Materials Declaration Package Body Size LeadCount Option TQFP 7X7 48 Pb Free Molding Compound % of Compound Weight (g) 8 5.40 E-03 86 5.80 E-02 5 3.37 E-03 0.4 2.70 E-04 0.4 2.70 E-04 0.2 1.35 E-04 PPM 38869 417839 24293 1943 1943 972 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 355188 11077 2400 554 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Ag Internal Leadframe Plating % of Plating Weight (g) 1.19 E-03 100 Sn External Leadframe Plating Weight (g) % of Plating 100 2.48 E-03 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Bond Wires % of Wire 99.99 Au Si Item Resin Ag Filler Die Attach Paste Weight (g) 4.93 E-02 1.54 E-03 3.33 E-04 7.69 E-05 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A PPM 8569 PPM 17822 Weight (g) 1.07 E-03 PPM 100 Weight (g) 1.36 E-02 PPM 97780 Die Attach % of Die Attach 26 74 Weight (g) 4.72 E-04 1.34 E-03 PPM Chip % of Chip Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS 7688 3396 9667 Package Totals Weight (g) PPM 1000000 1.39 E-01 STS-SU-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/9/04 Materials Declaration Package Body Size LeadCount Option TQFP 7X7 48 Sn/Pb Molding Compound % of Compound Weight (g) 8 5.40 E-03 86 5.80 E-02 5 3.37 E-03 0.4 2.70 E-04 0.4 2.70 E-04 0.2 1.35 E-04 PPM 38869 417839 24293 1943 1943 972 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND PPM 355188 11077 2400 554 Item Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM <5.0 <5.0 <5.0 <5.0 Ag Internal Leadframe Plating % of Plating Weight (g) 1.19 E-03 100 Sn Pb External Leadframe Plating Weight (g) % of Plating 85 2.10 E-03 15 3.71 E-04 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Bond Wires % of Wire 99.99 Au Si Item Resin Ag Filler Die Attach Paste Weight (g) 4.93 E-02 1.54 E-03 3.33 E-04 7.69 E-05 Pb Cd Hg Cr+6 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A PPM 8569 PPM 15149 2673 Weight (g) 1.07 E-03 PPM 100 Weight (g) 1.36 E-02 PPM 97780 Die Attach % of Die Attach 26 74 Weight (g) 4.72 E-04 1.34 E-03 PPM Chip % of Chip Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS 7688 3396 9667 Package Totals Weight (g) PPM 1000000 1.39 E-01 STS-SU-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/9/04