Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item BT Resin Glass fiber Cu Ni Soldermask Au Sn Ag Cu Subtotal BGA 23 X 23 225 SnAgCu 0.76 mm Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 27.0 25.0 18.0 11.0 11.0 8.0 Solder Ball % of Solder Ball 96.5 3.0 0.5 Weight (g) 5.47 E-01 3.80 E-02 3.80 E-02 9.51 E-03 1.90 E-03 6.34 E-01 PPM 284608 19810 19810 4953 991 330171 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Weight (g) 2.13 E-01 1.97 E-01 1.42 E-01 8.67 E-02 8.67 E-02 6.30 E-02 7.88 E-01 PPM 110786 102580 73857 45135 45135 32825 410318 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 3.69 E-01 1.15 E-02 1.91 E-03 3.83 E-01 PPM 192400 5982 997 199379 Die Attach Paste Au Bond Wires % of Wire 99.99 Weight (g) 9.52 E-03 PPM 4959 Si Chip % of Chip 100.0 Weight (g) 9.02 E-02 PPM 46980 Weight (g) 1.04 E-02 2.60 E-03 9.75 E-04 9.75 E-04 3.90 E-04 3.90 E-04 1.57 E-02 PPM 5417 1355 508 508 203 203 8193 Item Ag Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Die Attach % of Die Attach 66.1 16.5 6.2 6.2 2.5 2.5 Package Totals PPM Weight (g) 1000000 1.92 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Materials Declaration Package Body Size Ball Count Option Ball Size Item Silica Epoxy Resin Antimony trioxide Carbon Black Subtotal BGA 23 x 23 225 SnPbAg 0.76 mm Molding Compound % of Compound 93.1 5.5 1.1 0.3 Weight (g) 7.20 E-01 4.23 E-02 8.46 E-03 2.54 E-03 7.73 E-01 PPM 369404 21730 4346 1304 396783 Weight (g) 3.40 E-01 2.56 E-01 4.40 E-02 5.62 E-03 1.24 E-03 6.47 E-01 PPM 174622 131440 22588 2887 634 332171 Weight (g) 2.89 E-01 1.68 E-01 9.32 E-03 4.66 E-01 PPM 148299 86109 4784 239192 Weight (g) 1.07 E-02 PPM Au Bond Wires % of Wire 99.99 Si Chip % of Chip 100.0 Weight (g) 4.83 E-02 PPM 24799 Item Barium compounds Copper (Cu) Bismaleimide Triazine Resin Glass cloth Nickel Subtotal Solder Ball % of Plating 62.0 36.0 2.0 Sn Pb Ag Subtotal Item Ag Filler Resin Subtotal Laminate % of Laminate 52.57 39.57 6.8 0.869 0.191 Die Attach % of Die Attach 75.0 25.0 Weight (g) 2.27 E-03 7.58 E-04 3.03 E-03 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3051A/3052. ICP-OES None Detected EPA Method 3060A & 7196A. UV-VIS None Detected EPA Method 3540C/3550C. GC/MS None Detected EPA Method 3540C/3550C. GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach 5499 PPM 1167 389 1557 Package Totals Weight (g) PPM 1000000 1.95 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3051A/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS EPA Method 3540C/3550C. GC/MS EPA Method 3540C/3550C. GC/MS