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a
108-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-108-2)
Dimensions shown in millimeters
A1 CORNER
INDEX AREA
13.00
BSC SQ
12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
BALL A1
INDICATOR
TOP VIEW
11.00
BSC SQ
BOTTOM
VIEW
1.00 BSC
DETAIL A
1.05
1.00
0.90
0.75
0.70
0.65
*0.64 TYP
SEATING
PLANE
0.12 MAX
COPLANARITY
BALL DIAMETER
*COMPLIANT WITH JEDEC STANDARDS MO-192-AAD-1 WITH
THE EXCEPTION OF PACKAGE HEIGHT AND BALL DIAMETER.
012006-0
*1.85
1.70
1.55
DETAIL A