SIP23 64x31.1

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP23 64x31.1
CASE 127BE
ISSUE O
( R 1.8)
64.0
55.6
DATE 30 APR 2012
295B C H−B
25.8
21.0
31.1
5.0
9.0
+0 . 2
3.6−0.1
+0 . 2
2.0
( 5.8)
DOCUMENT NUMBER:
0.5−0.05
22× 2=44.0
98AON79773E
4.0
23
1
+0 . 2
0.4−0.05
2.9
5.5
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
SIP23 64X31.1
1
DOCUMENT NUMBER:
98AON79773E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION FROM SANYO TO ON SEMICONDUCTOR. REQ.
BY D. TRUHITTE.
DATE
30 APR 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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© Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. O
Case Outline Number:
127BE