MICROSEMI TSPDMEDA001-85

2830 S. Fairview St.
Santa Ana, CA 92704
PH: (714) 979-8220
FAX: (714) 966-5256
PRODUCT
CAPABILITY
SHEET
Performance Advantages
• 50% real estate reduction over competition
• On State Dissipation is 1.5 to 2 times less than competition
• Switching Characteristics - (ton) - up to 10 times faster
• Can handle 3 times the surge as competition for the same physical area
• Custom designs in 3-4 weeks (competition does not offer custom arrangements)
Monolithic Flip Chip
Thyristor Surge
Protection Device
Array
for Implantable
Applications
Features
• Monolithic Flip Chip Construction, all contacts on one side
• Available with solderable surface
• Common Anode/Cathode available
• Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below)
• Available in 5-8.5 Volt versions
• Power Rating is 50 Joules at 37°C
• Also available in TVS (TVSMEDA Series)
Proposed Maximum Ratings @ 37°C-Body Temperature (unless otherwise specified)
Part Number
VDRM
VZ
VBO
IBO
IH
5
6
8
20
1
3
6
30
100
500
10
100
TSPDMEDA001-7.5
7.5
8
12
20
1
3
6
30
100
500
15
100
TSPDMEDA001-8.5
8.5
9
12
20
1
3
6
30
100
500
15
100
Volts
MAX
TSPDMEDA001-5
VT
VT
ITSM
IR
ton
VC
CO
@1 A @8 A
@ VWM
1kV/us @ 50Ω @ 0V
Volts Volts mA mA Volts Volts Amps
nA
nsec
Volts
pF
MIN MAX MAX MIN MAX MAX MAX
MAX
MAX
MAX
MAX
Monolithic Flip Chip Configurations
(in development)
Elementary
Cell
Schematic
2 mm
Max
2.5 mm
Max
Common
Cathode
These Monolithic Arrays will feature
multiple devices on one chip with all
contacts on one surface. The
surfaces are available with a
solderable metal contact.
MSC0988.PDF
2 mm
Max
5 mm
Max
For more information on these
devices contact Microsemi's Santa
Ana division for custom
configurations and designs.
Input
Common
Anode