Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item BT resin Glass fiber Cu Soldermask Ni Au Subtotal Sn Ag Cu Subtotal CSP BGA 10 X 10 100 SnAgCu 0.45 mm Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 25.0 25.0 19.0 12.2 11.0 7.8 Solder Ball % of Solder Ball 96.5 3 0.5 Weight (g) 9.88 E-02 6.88 E-03 6.88 E-03 1.72 E-03 3.44 E-04 1.15 E-01 PPM 382807 26646 26646 6660 1333 444091 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Weight (g) 1.99 E-02 1.99 E-02 1.51 E-02 9.69 E-03 8.73 E-03 6.19 E-03 7.94 E-02 PPM 76901 76901 58445 37528 33836 23992 307603 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 3.41 E-02 1.06 E-03 1.77 E-04 3.53 E-02 PPM 132052 4107 686 136845 Die Attach Paste Au Bond Wires % of Wire 99.99 Weight (g) 1.15 E-03 PPM 4467 Si Chip % of Chip 100 Weight (g) 2.48 E-02 PPM 95973 Weight (g) 1.88 E-03 4.70 E-04 1.76 E-04 1.76 E-04 7.10 E-05 7.10 E-05 2.85 E-03 PPM 7287 1821 682 682 275 275 11022 Item Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Die Attach % of Die Attach 66.11 16.53 6.2 6.2 2.48 2.48 Package Totals PPM Weight (g) 1000000 2.58 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3060A & EPA 7196A. UV-VIS. EPA 3540C/3550C. GC/MS EPA 3540C/3550C. GC/MS STS-BC-G Materials Declaration Package Body Size Ball Count Option Ball Size Item Silica fused Phenol & Epoxy resin Antimony oxide Carbon black Subtotal Item BT resin Glass fiber Cu Soldermask Ni Au Subtotal Sn Pb Ag Subtotal CSP BGA 10 X 10 100 SnPbAg 0.45 mm Molding Compound % of Compound 75.5 20.0 3.0 1.5 Laminate % of Laminate 25.0 25.0 19.0 12.2 11.0 7.8 Solder Ball % of Solder Ball 62 36 2 Weight (g) 8.65 E-02 2.29 E-02 3.44 E-03 1.72 E-03 1.15 E-01 PPM 329097 87178 13077 6537 435889 Weight (g) 1.99 E-02 1.99 E-02 1.51 E-02 9.69 E-03 8.73 E-03 6.19 E-03 7.94 E-02 PPM 75481 75481 57366 36836 33212 23549 301924 Weight (g) 2.49 E-02 1.44 E-02 8.02 E-04 4.01 E-02 PPM 94528 54886 3050 152464 Au Bond Wires % of Wire 99.99 Weight (g) 1.15 E-03 PPM 4384 Si Chip % of Chip 100 Weight (g) 2.48 E-02 PPM 94201 Weight (g) 2.07 E-03 5.16 E-04 1.94 E-04 7.70 E-05 7.70 E-05 2.93 E-03 PPM 7852 1962 738 293 293 11138 Item Ag Epoxy resin Silane Phenolic resin Curing agent & hardner Subtotal Die Attach % of Die Attach 70.49 17.62 6.61 2.64 2.64 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3051/3052. ICP-OES Not Detected EPA 3060A & EPA 7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS Not Detected EPA 3540C/3550C. GC/MS Package Totals PPM Weight (g) 1000000 2.63 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-BC-G