MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE M 1 SCALE 2:1 DATE 27 MAY 2015 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D A 2 B D1 2X 0.20 C 4X E1 2 q E c 1 2 3 A1 4 TOP VIEW C DETAIL A 0.10 C SEATING PLANE A 0.10 C SIDE VIEW MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.00 5.15 5.30 4.70 4.90 5.10 3.80 4.00 4.20 6.00 6.15 6.30 5.70 5.90 6.10 3.45 3.65 3.85 1.27 BSC 0.51 0.575 0.71 1.20 1.35 1.50 0.51 0.575 0.71 0.125 REF 3.00 3.40 3.80 0_ −−− 12 _ DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q GENERIC MARKING DIAGRAM* DETAIL A 1 0.10 b C A B 0.05 c 8X XXXXXX AYWZZ e/2 e L 1 K RECOMMENDED SOLDERING FOOTPRINT* 2X E2 PIN 5 (EXPOSED PAD) G XXXXXX= Specific Device Code A = Assembly Location Y = Year W = Work Week ZZ = Lot Traceability 4 L1 M 0.495 4.560 2X *This information is generic. Please refer to device data sheet for actual part marking. 1.530 D2 3.200 BOTTOM VIEW 4.530 STYLE 1: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN STYLE 2: PIN 1. ANODE 2. ANODE 3. ANODE 4. NO CONNECT 5. CATHODE 1.330 2X 0.905 1 0.965 4X 1.000 4X 0.750 1.270 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON14036D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: REF TO JEDEC MO−240A © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com DFN5 5X6, 1.27P (SO−8FL) DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON14036D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY K. KIME. 13 JAN 2004 A ADDED STYLE 1. REQ. BY K. KIME. 23 MAR 2004 B ADDED DIMENSION M AND SOLDERING FOOTPRINT. UPDATED DESCRIPTION. REQ. BY K. KIME. 31 AUG 2005 C CHANGED DIMENSION A NOM FROM 0.99 TO 1.00 & MAX FROM 1.20 TO 1.10. REQ. BY L. DELUCA. 29 JUN 2007 D CHANGED PACKAGE DESCRIPTION FROM DFN6 TO DFN5. REQ. BY D. TRUHITTE. 31 MAR 2009 E ADDED STYLE 2. REQ. BY D. TRUHITTE. 17 AUG 2010 F CORRECTED MARKING DIAGRAM TO ADD LOT TRACEABILITY. REQ. BY J. CARTER. 12 APR 2012 G CHANGED K DIMENSIONS TO 1.2 MIN, 1.35 NOM, 1.5 MAX. REQ. BY D. TRUHITTE. 23 APR 2012 H MODIFIED DIMENSIONS D1, D2, E1, & E2. REQ. BY I. MARIANO. 05 MAR 2013 J ADDED MIN AND MAX VALUES TO DIMENSIONS D AND E. REQ. BY D. TRUHITTE. 17 JUN 2014 K CHANGED DIMENSION L1 TO NOMINAL VALUE OF 0.125. REQ. BY D. TRUHITTE. 10 JUL 2014 L ROTATED SOLDER FOOTPRINT 180 DEGREES TO MATCH TOP VIEW PIN ONE ORIENTATION. REQ. BY D. TRUHITTE. 26 SEP 2014 M CHANGED NOMINAL VALUES FOR DIMENSIONS G AND L TO 0.575. REQ. BY I. HYLAND. 27 MAY 2015 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2015 May, 2015 − Rev. M Case Outline Number: 488AA