VISHAY DG3000DB

DG3000
Vishay Siliconix
Low-Voltage Single SPDT MICRO FOOTtAnalog Switch
FEATURES
BENEFITS
APPLICATIONS
D MICRO FOOT Chip Scale Package
(1.07 x 1.57 mm)
D Low Voltage Operation (1.8 V to 5.5 V)
D Low On-Resistance - rDS(on): 1.4 W
D Fast Switching - tON : 24 ns, tOFF: 9 ns
D Low Power Consumption
D TTL/CMOS Compatible
D
D
D
D
D
D
D
D
D
D
Reduced Power Consumption
Simple Logic Interface
High Accuracy
Reduce Board Space
Cellular Phones
Communication Systems
Portable Test Equipment
Battery Operated Systems
PCM Cards
PDA
DESCRIPTION
The DG3000 is a single-pole/double-throw monolithic CMOS
analog switch designed for high performance switching of
analog signals. Combining low power, high speed (tON: 24 ns,
tOFF: 9 ns), low on-resistance (rDS(on): 1.4 W) and small
physical size (MICRO FOOT, 6-bump), the DG3000 is ideal for
portable and battery powered applications requiring high
performance and efficient use of board space.
The DG3000 is built on Vishay Siliconix’s low voltage JI2
process. An epitaxial layer prevents latchup. Break-before
-make is guaranteed for DG3000.
Each switch conducts equally well in both directions when on,
and blocks up to the power supply level when off.
FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION
MICRO FOOT
(6-Bump)
TRUTH TABLE
IN
B1
A1
NO (Source1)
V+
B2
A2
COM
GND
B3
A3
Logic
NC
NO
0
ON
OFF
1
OFF
ON
NC (Source2)
ORDERING INFORMATION
Top View
A1 Locator
XXX
3000
Temp Range
Package
Part Number
-40 to 85°C
MICRO FOOT: 6-Bump
(2 x 3, 0.5-mm Pitch)
DG3000DB
Device Marking: 3000
xxx = Date/Lot Traceability Code
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
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1
DG3000
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS
Reference to GND
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6 V
IN, COM, NC, NOa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V+ + 0.3 V)
Continuous Current (Any terminal) . . . . . . . . . . . . . . . . . . . . . . . . . . . "50 mA
Peak Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . "200 mA
(Pulsed at 1 ms, 10% duty cycle)
Storage Temperature (D Suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Package Reflow Conditionsb
VPR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
IR/Convection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Power Dissipation (Packages)c
6-Bump, 2 x 3 MICRO FOOTd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mW
Notes:
a
Signals on NC, NO, or COM or IN exceeding V+ will be clamped by
internal diodes. Limit forward diode current to maximum current ratings.
b
Refer to IPC/JEDEC (J-STD-020A). No hand/manual solder rework
recommended
c
All bumps soldered to PC Board.
d
Derate 6.5 mW/_C above 25_C
SPECIFICATIONS (V+ = 2.0 V)
Test Conditions
Otherwise Unless Specified
Parameter
Symbol
V+ = 2.0 V, "10%, VIN = 0.4 or 1.6 Ve
Limits
-40 to 85_C
Tempa
Minb
Full
0
Typc
Maxb
Unit
V+
V
Analog Switch
Analog Signal Ranged
On-Resistance
rON Flatnessd
Switch Off Leakage Currentf
VNO, VNC,
VCOM
rON
V+ = 1.8 V, VCOM = 1.0 V, INO, INC = 10 mA
Room
