Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 4 X 4 X 0.75 (2.7X1.4 & 2.7X0.95 EP) 24 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Component Level Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Others Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Others CAS# Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 2.14E-02 1.40E-03 8.89E-04 1.40E-03 6.34E-04 2.58E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 83.25 5.42 3.45 5.42 2.46 100.00 832500 54200 34500 54200 24600 1000000 41.79 2.72 1.73 2.72 1.23 50.20 PPM 417874 27206 17317 27206 12348 501951 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 37.63 0.91 0.05 0.01 38.59 1.93 E-02 4.65 E-04 2.38 E-05 5.94 E-06 1.98 E-02 PPM 376294 9070 463 116 385942 Internal / External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 90.9 6.8 2.3 100.00 909091 68182 22727 1000000 0.16 0.01 0.00 0.17 7.96 E-05 5.97 E-06 1.99 E-06 8.75 E-05 PPM 1551 116 39 1706 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.36 6.97 E-04 PPM 13577 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 9.38 4.81 E-03 PPM 93776 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Thermoset Other organic materials Others Others Subtotal Package Totals Substance Silver Acrylic resin Acrylate Polybutadiene derivative Epoxy resin Butadiene Copolymer Additive Peroxide CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 77.00 7.00 5.50 4.50 2.50 1.50 1.50 0.50 100.0 770000 70000 55000 45000 25000 15000 15000 5000 1000000 0.23 0.02 0.02 0.01 0.01 0.00 0.00 0.00 0.30 1.20 E-04 1.10 E-05 8.61 E-06 7.04 E-06 3.91 E-06 2.35 E-06 2.35 E-06 7.82 E-07 1.56 E-04 Weight (g) 5.13 E-02 Percentage (%) 100.00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 2348 213 168 137 76 46 46 15 3049 PPM 1000000