144-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-144-3) Dimensions shown in millimeters A1 CORNER INDEX AREA 13 .00 BSC SQ 12 11 10 9 8 7 6 5 4 3 2 A B C D E F G H J K L M BALL A1 INDICATOR TOP VIEW *1.85 MAX DETAIL A 11.00 BCS SQ 1.00 BSC 1 BOTTOM VIEW *1.32 1.21 1.11 DETAIL A 0.53 0.43 0.70 0.60 0.50 BALL DIAMETER SEATING PLANE *COMPLIANT WITH JEDEC STANDARDS MO-192-AAD-1 WITH EXCEPTION TO PACKAGE HEIGHT AND THICKNESS. COPLANARITY 0.20 MAX 021506-A a