Fulld
17
rON
Flatness
V+ = 1.8 V, VCOM = 0 to V+, INO, INC = 10 mA
Room
14
INO(off),
INC(off)
ICOM(off)
Channel-On Leakage Current f
ICOM(on)
20
22.5
W
V+ = 2.2 V
VNO, VNC = 0.5 V/1.5 V, VCOM = 1.5 V/0.5 V
V+ = 2.2 V, VNO, VNC = VCOM = 0.5 V/1.5 V
Room
Fulld
-700
-1 1
700
11
pA
nA
Room
Fulld
-700
-1 1
700
11
pA
nA
Room
Fulld
-700
-1 1
700
11
pA
nA
1.6
Digital Control
Input High Voltage
VINH
Full
Input Low Voltage
VINL
Full
Input Capacitanced
Cin
Full
Currentd
IINL or IINH
Input
VIN = 0 or V+
Full
0.4
5
-1
V
pF
1
mA
Dynamic Characteristics
Turn-On Time
tON
Turn-Off Time
tOFF
Break-Before-Make Time
Charge Injectiond
td
QINJ
Off-Isolationd
OIRR
Crosstalkd
XTALK
NO, NC Off Capacitanced
Channel-On Capacitanced
VNO or VNC = 1.5 V, RL = 300 W,
W CL = 35 pF
Figures 1 and 2
CNO(off),
CNC(off)
Room
Fulld
61
76
79
Room
Fulld
17
33
36
Room
CL = 1 nF, VGEN = 0 V, RGEN = 0 W, Figure 3
RL = 50 W
W, CL = 5 pF, f = 1 MHz
1
45
Room
2
Room
-61
Room
-67
Room
31
Room
98
pC
dB
VIN = 0 or V+, f = 1 MHz
CON
ns
pF
Power Supply
Power Supply Range
V+
Power Supply Currentd
I+
Power Consumption
PC
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2
1.8
0.1
VIN = 0 or V+
2.2
V
1.0
mA
2.2
mW
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
DG3000
Vishay Siliconix
SPECIFICATIONS (V+ = 3.0 V)
Limits
Test Conditions
Otherwise Unless Specified
Parameter
Symbol
V+ = 3 V, "10%, VIN = 0.4 or 2.0 Ve
-40 to 85_C
Tempa
Minb
Full
0
Typc
Maxb
Unit
V+
V
Analog Switch
Analog Signal Ranged
On-Resistanced
rON Flatnessd
Switch Off Leakage Current f
VNO, VNC,
VCOM
rON
V+ = 2.7 V, VCOM = 1.5 V, INO, INC = 10 mA
Room
Full
3.3
3.4
rON
Flatness
V+ = 2.7 V, VCOM = 0 to V+, INO, INC = 10 mA
Room
1.3
INO(off),
INC(off)
ICOM(off)
Channel-On Leakage Current f
ICOM(on)
V+ = 3.3 V
VNO, VNC = 1 V/3 V, VCOM = 3 V/1 V
V+ = 3.3 V, VNO, VNC = VCOM = 1 V/3 V
4.1
4.2
W
Room
Full
-800
-13
800
13
pA
nA
Room
Full
-800
-13
800
13
pA
nA
Room
Full
-800
-13
800
13
pA
nA
2
Digital Control
Input High Voltage
VINH
Full
Input Low Voltage
VINL
Full
Input Capacitanced
Input Currentd
Full
Cin
IINL or IINH
0.4
VIN = 0 or V+
Full
5
-1
V
pF
1
mA
Dynamic Characteristics
Turn-On Timed
tON
Turn-Off Timed
tOFF
Break-Before-Make Timed
td
Charge Injectiond
QINJ
Off-Isolationd
OIRR
Crosstalkd
XTALK
NO, NC Off Capacitanced
Channel-On Capacitanced
VNO or VNC = 2.0 V, RL = 300 W,
W CL = 35 pF
Figure 1 and 2
CNO(off),
CNC(off)
Room
Full
34
49
52
Room
Full
12
30
33
Room
CL = 1 nF, VGEN = 0 V, RGEN = 0 W, Figure 3
RL = 50 W
W, CL = 5 pF, f = 1 MHz
1
23
Room
4
Room
-61
Room
-67
Room
31
Room
47
pC
dB
VIN = 0 or V+, f = 1 MHz
CON
ns
pF
Power Supply
Power Supply Range
V+
Power Supply Currentd
I+
Power Consumption
PC
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
2.7
0.1
VIN = 0 or V+
3.3
V
1.0
mA
3.3
mW
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DG3000
Vishay Siliconix
SPECIFICATIONS (V+ = 5.0 V)
Limits
Test Conditions
Otherwise Unless Specified
Parameter
Symbol
V+ = 5 V, "10%, VIN = 0.8 or 2.4 Ve
-40 to 85_C
Tempa
Minb
Full
0
Typc
Maxb
Unit
V+
V
Analog Switch
Analog Signal Ranged
