NCL30082SMRTGEVB NCL30082 8W Smart LED Driver Evaluation Board User's Manual Overview This manual covers the specification, theory of operation, testing and construction of the NCL30082DIMGEVB demonstration board. The NCL30082 board demonstrates an 8 W SEPIC LED driver with a 3.3 V aux voltage for power control accessories. www.onsemi.com EVAL BOARD USER’S MANUAL Table 1. SPECIFICATIONS Parameter Input Voltage (Class 2 Input, No Ground) Line Frequency Value Notes 100–120 V ac 50 Hz/60 Hz Power Factor (100% Load) 0.6 LED Output Voltage Range 40–80 V dc LED Output Current 100 mA dc Aux. Voltage (Available in All Modes) 3.3–3.5 V Typ. ±5% Aux. Current 20 mA Max. Efficiency 83.5% Typ. 90 mW Typ. (Top View) Standby Power 120 V 60 Hz Analog Dimming Voltage 100% Output VDIM > 2.5 V 0% Output VDIM < 0.1 V PWM Dimming Voltage 0–3.3 V PWM Range (Freq > 200 Hz) 0–100% Start Up Time (from AC On) < 600 ms Start Up Time (from Enable On) < 1 ms EMI (Conducted) Class B Typ. FCC/CISPR Key Features • Single Mains • Integrated Auto-Recovery Fault Protection (Can be Latched by • • • (Bottom View) Figure 1. NCL30082SMRTGEVB Evaluation Board Choice of Options) ♦ Over Temperature on Board (a PCB Mounted NTC) ♦ Over Current ♦ Output and VCC Over Voltage 3.3 V Aux Voltage ♦ Available in All Modes “Dim to Zero Output” On/Off Control © Semiconductor Components Industries, LLC, 2015 August, 2015 − Rev. 0 1 Publication Order Number: EVBUM2307/D NCL30082SMRTGEVB THEORY OF OPERATION Power Stage CrM Timing In the off time, the voltage on the transformer/inductor forward biases DOUT and D9. When the current in the magnetic has reached zero, the voltage collapses to zero. This voltage collapse triggers a comparator on the ZCD pin to start a new switching cycle. The ZCD pin also counts rings on the auxiliary winding for higher order valley operation. A failure of the ZCD pin to reach a certain threshold also indicates a shorted output condition. The power stage for the demo board is a non-isolated coupled SEPIC converter. The controller has a built in control algorithm that is specific to the flyback transfer function. Specifically: V OUT Duty + (1 * Duty) V IN (eq. 1) This is applicable to flyback, buck-boost, and SEPIC converters. The controller has a built in hardware algorithm that relates the output current to a reference on the primary side. I OUT + V REF @ N PS 2 @ R SENSE N PS + N PRI N SEC VCC Power The auxiliary winding forward biases D9 to provide power for the controller. This arrangement is called a “bootstrap”. Initially the CVCC, is charged through RSTART and RSTART1. When the voltage on CVCC reaches the startup threshold, the controller starts switching and providing power to the output circuit and the CVCC. CVCC discharges as the controller draws current. As the output voltage rises, the auxiliary winding starts to provide all the power to the controller. Ideally, this happens before CVCC discharges to the under voltage threshold where the controller stops operating to allow CVCC to recharge once again. The size of the output capacitor will have a large effect on the rise of the output voltage. Since the LED driver is a current source, the rise of output voltage is directly dependent on the size of the output capacitor. There are tradeoffs in the selection of COUT and CVCC. A low output ripple will require a large COUT value. This requires that CVCC be large enough to support VCC power to the controller while COUT is charging up. A large value