXA5 is a 5 V wireless charger with an integrated full-bridge power stage. It
integrates all the functions required to control the power transfer between a
WPC-compliant Qi transmitter and a WPC-compliant Qi receiver efficiently. It can deliver
up to 8 W continuous power into the WPC-compliant Qi type A5, A11, A12 or A16
transmitter coil.
A block diagram of the NXQ1TXA5 is shown in Figure 1. It is operational when a 5 V
supply is connected and pin STBY is LOW. Internal 1.8 V biasing is activated and the
NXQ1TXA5 starts checking for a device on the transmitter base station. Power
consumption is extremely low (typically 10 mW) during this phase. When a device is
detected, the low-power DSP core starts up and sets up communications with the
detected device. Power transfer is initiated if the device is identified as a WPC-compliant
Qi receiver. The NXQ1TXA5 ensures that the correct power transfer level is maintained
with frequency and duty cycle control according to the WPC Qi specifications.
The power transfer can be monitored via the LED and BUZZER outputs. The external
temperature can be monitored via the NTC input to protect the application from
overheating when charging Qi-V1.0 receivers that do not support Foreign Object
Detection (FOD).
Additional inputs are provided to select the LED mode, configure FOD according to the
application design and coil/capacitor selection, set the SPR level and enable/disable SPL.
NXQ1TXA5_SDS
Product short data sheet
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Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
8.2 Protection mechanisms
The following protection circuits are included in the NXQ1TXA5:
•
•
•
•
OverTemperature Protection (OTP)
OverCurrent Protection (OCP)
Foreign Object Detection (FOD)
Negative Temperature Coefficient (NTC)
8.2.1 OverTemperature Protection (OTP)
8.2.1.1
Software OTP
A temperature protection circuit embedded in the NXQ1TXA5 keeps track of the
temperature inside the device. If the temperature exceeds 110 C, the output power is
limited to prevent the device from being damaged. Normal power transfer is resumed
when the temperature drops below 80 C.
8.2.1.2
Hardware OTP
Additional hardware OTP is triggered when the junction temperature exceeds the
temperature protection threshold of between 125 C and 140 C. When this happens, the
output stages are set floating. Because the software OTP mechanism reacts at lower
temperatures, it is expected that this additional hardware OTP is only triggered under
abnormal load conditions. It acts as an extra safety mechanism.
8.2.2 OverCurrent Protection (OCP)
In the NXQ1TXA5, the power stages are protected against excessive currents. If the
output current exceeds the maximum OCP threshold of 5 A, the output current is limited
by reversing the current in the output stage that is drawing excessive current.
8.2.3 Foreign Object Detection (FOD)
The NXQ1TXA5 features FOD functionality according to the Qi 1.1.2 standard. If the
received power level reported by the receiver is not in line with the transmitted power level
measured by the NXQ1TXA5, the NXQ1TXA5 switches to FOD mode.
If the difference between reported (as perceived by the receiver) and transmitted power
level is greater than the selected FOD threshold, the NXQ1TXA5 enters FOD mode. To
avoid the heating up of metal objects placed between the transmitter and the receiver,
power transfer is suspended in FOD mode.
NXQ1TXA5_SDS
Product short data sheet
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One-chip 5 V Qi wireless transmitter
8.2.4 Negative Temperature Coefficient (NTC)
The NTC input is used to monitor the voltage level on an external NTC resistor network.
The NXQ1TXA5 stops delivering power if the input level on the NTC input pin drops below
0.8 V and starts charging again when the level rises above 1.1 V again. The NXQ1TXA5
automatically compensates for variations in the 5 V supply.
If the NXQ1TXA5 detects a voltage level below 150 mV on the NTC input pin when
charging starts, the temperature sensing function via the NTC is disabled completely.
A standard NTC input resistor network does not reach levels below 150 mV for normal
operation. So, disabling the NTC temperature protection function can be done by
connecting the NTC input pin to ground. The NTC input pin can also be connected to
VDDP. As the sensing function then remains active and the input voltage level never
drops below 0.8 V, the NXQ1TXA5 power delivery is not stopped. Disabling the NTC
temperature sensing by connecting the NTC pin to ground is easier for a PCB layout.
The NTC input pin must always be connected to either the VDDP pin, ground, or the NTC
network. It must never be left floating.
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDDP
power supply voltage
on pin VDDP1 and
VDDP2
0.3
+6.0
V
Tj
junction temperature
-
150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
20
+85
C
VESD
electrostatic discharge voltage
Human Body Model
(HBM)
2
+2
kV
Charge Device Model
(CDM)
500
+500
V
10. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from
junction to ambient
2-layer application board positioned
horizontally in free air; dimensions
45 mm  45 mm  0.8 mm; natural
convection; copper coverage on each layer
> 95 %; copper thickness each layer 70 m
30
K/W
NXQ1TXA5_SDS
Product short data sheet
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Rev. 1.2 — 10 September 2015
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One-chip 5 V Qi wireless transmitter
11. Characteristics
Table 7.
DC characteristics
Tamb = 25 C, default settings unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDP
power supply voltage
on pin VDDP1 and VDDP
3.5
-
5.25
V
IDDP
power supply current
on pins VDDP1 and VDDP2:
Ping mode (peak current)
[1]
-
1
-
A
Ping mode (average current)
[1]
-
2
2.8
mA
-
2
30
A
Standby mode (STBY HIGH)
-
15
-
mA
Power_Transfer mode (average
current with load)
-
-
2
A
Power_Transfer mode (absolute
peak current with load)
-
-
5
A
Power_Transfer mode (no load)
[1]
[1]
Current consumption in the NXQ1TXA5_SDS; no external load connected between terminals OUT1 and OUT2.
