EVBUM2293/D NCL30086SMRTGEVB 8W Smart LED Driver Evaluation Board User's Manual www.onsemi.com Overview This manual covers the specification, theory of operation, testing and construction of the NCL30086SMRTGEVB demonstration board. The NCL30086 board demonstrates an 8 W high PF SEPIC LED driver with a 3.3 V ‘always on’ auxiliary voltage rail to power a MCU/wireless transceiver plus other accessories. A simple dimming and ON/OFF control is also provided that demonstrates dimming control of the NCL30086 as well as dim to off operation. EVAL BOARD USER’S MANUAL Specifications Input voltage (Class 2 Input, No Ground) 100 – 265 V ac Line Frequency 50 Hz/60 Hz Power Factor (100% Load) 0.9 IEC61000−3−2 Class C Yes LED Output Voltage Range 40 – 80 V dc LED Output Current 100 mA dc Aux. Voltage (Available in All Modes) 3.3 – 3.5 V Aux. Current (User Adjustable) Efficiency Standby Power 230 V 50 Hz 120 V 60 Hz Typ. 20 mA Max. 84% Typ. Typ. 400 mW Universal Mains or 170 mW 230 V Optimized 170 mW Analog Dimming Voltage 100% Output 0% Output VDIM > 2.5 V VDIM < 0.1 V PWM Dimming Voltage 0 – 3.3 V PWM Range (Freq > 200 Hz) 0 – 100% Start Up Time < 500 ms Typ. Class B FCC/CISPR EMI (Conducted) Key Features • • • • Min. • 3.3V Aux Voltage Wide Mains IEC61000−3−2 Class C Compliance over Line and Load High Power Factor across Wide Line and Load Integrated Auto Recovery Fault Protection (Can be Latched by Choice of Options) ♦ Over Temperature on Board (a PCB Mounted NTC) ♦ Over Current ♦ Output and VCC Over Voltage © Semiconductor Components Industries, LLC, 2015 February, 2015 − Rev. 0 ♦ Available in All Modes • “Dim to Zero Output” • On/Off Control 1 Publication Order Number: EVBUM2293/D EVBUM2293/D Figure 1. NCL30086SMRTGEVB THEORY OF OPERATION Power Stage If R14 was not present, the measured voltage would be too low due to the low value of the current sense resistor and the controller will not start because it will detect a shorted pin. So R14 is required for proper operation and should be greater than 250 W. The power stage for the demo board is a non-isolated coupled SEPIC converter. The controller has a built in control algorithm that is specific to the flyback transfer function and applies to flyback, buck-boost, and SEPIC converters. Specifically: V OUT V IN + Duty (1 * Duty) Voltage Sense The voltage sense pin has several functions: 1. Basis for the Reference of the PFC Control Loop 2. Line Range Detection (eq. 1) The control is very similar to the control of the NCL30080−83 with the addition of a power factor correction control loop. The controller has a built in hardware algorithm that relates the output current to a reference on the primary side. I OUT + V REF @ N PS 2 @ R SENSE N PS + N PRI N SEC The reference scaling is automatically controller inside the controller. The shape of the voltage waveform on VS is critical for the PFC loop control. The amplitude of VS is important for the range detection. Generally, the voltage on VS should be 3.5 V peak at the highest input voltage of interest. Voltage on VS must not be greater than 4 V under any operating condition. The voltage on VS determines which valley the power stage will operate in. At low line and maximum load, the power stage operates in the first valley (standard CrM operation). At the higher line range, the power stage moves to the second valley to lower the switching frequency while retaining the advantage of quasi-resonant soft switching. (eq. 2) (eq. 3) Where: NPRI = Primary Turns NSEC = Secondary Turns We can now find RSENSE for a given output current. R SENSE + V REF @ N PS 2 @ I OUT Auxiliary Winding The auxiliary winding has 3 functions: 1. CrM Timing 2. VCC Power 3. Output Voltage Sense (eq. 4) Line Feedforward The controller is designed to precisely regulate output current and can be compensated to address variation due to line voltage variation. R14 sets the