49-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-49-3) Dimensions shown in millimeters a 8.20 8.00 SQ 7.80 A1 CORNER INDEX AREA 7 6 5 4 3 2 1 A BALL A1 PAD CORNER TOP VIEW B C 6.00 BSC SQ D E F G 1.00 BSC DETAIL A BOTTOM VIEW DETAIL A 0.25 MIN 0.70 0.60 0.50 BALL DIAMETER SEATING PLANE *COMPLIANT WITH JEDEC STANDARDS MO-192-ABB-1 WITH EXCEPTION TO PACKAGE HEIGHT AND THICKNESS. *1.31 1.21 1.10 COPLANARITY 0.20 012006-0 *1.85 1.71 1.50