Materials Declaration Package Body Size Ball Count Option Ball Size Item PBGA 19 X 19 260 SnPbAg 0.6mm Molding Compound % of Compound 71.0 25.0 2.5 1.5 Weight (g) 3.07 E-01 1.08 E-01 1.08 E-02 6.49 E-03 PPM 257841 90789 9079 5447 Laminate % of Laminate 25.0 25.0 19.0 12.2 11.0 7.8 Weight (g) 1.14 E-01 1.14 E-01 8.66 E-02 5.56 E-02 5.02 E-02 3.56 E-02 PPM 95688 95688 72723 46696 42103 29855 Solder Ball % of Solder ball 62.0 36.0 2.0 Weight (g) 1.53 E-01 8.90 E-02 4.94 E-03 PPM 128593 74667 4148 Item Weight (g) 8.51 E-03 PPM Au Bond Wires % of Wire 100.0 Item Si Chip % of Chip 100.0 Weight (g) 3.38 E-02 PPM 28377 Die Attach % of Die Attach 70.0 20.0 5.0 5.0 Weight (g) 9.31 E-03 2.66 E-03 6.65 E-04 6.65 E-04 PPM Silica Resin Antimony oxide Carbon Black Item BT-Epoxy Glass Fiber Copper Solder Mask Nickel Gold Item Sn Pb Ag Item Ag Filler Resin Silane Amine Package Totals Weight (g) 1.19 E+00 7143 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #7196A and #3060A Not Detected Analysis was performed by GC/MS Not Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #7196A and #3060A Not Detected Analysis was performed by GC/MS Not Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM <2 <2 <2 Not Detected Not Detected Not Detected Laminate Method SGS Test Report SGS Test Report SGS Test Report SGS Test Report SGS Test Report SGS Test Report 7815 2233 558 558 PPM 1000000 STS-B-C Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary 3/22/06