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Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Item
BT resin
Glass fiber
Cu
Soldermask
Ni
Au
Subtotal
Sn
Ag
Cu
Subtotal
CSP BGA
10 X 10
100
SnAgCu
0.45 mm
Molding Compound
% of Compound
86.2
6.0
6.0
1.5
0.3
Laminate
% of Laminate
25.0
25.0
19.0
12.2
11.0
7.8
Solder Ball
% of Solder Ball
96.5
3
0.5
Weight (g)
9.88 E-02
6.88 E-03
6.88 E-03
1.72 E-03
3.44 E-04
1.15 E-01
PPM
382807
26646
26646
6660
1333
444091
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3060A & EPA 7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS
Not Detected
EPA 3540C/3550C. GC/MS
Weight (g)
1.99 E-02
1.99 E-02
1.51 E-02
9.69 E-03
8.73 E-03
6.19 E-03
7.94 E-02
PPM
76901
76901
58445
37528
33836
23992
307603
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
3.41 E-02
1.06 E-03
1.77 E-04
3.53 E-02
PPM
132052
4107
686
136845
Die Attach Paste
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.15 E-03
PPM
4467
Si
Chip
% of Chip
100
Weight (g)
2.48 E-02
PPM
95973
Weight (g)
1.88 E-03
4.70 E-04
1.76 E-04
1.76 E-04
7.10 E-05
7.10 E-05
2.85 E-03
PPM
7287
1821
682
682
275
275
11022
Item
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
Subtotal
Die Attach
% of Die Attach
66.11
16.53
6.2
6.2
2.48
2.48
Package Totals
PPM
Weight (g)
1000000
2.58 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3060A & EPA 7196A. UV-VIS.
EPA 3540C/3550C. GC/MS
EPA 3540C/3550C. GC/MS
STS-BC-G
Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
Silica fused
Phenol & Epoxy resin
Antimony oxide
Carbon black
Subtotal
Item
BT resin
Glass fiber
Cu
Soldermask
Ni
Au
Subtotal
Sn
Pb
Ag
Subtotal
CSP BGA
10 X 10
100
SnPbAg
0.45 mm
Molding Compound
% of Compound
75.5
20.0
3.0
1.5
Laminate
% of Laminate
25.0
25.0
19.0
12.2
11.0
7.8
Solder Ball
% of Solder Ball
62
36
2
Weight (g)
8.65 E-02
2.29 E-02
3.44 E-03
1.72 E-03
1.15 E-01
PPM
329097
87178
13077
6537
435889
Weight (g)
1.99 E-02
1.99 E-02
1.51 E-02
9.69 E-03
8.73 E-03
6.19 E-03
7.94 E-02
PPM
75481
75481
57366
36836
33212
23549
301924
Weight (g)
2.49 E-02
1.44 E-02
8.02 E-04
4.01 E-02
PPM
94528
54886
3050
152464
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.15 E-03
PPM
4384
Si
Chip
% of Chip
100
Weight (g)
2.48 E-02
PPM
94201
Weight (g)
2.07 E-03
5.16 E-04
1.94 E-04
7.70 E-05
7.70 E-05
2.93 E-03
PPM
7852
1962
738
293
293
11138
Item
Ag
Epoxy resin
Silane
Phenolic resin
Curing agent & hardner
Subtotal
Die Attach
% of Die Attach
70.49
17.62
6.61
2.64
2.64
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3060A & EPA 7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS
Not Detected
EPA 3540C/3550C. GC/MS
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3051/3052. ICP-OES
Not Detected
EPA 3060A & EPA 7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS
Not Detected
EPA 3540C/3550C. GC/MS
Package Totals
PPM
Weight (g)
1000000
2.63 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
STS-BC-G