Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg Ag Item Sn LQFP 7X7 64 Pb Free Molding Compound % of Compound Weight (g) 8 4.94 E-03 86 5.32 E-02 5 3.09 E-03 0.4 2.47 E-04 0.4 2.47 E-04 0.2 1.24 E-04 PPM 35444 381026 22153 1772 1772 886 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Molding Compound Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 5.00 E-02 1.56 E-03 3.38 E-04 7.80 E-05 PPM 358593 11183 2423 559 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Internal Leadframe Plating Weight (g) % of Plating 8.00 E-04 100 PPM 5735 External Leadframe Plating % of Plating Weight (g) 100 3.33 E-03 PPM 23895 Die Attach Paste Au Bond Wires % of Wire 99.99 Weight (g) 1.21 E-03 PPM 8674 Si Chip % of Chip 100 Weight (g) 1.85 E-02 PPM 132734 Die Attach % of Die Attach 26 74 Weight (g) 4.77 E-04 1.36 E-03 PPM 3419 9732 Item Resin Ag Filler Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A Package Totals PPM Weight (g) 1000000 1.40 E-01 STS-ST-D Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 07/19/04 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg LQFP 7X7 64 Sn/Pb Molding Compound % of Compound Weight (g) 8 4.94 E-03 86 5.32 E-02 5 3.09 E-03 0.4 2.47 E-04 0.4 2.47 E-04 0.2 1.24 E-04 PPM 35444 381026 22153 1772 1772 886 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 358593 11183 2423 559 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Internal Leadframe Plating Weight (g) % of Plating 8.00 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 85 2.83 E-03 15 5.00 E-04 Bond Wires % of Wire 99.99 Au Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS Die Attach Paste Weight (g) 5.00 E-02 1.56 E-03 3.38 E-04 7.80 E-05 Ag Item Molding Compound Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A PPM 5735 PPM 20310 3584 Weight (g) 1.21 E-03 PPM Weight (g) 1.85 E-02 PPM 132734 Weight (g) 4.77 E-04 1.36 E-03 PPM 8674 Chip % of Chip Si 100 Item Resin Ag Filler Die Attach % of Die Attach 26 74 3419 9732 Package Totals PPM Weight (g) 1000000 1.40 E-01 STS-ST-E Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 07/19/04