a 237-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-237-2) Dimensions shown in millimeters 13.10 13.00 SQ 12.90 BALL A1 INDICATOR A1 CORNER INDEX AREA 18 16 14 12 10 8 6 4 2 19 17 15 13 11 9 7 5 3 1 A B C D E F G H J K L M N P R T U V W 11.70 BSC SQ TOP VIEW 0.65 BSC BOTTOM VIEW DETAIL A *1.40 MAX DETAIL A 0.65 MIN 0.15 MIN *COMPLIANT TO JEDEC STANDARDS MO-225 WITH THE EXCEPTION TO PACKAGE HEIGHT. 012006-0 SEATING PLANE 0.45 COPLANARITY 0.40 0.10 0.35 BALL DIAMETER