of CVCC requires that RSTART and RSTART1 be lower in value to allow a fast enough startup time. Smaller values of RSTART and RSTART1 have higher static power dissipation which lowers efficiency of the driver. (eq. 2) (eq. 3) Where NPRI = Primary Turns and NSEC = Secondary Turns. We can now find RSENSE for a given output current. R SENSE + V REF @ N PS 2 @ I OUT (eq. 4) Line Feedforward The controller is designed to precisely regulate output current but variation input line voltage do have an impact. RLFF sets the line feedforward and compensates for power stage delay times by reducing the current threshold as the line voltage increases. RLFF is also used by the shorted pin detection. At start up the controller puts out a current to check for a shorted pin. If RLFF is zero, the current sense resistor is too low a value and the controller will not start because it will detect a shorted pin. So RLFF is required to make the controller operate properly. In practice, RLFF should be greater than 250 W. Output Voltage Sense The auxiliary winding voltage is proportional to the output voltage by the turns ratio of the output winding and the auxiliary winding. The controller has an overvoltage limit on the VCC pin at about 26 V minimum. Above that threshold, the controller will stop operation and enter overvoltage fault mode such as when an open LED string occurs. In cases where the output has a lot of ripple current and the LED has high dynamic resistance, the peak output voltage can be much higher than the average output voltage. The auxiliary winding will charge the CVCC to the peak of the output voltage which may trigger the OVP sooner than expected so in this case the peak voltage of the LED string is critical. Voltage Sense The voltage sense pin has several functions sets the brown level and line range selection. The amplitude of VIN is important for the range detection. Generally, the voltage on VIN should be 3.5 V peak at the highest input voltage of interest. Voltage on VIN must not be greater than 4 V under any operating condition. The voltage on VIN determines which valley the power stage will operate in. At low line and maximum load, the power stage operates in the first valley (standard CrM operation). At the higher line range, the power stage moves to the second valley to lower the switching frequency while retaining the advantage of CrM soft switching. Auxiliary Winding The auxiliary winding has 3 functions: 1. CrM Timing 2. VCC Power 3. Output Voltage Sense SD Pin The SD pin is a multi-function protection input. 1. Thermal Foldback Protection 2. Programmable OVP www.onsemi.com 2 NCL30082SMRTGEVB Programmable OVP While the SD pin has a current source for the OTP, it can be overcome raising the voltage on the SD pin. At about 2.5 V, the SD pin detects an OVP and shuts down the controller. Typically, a zener to VCC is used for this. In this way, the designer can set the OVP to a lower value that the OVP threshold built into the VCC pin. The zener programmable OVP is not implemented on this demo board. Thermal Protection There is an internal current source from the SD pin. Placing an NTC from the SD pin to ground will allow the designer to choose the level of current foldback protection from over temperature. Below 0.5 V on SD, the controller stops. Series or parallel resistors on the NTC and shape the foldback curve. In the event that the pin is left open, there is a soft voltage clamp at 1.35 V (nominal). Output current is