On-Resistance
rON Flatnessd
VNO, VNC,
VCOM
rON
V+ = 4.5 V, VCOM = 3 V, INO, INC = 10 mA
Room
Full
1.4
1.6
rON
Flatness
V+ = 4.5 V, VCOM = 0 to V+, INO, INC = 10 mA
Room
0.5
INO(off),
INC(off)
Switch Off Leakage Current
ICOM(off)
Channel-On Leakage Current
ICOM(on)
V+ = 5.5 V
VNO, VNC = 1 V/4.5 V, VCOM = 4.5 V/1 V
V+ = 5.5 V, V+ = 5.5 V
VNO, VNC = VCOM = 1 V/4.5 V
2.3
2.8
Room
Full
-1.2
-21
1.2
21
Room
Full
-1.2
-21
1.2
21
Room
Full
-1.2
-21
1.2
21
2.4
W
nA
Digital Control
Input High Voltage
VINH
Full
Input Low Voltage
VINL
Full
Input Capacitance
Input Current
Full
Cin
IINL or IINH
0.8
VIN = 0 or V+
Full
5
-1
V
pF
1
mA
Dynamic Characteristics
Turn-On Timed
tON
Turn-Off Timed
tOFF
Break-Before-Make Timed
td
Charge Injectiond
QINJ
Off-Isolationd
OIRR
Crosstalkd
XTALK
Source-Off Capacitanced
Channel-On Capacitanced
VNO or VNC = 3 V, RL = 300 W,
W CL = 35 pF
Figure 1 and 2
CNO(off),
CNC(off)
Room
Full
24
36
39
Room
Full
9
22
25
Room
CL = 1 nF, VGEN = 0 V, RGEN = 0 W, Figure 3
RL = 50 W
W, CL = 5 pF, f = 1 MHz
1
15
Room
38
Room
-61
Room
-67
Room
30
Room
96
pC
dB
VIN = 0 or V+, f = 1 MHz
CON
ns
pF
Power Supply
Power Supply Range
V+
Power Supply Current
I+
Power Consumption
PC
4.5
0.1
VIN = 0 or V+
5.5
V
1.0
mA
5.5
mW
Notes:
a.
b.
c.
d.
e.
f.
Room = 25°C, Full = as determined by the operating suffix.
The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
Typical values are for design aid only, not guaranteed nor subject to production testing.
Guarantee by design, nor subjected to production test.
VIN = input voltage to perform proper function.
Guaranteed by 5-V leakage testing, not production tested.
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Document Number: 71742
S-21483—Rev. C, 26-Aug-02
DG3000
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
rON vs. VCOM and Supply Voltage
20
r ON - On-Resistance ( W )
16
V+ = 1.8 V
12
8
V+ = 2 V
4
V+ = 3 V
V+ = 5 V
0
0
1
2
3
4
5
VCOM - Analog Voltage (V)
rON vs. Analog Voltage and Temperature
rON vs. Analog Voltage and Temperature
14
5
V+ = 3 V
r ON - On-Resistance ( W )
r ON - On-Resistance ( W )
12
10
8
V+ = 2 V
6
85_C
25_C
-40 _C
4
V+ = 5 V
85_C
25_C
-40 _C
2
1
2
3
4
25_C
85_C
3
-40 _C
2
1
0
0
4
0
0.0
5
0.5
1.0
VCOM - Analog Voltage (V)
2.0
2.5
3.0
VCOM - Analog Voltage (V)
Supply Current vs. Temperature
Supply Current vs. Input Switching Frequency
10 m
10
V+ = 5 V
VIN = 0 V
1m
I+ - Supply Current (A)
I+ - Supply Current (nA)
1.5
1
0.1
100 m
10 m
1m
100 n
0.01
-60
10 n
-40
-20
0
20
40
Temperature (_C)
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
60
80
100
10
100
1K
10 K
100 K
1M
10 M
Input Switching Frequency (Hz)
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DG3000
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Leakage Current vs. Temperature
Leakage vs. Analog Voltage
200
10000
V+ = 5.5 V
V+ = 5 V
T = 25_C
0
Leakage Current (pA)
Leakage Current (pA)
1000
INO(off)/INC(off)
100
ICOM(off)
ICOM(on)
10
-200
-400
INO(off)/INC(off)
ICOM(on)
-600
-800
ICOM(off)
-1000
-1200
1
-60
-40
-20
0
20
40
60
80
0
100
1
Switching Time vs. Temperature and Supply Voltage