line feedforward and compensates for power stage delay times by reducing the current threshold as the line voltage increases. R14 is also used for the shorted CS (current sense) pin detection. At start up, the controller puts out a current to check for a shorted pin. CrM Timing In the off time, the voltage on the transformer/inductor forward biases DOUT and D9. When the current in the magnetic has reached zero, the voltage collapses to zero. This voltage collapse triggers a comparator on the ZCD pin to start a new switching cycle. The ZCD pin also counts rings www.onsemi.com 2 EVBUM2293/D In certain cases when the output has significant ripple current and the LED has high dynamic resistance, the peak output voltage can be much higher than the average output voltage. The auxiliary winding will charge the CVCC to the peak of the output voltage which may trigger the OVP sooner than expected so in this case the peak voltage of the LED string is critical. The design of the auxiliary winding turns ratio needs to factor in the absolute peak LED forward voltage. on the auxiliary winding for higher order valley operation. A failure of the ZCD pin to reach a certain threshold also indicates a shorted output condition. VCC Power The auxiliary winding forward biases D9 to provide power for the controller. This arrangement is called a “bootstrap”. Initially CVCC, is charged through R4 and R13. When the voltage on CVCC reaches the startup threshold, the controller starts switching and providing power to the output circuit and the CVCC. CVCC discharges as the controller draws current. As the output voltage rises, the auxiliary winding starts to provide all the power to the controller. Ideally, this happens before CVCC discharges to the under voltage threshold where the controller stops operating to allow CVCC to recharge once again. The size of the output capacitor will have a large effect on the rise of the output voltage. Since the LED driver is a current source, the rise of output voltage is directly dependent on the size of the output capacitor. There are tradeoffs in the selection of COUT and CVCC. A low output ripple will require a large COUT value. This requires that CVCC be large enough to support VCC power to the controller while COUT is charging up. A large value of CVCC requires that R4 and R13 be lower in value to allow a fast enough startup time. Smaller values of R4 and R13 have higher static power dissipation which lowers the efficiency of the driver. In general for a smart lighting application, startup time may not be as critical given that intent is that the driver IC is always biased even when the lamp is off. SD Pin The SD pin is a multi-function protection input. 1. Thermal Foldback Protection 2. Programmable OVP Thermal Protection There is an internal current source from the SD pin. Placing an NTC from the SD pin to ground will allow the designer to choose the level of current foldback protection in the event of high temperature. Output current is reduced when the voltage on the SD pin drops below 1 V. Below 0.5 V on SD, the controller stops. Addition of series or parallel resistors with the NTC can shape the foldback curve and this can be modeled using the on-line EXCEL® design tool. In the event that the pin is left open, there is a soft voltage clamp at 1.35 V (nominal). While the SD pin has a current source for the OTP, it can be overcome raising the voltage on the SD pin. At about 2.5 V, the SD pin detects an OVP and shuts down the controller. Typically, a zener to VCC is used for this. In this way, the designer can set the OVP to a lower value that the OVP threshold built into the VCC pin. The zener programmable OVP is not implemented on this demo board. Output Voltage Sense The auxiliary winding voltage is proportional to the output voltage by the turns ratio of the output winding and the auxiliary winding. The