reduced when the voltage on the SD pin drops below 1 V. Aux Power Management Figure 2. Aux Power Management Circuit Modifications Output 1. Wire 3 (Red) − LED+ 2. Wire 4 (Black) − LED– Output Current The output current is set by the value of RSENSE as shown above. It’s possible to adjust the output current by changing RSENSE. Since the magnetic is designed for 8 W, it is possible to increase the current while reducing the maximum LED forward voltage within limits. Changes of current of ±10% are within the existing EMI filter design and magnetic, changes of more than 10% may require further adjustments to the transformer or EMI filter. I/O (J7) 1. 3.3 V 2. On/Off 3. Dim 4. NC 5. Common 6. NC Connections AC Input 1. Wire 1 (White) − AC Line 2. Wire 2 (White) − AC Neutral www.onsemi.com 3 NCL30082SMRTGEVB Interface Control Signals the power on startup time to be longer than 0.5 s since power on timing is now a one-time event. In this case, RSTART and RSTART1 are optimized for low power consumption rather than an optimized startup time. Once the converter is operating, startup through on/off control is less than 1 ms. On/Off Control The on/off control defaults to “on” if left open. Grounding this pin to signal ground turns the output “off”. In “off” mode, the output voltage will regulate to ~16 V. This is well below the level that will cause the LEDs to pass current resulting in a true off mode. “Off” mode is also the standby mode. The standby power consumption is greatly affected by the values of RSTART and RSTART1. The designer may choose to trade off start up time for standby power consumption. In a “Smart Bulb” application, the mains power is left on so the bulb can be controlled remotely. This designer can choose to optimize standby power by allowing Dim Control The dim control input will accept either an analog or PWM signal. The output has full range from 0% to 100% output. A 0 V input to the dim connection causes Q4 to operate in linear mode which maintains the voltage on the dim pin of the controller at its minimum level. At 0 V on the dim connection, the output voltage will be ~25 V which is below the Vf of the LEDs. www.onsemi.com 4 5 www.onsemi.com t° 4 Figure 4. Main Schematic Com NCL30082 VCC GDrv CS VIN 5 6 7 8 RIFF 620 W Dim QFET NDD02N60Z RSENSE 1.0 W C13 4.7 mF VCC VCC_Lin C4 10 mF 200 V C15 4.7 mF D13 BAS21DW5T1G Keep Alive Regulator (Active in Off Mode) D12 MM5Z15VT1G R2 51.1 kW C11 1 nF 3 Dim Q3 MMBTA06LT1G ZCD R20 56 kW 2 U1 − SD AC2 1 L2 1.5 mH T1 + RZCD 56 kW D9 BAS21DW5T1G AC1 CVCC 4.7 mF RSTART1 1 MW LED+ FUSE RBO 3.01 MW RSTART 1 MW DOUT UFM15PL AC_N +HVDC AC_L 1 C5 100 nF 250 V NCL30082SMRTGEVB SCHEMATIC RDAMP 180 W F1 D4 +HVDC L1 1.5 mH C3 100 nF 250 V 1 ABS10 Figure 3. Input Circuit COUT 4.7 mF 100 V 6 Dim LED+ VCC_Lin VCC Figure 5. Interface Schematic www.onsemi.com ADJ VIN VOUT 2 R18 62 W Error Vo_Tap FB IN OUT Com 6th_Dn SENSE 4 3 2 1 CZIG 4.7 mF D14 BAS16XV2T1G R8 100 kW R9 100 kW R7 470 W Q1 MMBT3904WT1G 3.3 V Regulator (for Off State 3.3 V Power) LP2951ACDM−3.3 5 6 7 8 U2 20 mA Current Source (for Active Mode) 1 3 Off State Voltage Regulation D10 MM5Z15VT1G 1 2 C10 1 nF R6 10 kW R19 100 kW R11 12 kW R10 10 kW 3.5 V in Active Mode 3.3 V in Off Mode D15 MM5Z15VT1G Dim Disconnect Q4 BSS138 R15 100 kW R16 40.2 kW Q2 MMBT3904WT1G On/Off Control (Default in On) U4 NCP431A D11 BAS116LT1G LED+ 1 2 U5 LM317 1 2 3 4 5 6 J7 LED− LED+ TMS−103−02−G−D 1 1 NCL30082SMRTGEVB R21 3.32 kW NCL30082SMRTGEVB GERBER