10
Loss, OIRR, XTALK (dB)
50
40
tON V+ = 3 V
30
tON V+ = 5 V
20
tOFF V+ = 2 V
tOFF V+ = 3 V
tOFF V+ = 5 V
10
0
-60
4
5
LOSS
0
tON V+ = 2 V
60
3
Insertion Loss, Off-Isolation, Crosstalk vs. Frequency
70
t ON, t OFF - Switching Time (ns)
2
VCOM, VNO, VNC - Analog Voltage
Temperature (_C)
-10
-20
-30
-40
-50
OIRR
-60
V+ = 3 V
RL = 50 W
-70
XTALK
-80
-90
-40
-20
0
20
40
60
80
100
100 K
1M
10 M
100 M
1G
Frequency (Hz)
Temperature (_C)
Switching Threshold vs. Supply Voltage
Charge Injection vs. Analog Voltage
2.0
40
20
1.6
Q - Charge Injection (pC)
V T - Switching Threshold (V)
1.8
1.4
1.2
1.0
0.8
0.6
0.4
0
V+ = 3 V
V+ = 2 V
-20
-40
V+ = 5 V
-60
0.2
0.0
-80
0
1
2
3
4
V+ - Supply Voltage (V)
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6
5
6
0
1
2
3
4
5
VCOM - Analog Voltage (v)
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
DG3000
Vishay Siliconix
TEST CIRCUITS
V+
VINH
Logic
Input
VINL
V+
Switch
Input
Switch Output
COM
NO or NC
tr t 5 ns
tf t 5 ns
50%
VOUT
0.9 x VOUT
Switch
Output
IN
Logic
Input
RL
300 W
GND
CL
35 pF
0V
tOFF
tON
Logic “1” = Switch On
Logic input waveforms inverted for switches that have
the opposite logic sense.
CL (includes fixture and stray capacitance)
V OUT + V COM
ǒ
RL
R L ) R ON
Ǔ
FIGURE 1. Switching Time
V+
Logic
Input
V+
tr <5 ns
tf <5 ns
VINL
COM
NO
VNO
VINH
VO
NC
VNC
RL
300 W
IN
CL
35 pF
GND
VNC = VNO
VO
Switch
Output
90%
0V
tD
tD
CL (includes fixture and stray capacitance)
FIGURE 2. Break-Before-Make Interval
V+
DVOUT
V+
Rgen
COM
NC or NO
VOUT
VOUT
+
Vgen
IN
CL = 1 nF
IN
On
Off
On
GND
Q = DVOUT x CL
VIN = 0 - V+
IN depends on switch configuration: input polarity
determined by sense of switch.
FIGURE 3. Charge Injection
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
www.vishay.com
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DG3000
Vishay Siliconix
TEST CIRCUITS
V+
10 nF
V+
NC or NO
0V, 2.4 V
IN
COM
RL
V COM
Off Isolation + 20 log V
NOńNC
GND
Analyzer
FIGURE 4. Off-Isolation
V+
10 nF
V+
COM
Meter
IN
0 V, 2.4 V
NC or NO
HP4192A
Impedance
Analyzer
or Equivalent
GND
f = 1 MHz
FIGURE 5. Channel Off/On Capacitance
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Document Number: 71742
S-21483—Rev. C, 26-Aug-02
DG3000
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 6−BUMP (2 X 3, 0.5−mm PITCH)
6
O 0.150 X 0.180
Note 2
Solder Mask O X 0.280
0.5
Silicon
0.5
A2
A
A1
Recommended Land Pattern
Bump
Note 1
Index-Bump A1
Note 3
3
2
1
b Diameter
A
XXX
3000
E
e
B
S
S
Top Side (Die Back)
e
D
NOTES (Unless Otherwise Specified):
1.
Bump is Eutectic 63/57 Sn/Pb.
2.
Non-solder mask defined copper landing pad.
3.
Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
MILLIMETERS*
INCHES
Dim
Min
Max
Min
Max
A
0.615
0.715
0.0242
0.0281
A1
0.140
0.190
0.0055
0.0075
A2
0.475
0.525
0.0187
0.0207
b
0.180
0.250
0.0071
0.0098
D
1.555
1.585
0.0612
0.0624
E
1.055
1.085
0.0415
0.0427
e
S
0.5 BASIC
0.278
0.0197 BASIC
0.293
0.0109
0.0115
* Use millimeters as the primary measurement.
Document Number: 71742
S-21483—Rev. C, 26-Aug-02
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