pdf

64-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-64-4)
Dimensions shown in millimeters
a
6.10
6.00 SQ
5.90
A1 CORNER
INDEX AREA
8
7
6
5
4
3
2
1
A
1.50
SQ
BALL A1
PAD CORNER
TOP VIEW
B
4.55 SQ
C
D
E
0.65
F
G
H
BOTTOM VIEW
DETAIL A
*1.40 MAX
DETAIL A
0.65 MIN
0.15 MIN
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
SEATING
PLANE
COPLANARITY
0.10
030907-B
0.45
0.40
0.35
BALL DIAMETER