VIEWS Figure 6. Top Side PCB Figure 7. Bottom Side PCB www.onsemi.com 7 NCL30082SMRTGEVB Figure 8. PCB Outline www.onsemi.com 8 NCL30082SMRTGEVB All Wire 6″ ±0.5″. Strip Ends 0.5″ Wire 3 Red Wire 1 White Wire 4 Black Place the Label on Top of T1 “NCL30082SMRTGEVB” “Rev( )” Wire 2 White L2 Mounts Horizontally Figure 9. Assembly Notes Top Bevel Edge of D4 Indicates Polarity J7 on the Solder Side Figure 10. Assembly Notes Bottom www.onsemi.com 9 NCL30082SMRTGEVB CIRCUIT BARD FABRICATION NOTES 11. Size tolerance of plated holes: ±0.003″: non-plated holes ±0.002″. 12. All holes shall be ±0.003″ of their true position U.D.S. 13. Construction to be SMOBC, using liquid photo image (LPI) solder mask in accordance with IPC−SM−B40C, Type B, Class 2, and be green in color. 14. Solder mask mis-registration ±0.004 in. max. 15. Silkscreen shall be permanent non-conductive white ink. 16. The fabrication process shall be UL approved and the PCB shall have a flammability rating of UL94V0 to be marked on the solder side in silkscreen with date, manufactures approved logo, and type designation. 17. Warp and twist of the PCB shall not exceed 0.0075″ per in. 18. 100% electrical verification required. 19. Surface finish: electroless nickel immersion gold (ENIG). 20. RoHS 2002/95/EC compliance required. 1. Fabricate per IPC−6011 and IPC6012. Inspect to IPA−A−600 Class 2 or updated standard. 2. Printed Circuit Board is defined by files listed in fileset. 3. Modification to copper within the PCB outline is not allowed without permission, except where noted otherwise. The manufacturer may make adjustments to compensate for manufacturing process, but the final PCB is required to reflect the associated gerber file design ±0.001″ for etched features within the PCB outline. 4. Material in accordance with IPC−4101/21, FR4, Tg 125°C min. 5. Layer to layer registration shall not exceed ±0.004″. 6. External finished copper conductor thickness shall be 0.0026″ min. (i.e. 2 oz). 7. Copper plating thickness for through holes shall be 0.0013″ min. (i.e. 1 oz). 8. All holes sizes are finished hole size. 9. Finished PCB thickness 0.031″. 10. All un-dimensioned holes to be drilled using the NC drill data. www.onsemi.com 10 NCL30082SMRTGEVB SEPIC INDUCTOR SPECIFICATION Figure 11. SEPIC Inductor Specification www.onsemi.com 11 NCL30082SMRTGEVB ECA PICTURES Figure 12. Top View Figure 13. Bottom View www.onsemi.com 12 NCL30082SMRTGEVB TEST PROCEDURE Equipment Needed Test Connections • AC Source – 90 to 135 V ac 50/60 Hz minimum 500 W • • • • 1. Connect the LED load to the red(+) and black(−) leads through the ammeter shown in Figure 14. Caution: Observe the correct polarity or the load may be damaged. 2. Connect the AC power to the input of the AC wattmeter shown in Figure 14. Connect the white leads to the output of the AC wattmeter. 3. Connect the DC voltmeter as shown in Figure 14. capability AC Wattmeter – 300W minimum, true RMS input voltage, current, power factor, and THD 0.2% accuracy or better DC Voltmeter – 300 V dc minimum 0.1% accuracy or better DC Ammeter – 1 A dc minimum 0.1% accuracy or better LED Load – 75 V @ 0.1 A. A constant voltage electronic load is an acceptable substitute for the LEDs as long as it is stable Functional Test Procedure 1. Set the LED Load for 75 V output. 2. Set the input power to 120 V 60 Hz. Caution: Do not touch the ECA once it is energized because there are hazardous voltages present. DC Ammeter AC Power Source NOTE: AC Wattmeter UUT DC Voltmeter LED Test Load Unless otherwise specified, all voltage measurements are taken at the terminals of the UUT. Figure 14. Test Set Up Line and Load Regulation Table 2. 