controller has an overvoltage limit on the VCC pin at 25.5 V minimum. Above that threshold, the controller will stop operation and enter overvoltage fault mode. This protection would normally be triggered if the LED string had an open. www.onsemi.com 3 EVBUM2293/D AUX Power Management NOTE: While this is shown for the NCL30082 controller, the management scheme is the same for the NCL30086SMRTGEVB demo board. Figure 2. AUX Power Management Circuit Modifications Interface Control Signals Output Current The output current is set by the value of RSENS as shown above. It’s possible to adjust the output current by changing RSENS. Since the magnetic is designed for 8 W, it is possible to increase the current while reducing the maximum LED forward voltage within limits. Changes of current of ±10 % are within the existing EMI filter design and magnetic, changes of more than 10 % may require further adjustments to the transformer or EMI filter. On/Off Control The on/off control defaults to “on” if left open. Grounding this pin to signal ground turns the output “off”. In “off” mode, the output voltage will regulate to ~16 V. This is well below the level that will cause the LEDs to pass current resulting in a true off mode. “Off” mode is also the standby mode. The standby power consumption is greatly affected by the values of R4 and R13. You can see this in Figure 22 for universal mains and 230 V optimized mains. The designer may choose to trade off start up time for standby power consumption. In a “Smart Bulb” application, the mains power is left on so the bulb can be controlled remotely. This designer can choose to optimize standby power by allowing the power on startup time to be longer than 0.5 s since power on timing is now a one-time event. In this case, R4 and R13 are optimized for low power consumption rather than an optimized startup time. Connections AC Input 1. AC Neutral 2. NC 3. AC Line Output 1. LED+ 2. LED– 3. NC 4. +3.3 V 5. Dim Input 6. On/Off Control 7. Signal Ground Dim Control The dim control input will accept either an analog or PWM signal. The output has full range from 0% to 100% output. A 0 volt input to the dim connection causes Q4 to operate in linear mode which maintains the voltage on the dim pin of the controller at its minimum level. At 0 volts on the dim connection, the output voltage will be ~25 V which is below the forward voltage of the LEDs. www.onsemi.com 4 EVBUM2293/D SCHEMATIC RDAMP 180 W +HVDC F1 J1 D4 FUSE 1 2 3 AC1 + AC2 − L1 1.5 mH C4 100 nF, 400 V ABS10 CON3 C3 100 nF, 400 V L2 1.5 mH +HVDC D9 BAS21DW5T1G R13 200 kW CVCC1 4.7 mF R12 620 kW 9 U3 Dim 3 C14 1 nF 2 VCC 1 Dim GDrv 4 NC 10 SD 7 5 Com Comp R3 12 kW RZCD 56 kW ZCD VS RTCO 100 kW NTC T1 Q3 MMBT5551LT1G R4 200 kW DOUT UFM15PL 6 CS Keep Alive Regulator (Active in Off Mode) 8 QFET NDD02N60Z NCL30086B D13 R5 56 kW VCC_Lin VCC R14 330 W BAS21DW5T1G RSENS 1.0 W t° LED+ D12 MM5Z15VT1G C5 100 nF 400 V COUT 33 mF 100 V Figure 3. Input Circuit C13 4.7 mF C15 4.7 mF C12 1.0 mF Figure 4. Main Schematic Available “3.3 V” Power quiescent current. For very low current draw on the 3.3 V aux output, U5 may not be needed. Variable loads on the 3.3 V aux output may result in flicker of the LED without the stabilization from U5. The design is setup for 20 mA, adjusting the value of R18 can raise or lower available current based on the specific application needs. In active mode, the current source (U5) and shunt (U4) represent a constant power load to the LED driver to ensure consistent LED current regulation regardless of the instantaneous demand on the 3.3 V output from the MCU/wireless transceiver plus other accessories. NCP431A was selected for the shunt regulator due to its low www.onsemi.com 5 6 www.onsemi.com Dim Figure 5. Interface Schematic 2 Com Sht_Dn Sense Out 4 3 2 1 D14 BAS16XV2T1G 20 mA Current Source (for Active Mode) VOUT LP2951ACDM−3.3 Error