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Materials Declaration
Package
Body Size
LeadCount
Option
TQFP
7X7
48
Pb Free
Molding Compound
% of Compound
Weight (g)
8
5.40 E-03
86
5.80 E-02
5
3.37 E-03
0.4
2.70 E-04
0.4
2.70 E-04
0.2
1.35 E-04
PPM
38869
417839
24293
1943
1943
972
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
355188
11077
2400
554
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
1.19 E-03
100
Sn
External Leadframe Plating
Weight (g)
% of Plating
100
2.48 E-03
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Bond Wires
% of Wire
99.99
Au
Si
Item
Resin
Ag Filler
Die Attach Paste
Weight (g)
4.93 E-02
1.54 E-03
3.33 E-04
7.69 E-05
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
PPM
8569
PPM
17822
Weight (g)
1.07 E-03
PPM
100
Weight (g)
1.36 E-02
PPM
97780
Die Attach
% of Die Attach
26
74
Weight (g)
4.72 E-04
1.34 E-03
PPM
Chip
% of Chip
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
7688
3396
9667
Package Totals
Weight (g)
PPM
1000000
1.39 E-01
STS-SU-B
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/9/04
Materials Declaration
Package
Body Size
LeadCount
Option
TQFP
7X7
48
Sn/Pb
Molding Compound
% of Compound
Weight (g)
8
5.40 E-03
86
5.80 E-02
5
3.37 E-03
0.4
2.70 E-04
0.4
2.70 E-04
0.2
1.35 E-04
PPM
38869
417839
24293
1943
1943
972
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
PPM
355188
11077
2400
554
Item
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
<5.0
<5.0
<5.0
<5.0
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
1.19 E-03
100
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
2.10 E-03
15
3.71 E-04
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Bond Wires
% of Wire
99.99
Au
Si
Item
Resin
Ag Filler
Die Attach Paste
Weight (g)
4.93 E-02
1.54 E-03
3.33 E-04
7.69 E-05
Pb
Cd
Hg
Cr+6
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
PPM
8569
PPM
15149
2673
Weight (g)
1.07 E-03
PPM
100
Weight (g)
1.36 E-02
PPM
97780
Die Attach
% of Die Attach
26
74
Weight (g)
4.72 E-04
1.34 E-03
PPM
Chip
% of Chip
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
7688
3396
9667
Package Totals
Weight (g)
PPM
1000000
1.39 E-01
STS-SU-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/9/04