MCP98242 MCP98242 Rev. A1 Silicon Errata The MCP98242 family devices that you have received conform functionally to the current Device Data Sheet (DS21996B), except for the anomalies described in this document. Devices on or after date code 0847 correct this issue. Data Sheet Clarifications The following typographic corrections and clarifications are to be noted for the latest version of the device data sheet (DS21996B): Note: Corrections are shown in bold. Where possible, the original bold text formatting has been removed for clarity. 1. Module: Sensor Temperature Register Update The MCP98242 device has internal intermittent timing issue. For example, if the previous temperature conversion is 31.75°C (byte 1 = ‘0000 0001’b and byte 2 = ‘1111 1100’b) and if the next temperature conversion from the internal ADC is complete after TCONV with 32.00°C (byte 1 = ‘0000 0010’b and byte 2 = ‘0000 0000’b) while byte 1 ‘0000 0001’b from previous conversion is in transmission via I2C to the host controller, then byte 2 can be over written by the second byte of the latest conversion data of ‘0000 0000’b. In this case, the host controller would read 16°C (byte 1 = ‘0000 0001’b and byte 2 = ‘0000 0000’b). Also, if the above conditions are met with the previous temperature conversion at 32.00°C and the next temperature conversion is 31.75°C, the host controller would read 48.75°C. Byte 1 must be in I2C transmission for this issue to occur and the ADC must complete conversion while I2C is in communication. In addition, the ambient temperature must be at multiples of 16°C±0.25°C for the temperature register to be partially overwritten. Under the specific boundary conditions listed below, the 2 byte temperature register TA may contain temperature data +16°C or -16°C from the nominal temperature due to internal data synchronization issue. Conditions: If the Lower Byte of the TA register rolls up or down: - from ‘1111 1100’b to ‘0000 0000’b - from ‘0000 0000’b to ‘1111 1100’b b) If the internal ADC conversion completes (TCONV = 65 ms) while the Upper Byte is in transmission via the I2C bus. a) Under these two conditions, the temperature reading may jump up or down by 16°C. © 2009 Microchip Technology Inc. DS80431C-page 1 MCP98242 Figure 1 shows flow diagram describing the specific conditions for the synchronization issue occurs. Table 1 shows a complete list of temperatures greater than 0°C. Continuous Temperature Conversion Begin I2C communication Begin TA Upper Byte Transmission Is Temperature 31.75°C? Note 2 No Yes Is internal ADC Conversion Done? No #Event Output Logic Yes Is Temperature 32.00°C? Note 2 No Note 1 #Event Pin Yes TA Lower Byte is overwritten by the new Lower Byte End TA Upper Byte Transmission Read TA Lower Byte Note 1: #Event output status is not affected by this issue. This issue relates to the I2C module shift register methodology only. 2: See Table 1 for the list of boundary conditions. FIGURE 1: DS80431C-page 2 Flow Chart. © 2009 Microchip Technology Inc. MCP98242 For temperature conditions other than Table 1, the device blocks data overwrite. Therefore, this issue will not occur. TABLE 1: TEMPERATURE BOUNDARY CONDITIONS AND OUTPUT ERROR FOR TEMPERATURES > 0°C Previous Temperature Next Temperature °C Binary °C Binary 15.75 0000 0000 1111 1100 16.00 16.00 0000 0001 0000 0000 15.75 31.75 0000 0001 1111 1100 32.00 Error °C Binary 0000 0001 0000 0000 0 0000 0000 0000 0000 0000 0000 1111 1100 31.75 0000 0001 1111 1100 0000 0010 0000 0000 16 0000 0001 0000 0000 32.00 0000 0010 0000 0000 31.75 0000 0001 1111 1100 47.75 0000 0010 1111 1100 47.75 0000 0010 1111 1100 48.00 0000 0011 0000 0000 32.00 0000 0010 0000 0000 48.00 0000 0011 0000 0000 47.75 0000 0010 1111 1100 63.75 0000 0011 1111 1100 63.75 0000 0011 1111 1100 64.00 0000 0100 0000 0000 48.00 0000 0011 0000 0000 64.00 0000 0100 0000 0000 63.75 0000 0011 1111 1100 79.75 0000 0100 1111 1100 79.75 0000 0100 1111 1100 80.00 0000 0101 0000 0000 64.00 0000 0100 0000 0000 80.00 0000 0101 0000 0000 79.75 0000 0100 1111 1100 95.75 0000 0101 1111 1100 97.75 0000 0101 1111 1100 96.00 0000 0101 0000 0000 80.00 0000 0101 0000 0000 96.00 0000 0110 0000 0000 97.75 0000 0101 1111 1100 111.75 0000 0110 1111 1100 111.75 0000 0110 1111 1100 112.00 0000 0111 0000 0000 96.00 0000 0110 0000 0000 112.00 0000 0111 0000 0000 111.75 0000 0110 1111 1100 127.75 0000 0111 1111 1100 The #Event output condition Part Numbers that fix this issue The data synchronization issue does not affect the #Event output status. The #Event output logic is not related to the I2C data transmission logic, therefore the #Event output will not false trigger. This issue is strictly related to the data transmission process with the host controller. Devices on or after date code 0847 correct this issue. The Device ID/Revision Register for these parts is set to 0x2000 hex. Work around If the ambient temperature read is within the host temperature limit, then do nothing. Otherwise, if the new temperature read is greater than or less than the previous temperature data by exactly 16.00°C, then perform a Repeat Read to receive the correct temperature data. There is a 0% probability that the Repeat Read data would be corrupted, if the Repeat Read is performed within TCONV (65 ms). If a Repeat Read is performed after 65 ms then there is a greater than 0% probability that the next conversion would also be corrupt by ±16.00°C as stated in Table 1. In this case, disregard this reading and perform a Repeat Read and compare the result with the last known good reading. Devices on or after date code 0915 have an updated Device ID/Revision of 0x2001 hex. These devices have been validated by Microchip Technology Inc. and Intel Corporation. • • • • • MCP98242T-BE/MNYBA2 MCP98242T-BE/MNYBAC MCP98242T-BE/MCBA2 MCP98242T-BE/MCBAC MCP98242-BE/MCBA2 This workaround is Microchip's recommendation and it has not been endorsed by Intel or other OEMs. If necessary, OEMs can contact Microchip to discuss other firmware solutions. © 2009 Microchip Technology Inc. DS80431C-page 3 MCP98242 APPENDIX A: DOCUMENT REVISION HISTORY Rev A Document (1/2009) • Initial Release of this Document. Rev B Document (1/2009) • Clarified initial workaround description and added additional verbiage to Part Numbers section. Rev C Document (5/2009) • Updated Section “Part Numbers that fix this issue” with date code for devices with Device/ Rev ID register of 0x2001. This document replaces this errata document: • DS80431B, “MCP98242 Rev. A1 Silicon Errata” DS80431C-page 4 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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