120 V/MAX LOAD LED Output Output Current 100 mA + 3 mA Output Power Power Factor 75 V 3.3 V Load = 0 75 V 3.3 V Load = 20 mA Output Voltage Aux Voltage Min 3.3 V 3.0 V 3.6 V LED Current = Max 3.3 V 3.0 V 3.6 V LED Current = 0 (Dim = 0 V) 3.3 V 3.0 V 3.6 V On/Off = Off Efficiency + V OUT @ I OUT P IN Measured @ 100% www.onsemi.com 13 Max NCL30082SMRTGEVB TEST DATA Figure 15. Efficiency over Load Figure 16. Regulation over Line www.onsemi.com 14 NCL30082SMRTGEVB Figure 17. Cross Regulation Effect of +3.3 Load on Output Current Figure 18. Cross Regulation Effect of Output Current on +3.3 V Output www.onsemi.com 15 NCL30082SMRTGEVB Figure 19. Standby Power Consumption over Line Figure 20. Start Up with AC Applied 120 V Maximum Load Figure 21. Start Up with Enable www.onsemi.com 16 NCL30082SMRTGEVB BILL OF MATERIALS Table 3. NCL30082SMRTGEVB BILL OF MATERIALS Qty. Reference Part Manufacturer Manufacturer Part Number PCB Footprint Substitution Allowed 4 C13, C15, CZIG, CVCC 4.7 mF Taiyo Yuden EMK107ABJ475KA-T 603 Yes 1 COUT 4.7 mF, 100 V AVX 12061Z475KAT2A 1206 Yes 2 C3, C5 100 nF, 250 V Epcos B32559-C3104-+*** CAP-BOX-LS5-3M5X7M2 Yes 1 C4 10 mF, 200 V Rubycon 200LLE10MEFC8X11.5 CAP-ALEL-8X12-HOR Yes 2 C10, C11 1 nF Kemet C0402C102K3GACTU 402 Yes 1 DOUT UFM15PL MCC UFM15PL SOD123FL Yes 1 D4 ABS10 Comchip ABS10 ABS10 Yes 2 D9, D13 BAS21DW5T1G ON Semiconductor BAS21DW5T1G SC-88A No 3 D10, D12, D15 MM5Z15VT1G ON Semiconductor MM5Z15VT1G SOD523 No 1 D11 BAS116LT1G ON Semiconductor BAS116LT1G SOT23 No 1 D14 BAS16XV2T1G ON Semiconductor BAS16XV2T1G SOD523 No 1 F1 FUSE Littelfuse 0263.500WRT1L FUSE-AXIAL-LS450 Yes 1 J7 TMS−103−02−G−D Samtec TMS-103-02-G-D Conn_Samtec_2X3 Yes 1 L1 1.5 mH Wurth 7447462152 IND-UPRIGHT-LS25 Yes 1 L2 1.5 mH Wurth 7447462152 IND-HOR-LS25 Yes 1 QFET NDD02N60Z ON Semiconductor NDD02N60Z IPAK No 2 Q1, Q2 MMBT3904WT1G ON Semiconductor MMBT2904WT1G SOT323 No 1 Q3 MMBTA06LT1G ON Semiconductor MMBTA06LT1G SOT23 No 1 Q4 BSS138 ON Semiconductor BSS138 SOT23 No 1 RBO 3.01 MW Yaego RC0805FR-073M01L 805 Yes 1 RDAMP 180 W Yaego RC0805JR-07180RL 805 Yes 1 RIFF 620 W Yaego RC0402FR-07620RL 402 Yes 1 RSENSE 1W Yaego RC1206FR-071RL 1206 Yes 2 RSTART1, RSTART 1.0 MW Yaego RC0805FR-071ML 805 Yes 1 RTCO 100 kW NTC Epcos B57331V2104J60 603 Yes 2 R20, RZCD 56 kW Yaego RC0805FR-0756KL 805 Yes 1 R2 51.1 kW Yaego RC0402FR-0751K1L 402 Yes 2 R6, R10 10 kW Yaego RC0402FR-0710KL 402 Yes 1 R7 470 W Yaego RC0402FR-07470RL 402 Yes 4 R8, R9, R15, R19 100 kW Yaego RC0402FR-07100KL 402 Yes 1 R11 12 kW Yaego RC0402FR-0712KL 402 Yes 1 R16 40.2 kW Yaego RC0402FR-0740K2L 402 Yes 1 R18 62 W Yaego RC0402FR-0762RL 402 Yes 1 R21 3.32 kW Yaego RC0402FR-073K32L 402 Yes 1 T1 XFRM_LINEAR Wurth 750315096 RM5_8P_TH Yes 1 U1 NCL30082B ON Semiconductor NCL30082B MICRO8 No 1 U2 LP2951ACDM−3.3 ON Semiconductor LP2951ACDM-3.3 MICRO8 No 1 U4 NCP431A ON Semiconductor NCP431A SOT23 No 1 U5 LM317 ON Semiconductor LM317LBDR2G TO92 No 6″ W1 Wire, Red, 24AWG McMaster Carr 7587K922 UL1569 Yes 6″ W2 Wire, Blk, 24AWG McMaster Carr 7587K921 UL1569 Yes 12″ W3, W4 Wire, Wht, 24AWG McMaster Carr 7587K924 UL1569 Yes NOTE: All components to comply with RoHS 2002/95/EC. www.onsemi.com 17 NCL30082SMRTGEVB ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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