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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
LQFP
7X7
64
Pb Free
Molding Compound
% of Compound
Weight (g)
8
4.94 E-03
86
5.32 E-02
5
3.09 E-03
0.4
2.47 E-04
0.4
2.47 E-04
0.2
1.24 E-04
PPM
35444
381026
22153
1772
1772
886
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Molding Compound
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
5.00 E-02
1.56 E-03
3.38 E-04
7.80 E-05
PPM
358593
11183
2423
559
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Internal Leadframe Plating
Weight (g)
% of Plating
8.00 E-04
100
PPM
5735
External Leadframe Plating
% of Plating
Weight (g)
100
3.33 E-03
PPM
23895
Die Attach Paste
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.21 E-03
PPM
8674
Si
Chip
% of Chip
100
Weight (g)
1.85 E-02
PPM
132734
Die Attach
% of Die Attach
26
74
Weight (g)
4.77 E-04
1.36 E-03
PPM
3419
9732
Item
Resin
Ag Filler
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
Package Totals
PPM
Weight (g)
1000000
1.40 E-01
STS-ST-D
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
07/19/04
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
LQFP
7X7
64
Sn/Pb
Molding Compound
% of Compound
Weight (g)
8
4.94 E-03
86
5.32 E-02
5
3.09 E-03
0.4
2.47 E-04
0.4
2.47 E-04
0.2
1.24 E-04
PPM
35444
381026
22153
1772
1772
886
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
358593
11183
2423
559
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Internal Leadframe Plating
Weight (g)
% of Plating
8.00 E-04
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
2.83 E-03
15
5.00 E-04
Bond Wires
% of Wire
99.99
Au
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
Die Attach Paste
Weight (g)
5.00 E-02
1.56 E-03
3.38 E-04
7.80 E-05
Ag
Item
Molding Compound
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
PPM
5735
PPM
20310
3584
Weight (g)
1.21 E-03
PPM
Weight (g)
1.85 E-02
PPM
132734
Weight (g)
4.77 E-04
1.36 E-03
PPM
8674
Chip
% of Chip
Si
100
Item
Resin
Ag Filler
Die Attach
% of Die Attach
26
74
3419
9732
Package Totals
PPM
Weight (g)
1000000
1.40 E-01
STS-ST-E
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
07/19/04