a 81-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-81-2) Dimensions shown in millimeters 7.10 7.00 SQ 6.90 A1 CORNER INDEX AREA 9 8 7 6 5 4 3 2 1 A B A1 BALL CORNER C 5.20 BSC SQ D E F G 0.65 BSC H J TOP VIEW DETAIL A DETAIL A 0.43 MAX 0.15 MIN SEATING PLANE 0.45 0.40 0.35 BALL DIAMETER *COMPLIANT WITH JEDEC STANDARDS MO-225 WITH EXCEPTION TO PACKAGE THICKNESS. 1.00 MAX 0.65 MIN 0.08 COPLANARITY 051607-A *1.20 1.13 1.06 BOTTOM VIEW