Vo_Tap FB In U2 ADJ VIN R18 62 W CZIG 4.7 mF R8 100 kW R9 100 kW R7 470 W Q1 MMBT3904WT1G 3.3 V Regulator (for Off State 3.3 V Power) 5 6 7 8 1 3 Off State Voltage Regulation D10 MM5Z15VT1G LED+ VCC_Lin VCC 1 2 On/Off Control (Default is On) Q2 MMBT2904WT1G C10 1 nF R6 10 kW U4 NCP431A D11 BAS115LT1G Q4 BSS138 R21 3.32 kW R11 12 kW 3.3 V On/Off Dim R10 10 kW 3.5 V in Active Mode 3.3 V in Off Mode R19 100 kW Dim Disconnect R15 100 kW R16 40.2 kW D15 MM5Z15VT1G LED+ 1 2 U5 LM317 7 5 6 4 2 3 1 CON7 J6 EVBUM2293/D EVBUM2293/D GERBER VIEWS Figure 6. Top Side PCB Figure 7. Bottom Side PCB www.onsemi.com 7 EVBUM2293/D 40.0 mm 80.0 mm Figure 8. PCB Outline Bevel Edge of D4 Indicates Polarity + Side of CVCC1 Mark Appropriate Revision Level Figure 9. Assembly Notes www.onsemi.com 8 EVBUM2293/D CIRCUIT BOARD FABRICATION NOTES 11. Size tolerance of plated holes: ±0.003 in.; non-plated holes ±0.002 in. 12. All holes shall be ±0.003 in. of their true position U.D.S. 13. Construction to be SMOBC, using liquid photo image (LPI) solder mask in accordance with IPC−SM−B40C, Type B, Class 2, and be green in color. 14. Solder mask mis-registration ±0.004 in. max. 15. Silkscreen shall be permanent non-conductive white ink. 16. The fabrication process shall be UL approved and the PCB shall have a flammability rating of UL94V0 to be marked on the solder side in silkscreen with date, manufactures approved logo, and type designation. 17. Warp and twist of the PCB shall not exceed 0.0075 in. per in. 18. 100% electrical verification required. 19. Surface finish: electroless nickel immersion gold (ENIG) 20. RoHS 2002/95/EC compliance required. 1. Fabricate per IPC−6011 and IPC6012. Inspect to IPA−A−600 Class 2 or updated standard. 2. Printed Circuit Board is defined by files listed in fileset. 3. Modification to copper within the PCB outline is not allowed without permission, except where noted otherwise. The manufacturer may make adjustments to compensate for manufacturing process, but the final PCB is required to reflect the associated gerber file design ±0.001 in. for etched features within the PCB outline. 4. Material in accordance with IPC−4101/21, FR4, Tg 125°C min. 5. Layer to layer registration shall not exceed ±0.004 in. 6. External finished copper conductor thickness shall be 0.0026 in. min. (ie 2oz) 7. Copper plating thickness for through holes shall be 0.0013 in. min. (ie 1oz) 8. All holes sizes are finished hole size. 9. Finished PCB thickness 0.062 in. 10. All un-dimensioned holes to be drilled using the NC drill data. ECA PICTURE Figure 10. Top View www.onsemi.com 9 EVBUM2293/D SEPIC INDUCTOR SPECIFICATION www.onsemi.com 10 EVBUM2293/D TEST PROCEDURE Equipment Needed Test Connections • AC Source – 90 to 305 V ac 50/60 Hz Minimum 500 W • • • • 1. Connect the LED Load to the red(+) and black(−) leads through the ammeter shown in Figure 11. Caution: Observe the correct polarity or the load may be damaged. 2. Connect the AC power to the input of the AC wattmeter shown in Figure 11. Connect the white leads to the output of the AC wattmeter 3. Connect the DC voltmeter as shown in Figure 11. Capability. AC Wattmeter – 300W Minimum, True RMS Input Voltage, Current, Power Factor, and THD 0.2% Accuracy or Better. DC Voltmeter – 300 V dc minimum 0.1% A|ccuracy or Better. DC Ammeter – 1 A dc Minimum 0.1%Accuracy or Better. LED Load – 75 V @ 0.1 A. A Constant Voltage Electronic Load is an Acceptable Substitute for the LEDs as long as it is Stable. DC Ammeter AC Power Source AC Wattmeter UUT DC Voltmeter NOTE: Unless otherwise specified, all voltage measurements are taken at the terminals of the UUT. Figure 11. Test Set Up Functional Test Procedure 1. Set the LED Load for 75 V Output. 2. Set the Input Power to 120 V 60 Hz. Caution: Do not touch the ECA once it is energized because there are hazardous voltages present. www.onsemi.com 11 LED Test Load EVBUM2293/D Line and Load Regulation Table 1. 