a 108-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-108-2) Dimensions shown in millimeters A1 CORNER INDEX AREA 13.00 BSC SQ 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M BALL A1 INDICATOR TOP VIEW 11.00 BSC SQ BOTTOM VIEW 1.00 BSC DETAIL A 1.05 1.00 0.90 0.75 0.70 0.65 *0.64 TYP SEATING PLANE 0.12 MAX COPLANARITY BALL DIAMETER *COMPLIANT WITH JEDEC STANDARDS MO-192-AAD-1 WITH THE EXCEPTION OF PACKAGE HEIGHT AND BALL DIAMETER. 012006-0 *1.85 1.70 1.55 DETAIL A