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Materials Declaration
Package
Body Size
LeadCount
Option
TQFP
14 X 14
100
Pb Free
Molding Compound
% of Compound
Weight (g)
8
1.88 E-02
86
2.02 E-01
5
1.18 E-02
0.4
9.41 E-04
0.4
9.41 E-04
0.2
4.70 E-04
PPM
37018
397941
23136
1851
1851
925
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
401498
12521
2713
626
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
2.88 E-03
100
Sn
External Leadframe Plating
Weight (g)
% of Plating
100
5.16 E-03
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Bond Wires
% of Wire
99.99
Au
Si
Item
Resin
Ag Filler
Die Attach Paste
Weight (g)
2.04 E-01
6.37 E-03
1.38 E-03
3.18 E-04
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
PPM
5665
PPM
10142
Weight (g)
1.33 E-03
PPM
100
Weight (g)
4.00 E-02
PPM
78680
Die Attach
% of Die Attach
26
74
Weight (g)
3.02 E-03
8.58 E-03
PPM
Chip
% of Chip
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
2616
5932
16885
Package Totals
Weight (g)
PPM
1000000
5.08 E-01
STS-SU-B
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/9/04
Materials Declaration
Package
Body Size
LeadCount
Option
TQFP
14 X 14
100
Sn/Pb
Molding Compound
% of Compound
Weight (g)
8
1.88 E-02
86
2.02 E-01
5
1.18 E-02
0.4
9.41 E-04
0.4
9.41 E-04
0.2
4.70 E-04
PPM
37018
397941
23136
1851
1851
925
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
PPM
401498
12521
2713
626
Item
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
<5.0
<5.0
<5.0
<5.0
Internal Leadframe Plating
% of Plating
Weight (g)
2.88 E-03
100
PPM
Ag
PPM
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
4.38 E-03
15
7.73 E-04
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Item
Bond Wires
% of Wire
99.99
Au
Si
Item
Resin
Ag Filler
Die Attach Paste
Weight (g)
2.04 E-01
6.37 E-03
1.38 E-03
3.18 E-04
Pb
Cd
Hg
Cr+6
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
5665
8621
1521
Weight (g)
1.33 E-03
PPM
100
Weight (g)
4.00 E-02
PPM
78680
Die Attach
% of Die Attach
26
74
Weight (g)
3.02 E-03
8.58 E-03
PPM
Chip
% of Chip
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
2616
5932
16885
Package Totals
Weight (g)
PPM
1000000
5.08 E-01
STS-SU-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
9/9/04