Materials Declaration Package Body Size LeadCount Option LQFP 14 X 14 120 Pb Free Molding Compound % of Compound Weight (g) 8 1.67 E-02 86 1.79 E-01 5 1.04 E-02 0.4 8.34 E-04 0.4 8.34 E-04 0.2 4.17 E-04 PPM 28396 305257 17748 1420 1420 710 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 380638 11870 2572 594 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Ag Internal Leadframe Plating % of Plating Weight (g) 8.50 E-04 100 Sn External Leadframe Plating Weight (g) % of Plating 100 9.15 E-03 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Bond Wires % of Wire 99.99 Au Si Item Resin Ag Filler Die Attach Paste Weight (g) 2.24 E-01 6.97 E-03 1.51 E-03 3.49 E-04 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A PPM 1447 PPM 15578 Weight (g) 3.90 E-03 PPM 100 Weight (g) 1.21 E-01 PPM 205890 Die Attach % of Die Attach 26 74 Weight (g) 3.03 E-03 8.61 E-03 PPM Chip % of Chip Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS 6647 5152 14662 Package Totals Weight (g) PPM 1000000 5.87 E-01 STS-ST-C Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/21/04 Materials Declaration Package Body Size LeadCount Option LQFP 14 X 14 120 Sn/Pb Molding Compound % of Compound Weight (g) 8 1.67 E-02 86 1.79 E-01 5 1.04 E-02 0.4 8.34 E-04 0.4 8.34 E-04 0.2 4.17 E-04 PPM 28396 305257 17748 1420 1420 710 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS PPM 380638 11870 2572 594 Item Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM <5.0 <5.0 <5.0 <5.0 Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A Ag Internal Leadframe Plating % of Plating Weight (g) 8.50 E-04 100 Sn Pb External Leadframe Plating Weight (g) % of Plating 85 7.78 E-03 15 1.37 E-03 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Bond Wires % of Wire 99.99 Au Item Resin Ag Filler Pb Cd Hg Cr+6 PPM 1447 PPM 13242 2337 Weight (g) 3.90 E-03 PPM 100 Weight (g) 1.21 E-01 PPM 205890 Die Attach % of Die Attach 26 74 Weight (g) 3.03 E-03 8.61 E-03 PPM Chip % of Chip Si Weight (g) 2.24 E-01 6.97 E-03 1.51 E-03 3.49 E-04 6647 5152 14662 Package Totals Weight (g) PPM 1000000 5.87 E-01 STS-ST-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/21/04