Materials Declaration Package Body Size LeadCount Option TQFP 14 X 14 100 Pb Free Molding Compound % of Compound Weight (g) 8 1.88 E-02 86 2.02 E-01 5 1.18 E-02 0.4 9.41 E-04 0.4 9.41 E-04 0.2 4.70 E-04 PPM 37018 397941 23136 1851 1851 925 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 401498 12521 2713 626 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Ag Internal Leadframe Plating % of Plating Weight (g) 2.88 E-03 100 Sn External Leadframe Plating Weight (g) % of Plating 100 5.16 E-03 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Bond Wires % of Wire 99.99 Au Si Item Resin Ag Filler Die Attach Paste Weight (g) 2.04 E-01 6.37 E-03 1.38 E-03 3.18 E-04 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A PPM 5665 PPM 10142 Weight (g) 1.33 E-03 PPM 100 Weight (g) 4.00 E-02 PPM 78680 Die Attach % of Die Attach 26 74 Weight (g) 3.02 E-03 8.58 E-03 PPM Chip % of Chip Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS 2616 5932 16885 Package Totals Weight (g) PPM 1000000 5.08 E-01 STS-SU-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/9/04 Materials Declaration Package Body Size LeadCount Option TQFP 14 X 14 100 Sn/Pb Molding Compound % of Compound Weight (g) 8 1.88 E-02 86 2.02 E-01 5 1.18 E-02 0.4 9.41 E-04 0.4 9.41 E-04 0.2 4.70 E-04 PPM 37018 397941 23136 1851 1851 925 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND PPM 401498 12521 2713 626 Item Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM <5.0 <5.0 <5.0 <5.0 Internal Leadframe Plating % of Plating Weight (g) 2.88 E-03 100 PPM Ag PPM Sn Pb External Leadframe Plating Weight (g) % of Plating 85 4.38 E-03 15 7.73 E-04 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Item Bond Wires % of Wire 99.99 Au Si Item Resin Ag Filler Die Attach Paste Weight (g) 2.04 E-01 6.37 E-03 1.38 E-03 3.18 E-04 Pb Cd Hg Cr+6 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A 5665 8621 1521 Weight (g) 1.33 E-03 PPM 100 Weight (g) 4.00 E-02 PPM 78680 Die Attach % of Die Attach 26 74 Weight (g) 3.02 E-03 8.58 E-03 PPM Chip % of Chip Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS 2616 5932 16885 Package Totals Weight (g) PPM 1000000 5.08 E-01 STS-SU-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/9/04