120 V/MAX LOAD Output Current 100 mA 3 mA LED Output Output Power Power Factor 75 V 3.3 V Load = 0 75 V 3.3 V Load = 20 mA Output Voltage Aux Voltage Min 3.3 V 3.0 V Measured 3.6 V Max LED Current = Max 3.3 V 3.0 V 3.6 V LED Current = 0 (Dim = 0 V) 3.3 V 3.0 V 3.6 V On/Off = Off Table 2. 230 V/MAX LOAD Output Current 100 mA 3 mA LED Output Output Power Power Factor 75 V 3.3 V Load = 0 75 V 3.3 V Load = 20 mA Output Voltage Aux Voltage Min 3.3 V 3.0 V 3.6 V LED Current = Max 3.3 V 3.0 V 3.6 V LED Current = 0 (Dim = 0 V) 3.3 V 3.0 V 3.6 V On/Off = Off Efficiency + V OUT @ I OUT P IN Measured @ 100% www.onsemi.com 12 Max EVBUM2293/D TEST DATA Figure 12. Power Factor over Line and Load Figure 13. THD over Line and Load www.onsemi.com 13 EVBUM2293/D Figure 14. Efficiency over Line and Load Figure 15. Regulation over Line www.onsemi.com 14 EVBUM2293/D Figure 16. Cross Regulation Effect of +3.3 V Load on Output Current Figure 17. Cross Regulation Effect of Output Current on +3.3 V Output www.onsemi.com 15 EVBUM2293/D Figure 18. Standby Power Consumption over Line Figure 19. Start Up with AC Applied 120 V Maximum Load Figure 20. Start Up with AC Applied 230 V Maximum Load www.onsemi.com 16 EVBUM2293/D IEC61000−3−2 TEST RESULTS www.onsemi.com 17 EVBUM2293/D Figure 21. Pre-compliance Conducted EMI 150 kHz − 1.5 MHz Figure 22. Pre-compliance Conducted EMI 150 kHz − 30 MHz www.onsemi.com 18 EVBUM2293/D BILL OF MATERIALS Table 3. BILL OF MATERIALS Manufacturer Manufacturer Part Number PCB Footprint Substitution Allowed 4.7 mF AVX 33 mF, 100 V Rubycon TAJB475M035RNJ 1210 Yes 100ZLJ33M8X11.5 CAP_AL_8X11 4.7 mF Yes Taiyo Yuden EMK107ABJ475KA−T 603 Yes C3, C4 C5 100 nF, 400 V Epcos B32559C6104+*** CAP−BOX−LS5−5M0X7M2 Yes 120 nF, 400 V Epcos B32559C6124+*** CAP−BOX−LS5−5M0X7M2 2 Yes C10, C14 1 nF Kemet C0402C102K3GACTU 402 Yes 1 C12 1.0 mF Taiyo Yuden GMK107AB7105KAHT 603 Yes 1 DOUT UFM15PL MCC UFM15PL SOD123FL Yes 1 D4 ABS10 Comchip ABS10 ABS10 Yes 2 D9, D13 BAS21DW5T1G ON Semiconductor BAS21DW5T1G SC−88A No 3 D10, D12, D15 MM5Z15VT1G ON Semiconductor MM5Z15VT1G SOD523 No 1 D11 BAS116LT1G ON Semiconductor BAS116LT1G SOT23 No 1 D14 BAS16XV2T1G ON Semiconductor BAS16XV2T1G SOD523 No 1 F1 FUSE Littelfuse 0263.500WRT1L FUSE−HAIRPIN−LS25 Yes 1 J1 CON3 Wurth 6.91102E+11 CONN_3P_SCRMNT Yes 1 J6 CON7 On Shore OSTTA074163 CONN_7P_SCRMNT Yes 2 L1, L2 1.5 mH Wurth 7447462152 IND−UPRIGHT−LS25 Yes Quantity Reference 1 CVCC1 1 COUT 3 C13, C15, CZIG 2 1 Part 1 QFET NDD02N60Z ON Semiconductor NDD02N60Z IPAK No 2 Q1, Q2 MMBT3904WT1G ON Semiconductor MMBT3904WT1G SOT323 No 1 Q3 MMBT5551LT1G ON Semiconductor MMBT5551LT1G SOT23 No 1 Q4 BSS138 ON Semiconductor BSS138 SOT23 No 1 RDAMP 180 W Yaego RC0805JR−07180RL 805 Yes 1 RSENS 1W Yaego RC1206FR−071RL 1206 Yes 1 RTCO 100 kW NTC Epcos B57331V2104J60 603 Yes 2 R5, RZCD 56 kW Yaego RC0805FR−0756KL 805 Yes 2 R3, R11 12 kW Yaego RC0402FR−0712KL 402 Yes 2 R4, R13 200 kW Yaego RV1206FR−07200KL 1206 Yes 2 R6, R10 10 kW Yaego RC0402FR−0710KL 402 Yes 1 R7 470 W Yaego RC0402FR−07470RL 402 Yes 4 R8, R9, R15, R19 100 kW Yaego RC0402FR−07100KL 402 Yes 1 R12 620 kW Yaego RC1206FR−07620KL 1206 Yes 1 R14 330 W Yaego RC0402FR−07330RL 402 Yes 1 R16 40.2 kW Yaego RC0402FR−0740k2L 402 Yes 1 R18 62 W Yaego RC0402FR−0762RL 402 Yes 1 R21 3.32 kW Yaego RC0402FR−073K32L 402 Yes 1 T1 XFRM_LINEAR Wurth 750314910 RM6−8P−TH Yes 1 U2 LP2951ACDM−3.3 ON Semiconductor LP2951ACDM−3.3 MICRO8 No 1 U3 NCL30086B ON Semiconductor NCL30086 SO10 No 1 U4 NCP431A ON Semiconductor NCP431A SOT23 No 1 U5 LM317 ON Semiconductor LM317LBDR2G TO−92 No NOTE: All Components to comply with RoHS 2002/95/EC. www.onsemi.com 19 EVBUM2293/D Microsoft Excel is a registered trademark of Microsoft Corporation. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 20 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EVBUM2293/D