MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 5x6, 1.27P CASE 506BQ ISSUE C 1 DATE 12 APR 2012 2X SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. 4. PROFILE TOLERANCE APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINAL. 5. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 6. SEATING PLANE IS DEFINED BY THE TERMINALS. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 7. A VISUAL INDICATOR FOR PIN 1 MUST BE LOCATED IN THIS AREA. 0.20 C D A B D1 8 6 7 2X 0.20 C 5 E1 E PIN ONE IDENTIFIER NOTE 7 4X DIM A A1 b c D D1 D2 E E1 E2 e G h K L M N h 1 2 3 c 4 A1 TOP VIEW GENERIC MARKING DIAGRAM* 0.10 C A DETAIL A 0.10 C NOTE 4 C SIDE VIEW 1 XXXXXX AYWZZ SEATING PLANE NOTE 6 DETAIL A D2 1 8X M XXXXXX= Specific Device Code A = Assembly Location Y = Year W = Work Week ZZ = Lot Traceability 4 L E2 N K 8 G MILLIMETERS MIN MAX 0.90 1.10 0.05 0.33 0.51 0.20 0.33 5.15 BSC 4.50 5.10 3.90 4.30 6.15 BSC 5.50 6.10 3.00 3.50 1.27 BSC 0.80 1.20 12 _ 0.20 0.51 0.71 3.25 3.75 1.80 2.20 *This information is generic. Please refer to device data sheet for actual part marking. 5 e 8X BOTTOM VIEW SOLDERING FOOTPRINT* b 0.10 C A B 8X 0.05 c 0.75 NOTE 3 4X 1.27 PITCH 0.92 4X 4.84 0.90 2.00 6.59 3.70 0.99 4X 1.00 4.56 5.55 DIMENSION: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON38888E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 DESCRIPTION: October, 2002 Rev. 0 DFN8 5X6, 1.27P http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON38888E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY J. CARTER. 27 FEB 2009 A ADMIN CHANGE DUE TO WRONG FILE LOADED ON REV O. REQ. BY E. RIVAS. 02 MAR 2009 B CORRECTED DIMENSION K LABEL ON BOTTOM VIEW. REQ. BY S. WINSTON. 27 MAR 2009 C CORRECTED MARKING DIAGRAM TO ADD LOT TRACEABILITY. REQ. BY J. CARTER. 12 APR 2012 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2012 April, 2012 Rev. C Case Outline Number: 506BQ