Table 8.
AC characteristics
Tamb = 25 C, default settings unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Start-up and Power_Transfer modes
110
-
205
kHz
BTL power stage
fsw
switching frequency
fsw(step)
switching frequency step size Start-up and Power_Transfer modes
-
500
-
Hz

duty cycle
Start-up and Power_Transfer modes
0
-
50
%
step
duty cycle step size
Start-up and Power_Transfer modes
-
0.1
-
%
VIH
HIGH-level input voltage
Standby mode
1.2
-
VDDP
V
VIL
LOW-level input voltage
Operating mode
-
-
0.6
V
0
-
1.5
V
400
-
VDDP
mV
-
-
20
mA
400
-
VDDP
mV
-
-
20
mA
STBY pin
FOD1, FOD2, FOD3, CONFIG and NTC pins
input voltage
VI
operating range
[1]
LED_G, LED_R and NFC_DIS outputs
output voltage
VO
Iload
load current
set externally
open-drain output
[2]
BUZZER output
output voltage
VO
Iload
load current
set externally
open-drain output
[2]
NFC_FD, SPR1 and SPR2 pins
VIH
HIGH-level input voltage
1
1.8
VDDP
V
VIL
LOW-level input voltage
-
-
0.6
V
I2C
pins: SCL and SDA
VIH
HIGH-level input voltage
1
-
3.6
V
VIL
LOW-level input voltage
-
-
0.6
V
NXQ1TXA5_SDS
Product short data sheet
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Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
Table 8.
AC characteristics …continued
Tamb = 25 C, default settings unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
1.8
V
32
32.768
33.5
kHz
-
-
1
W
8
12
14
pF
Oscillator: pins XTAL_IN and XTAL_OUT
input voltage
VI
External crystal requirements
fnom
nominal frequency
DL
drive level
[3]
load capacitance
CL
[1]
The nominal operating range is from 0 V to 1.5 V. However, any level between 1.5 V and VDDP has the same effect (as 1.5 V).
[2]
The output voltage at maximum load current is guaranteed not to exceed 400 mV.
[3]
The load capacitors are embedded in the NXQ1TXA5_SDS.
12. Application information
12.1 Crystal oscillator
The NXQ1TXA5 uses an external low-cost 32.768 kHz crystal, with a 1 % accuracy. The
crystal should support a load capacitance of  12 pF (the load capacitance is embedded
in the NXQ1TXA5). Do not connect the crystal to the NXQ1TXA5 using vias, but directly
on the top layer of the PCB. If possible, shield the crystal by connecting the casing to
ground. The crystal is connected to the oscillator input pin (XTAL_IN) via a 2.2 pF series
capacitor.
12.2 Supply decoupling
Effective supply decoupling is required. The decoupling capacitors must to be chosen
such that the effective capacitance is at least 10 F at a DC bias voltage of 5.5 V and a
frequency of 205 kHz for each supply pin. To improve HF behavior and reduce EMI,
mount smaller (10 nF) high-quality capacitors in parallel with the larger capacitors.
12.3 Snubber network
Snubber RC networks are connected to outputs OUT1 and OUT2. Each snubber network
consists of a 6.8 nF capacitor in series with a 1  resistor to ground (see Figure 3).
12.4 Exposed die-pad ground and thermal connection
For optimal thermal and electrical performance, the device bottom exposed die-pad
MUST be soldered to a PCB solder land under the exposed die-pad. To have good
electrical contact and thermal flow from the device to the bottom copper layer, the PCB
solder land under the device MUST be connected with plated-through vias to the copper
bottom layer of the PCB. In this way, the PCB bottom copper layer can provide heat
sinking for the device dissipation.
In the NXQ1TXA5 application note examples are provided for recommended layouts with
good thermal and electrical performance.
NXQ1TXA5_SDS
Product short data sheet
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Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
12.5 Application diagram
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NXQ1TXA5 application diagram
NXQ1TXA5_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
13. Package outline
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NXQ1TXA5_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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One-chip 5 V Qi wireless transmitter
14. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NXQ1TXA5_SDS v.1.2
20150910
Product data sheet
-
NXQ1TXA5_SDS v.1.1
Modifications:
•
Section 13 “Package outline” has been updated.
NXQ1TXA5_SDS v.1.1
20150909
Product data sheet
-
NXQ1TXA5_SDS v.1
NXQ1TXA5_SDS v.1
20150730
Product data sheet
-
-
NXQ1TXA5_SDS
Product short data sheet
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Rev. 1.2 — 10 September 2015
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One-chip 5 V Qi wireless transmitter
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NXQ1TXA5_SDS
Product short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 10 September 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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17. Contents
1
2
3
4
5
5.1
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.1.1
8.2.1.2
8.2.2
8.2.3
8.2.4
9
10
11
12
12.1
12.2
12.3
12.4
12.5
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Device operation. . . . . . . . . . . . . . . . . . . . . . . . 5
Protection mechanisms . . . . . . . . . . . . . . . . . . 6
OverTemperature Protection (OTP) . . . . . . . . . 6
Software OTP . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Hardware OTP . . . . . . . . . . . . . . . . . . . . . . . . . 6
OverCurrent Protection (OCP) . . . . . . . . . . . . . 6
Foreign Object Detection (FOD) . . . . . . . . . . . . 6
Negative Temperature Coefficient (NTC) . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . . 9
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . 9
Supply decoupling . . . . . . . . . . . . . . . . . . . . . . 9
Snubber network . . . . . . . . . . . . . . . . . . . . . . . 9
Exposed die-pad ground and thermal
connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application diagram . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 September 2015
Document identifier: NXQ1TXA5_SDS