Materials Declaration Package Body Size Ball Count Option Ball Size Item Epoxy resin SiO2 Filler Sb2O3 Carbon Black Item CSP BGA 10 X 10 108 SnPbAg 0.45 Molding Compound % of Compound 13.7 85 1 0.3 Laminate % of Laminate BT Resin Copper (Cu) Main agent Hardener Copper (Cu) Nickel (Ni) Gold (Au) 46 33.406 7.11 3.049 0.672 7.445 1.742 Solder Ball % of Solder Ball Weight (g) 1.12 E-02 6.96 E-02 8.19 E-04 2.46 E-04 PPM 52569 326159 3837 1151 Weight (g) 3.48 E-02 2.55 E-02 5.43 E-03 2.33 E-03 5.13 E-04 5.69 E-03 1.33 E-03 PPM 163039 119495 25433 10906 2404 26631 6231 Sn Pb Ag 62 36 2 Weight (g) 3.06 E-02 1.78 E-02 9.88 E-04 PPM 143415 83273 4626 Au Bond Wires % of Wire 99.99 Weight (g) 1.14 E-03 PPM 5318 100 Weight (g) 5.12 E-03 PPM 23982 80 20 Weight (g) 2.61 E-04 6.53 E-05 PPM 1222 306 Chip % of Chip Si Item Ag Filler Resin Die Attach % of Die Attach Item Pb Cd Hg Cr+6 PPM <10 <5 <10 <10 Molding Compound Method ICP-AES ICP-AES ICP-AES ICP-AES Package Totals PPM Weight (g) 1000000 2.14 E-01 AST-BC-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 2/2/05