a 148-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-148) Dimensions shown in millimeters A1 CORNER INDEX AREA 9.10 9.00 SQ 8.90 BALL A1 PAD CORNER TOP VIEW 16 14 12 10 15 13 11 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T 7.50 BSC SQ 0.50 BSC DETAIL A *1.11 MAX 0.15 MIN 0.35 0.30 0.25 BALL DIAMETER SEATING PLANE *COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION TO DIMENSIONS PACKAGE HEIGHT AND THICKNESS. COPLANARITY 0.08 012006-0 *1.40 MAX DETAIL A