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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
4 X 4 X 0.75 (2.7X1.4 & 2.7X0.95 EP)
24
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Others
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Others
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
2.14E-02
1.40E-03
8.89E-04
1.40E-03
6.34E-04
2.58E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
83.25
5.42
3.45
5.42
2.46
100.00
832500
54200
34500
54200
24600
1000000
41.79
2.72
1.73
2.72
1.23
50.20
PPM
417874
27206
17317
27206
12348
501951
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
37.63
0.91
0.05
0.01
38.59
1.93 E-02
4.65 E-04
2.38 E-05
5.94 E-06
1.98 E-02
PPM
376294
9070
463
116
385942
Internal / External Leadframe Plating
Homogeneous Material Level
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Substance
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
90.9
6.8
2.3
100.00
909091
68182
22727
1000000
0.16
0.01
0.00
0.17
7.96 E-05
5.97 E-06
1.99 E-06
8.75 E-05
PPM
1551
116
39
1706
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.36
6.97 E-04
PPM
13577
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
9.38
4.81 E-03
PPM
93776
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Acrylic resin
Acrylate
Polybutadiene derivative
Epoxy resin
Butadiene Copolymer
Additive
Peroxide
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
77.00
7.00
5.50
4.50
2.50
1.50
1.50
0.50
100.0
770000
70000
55000
45000
25000
15000
15000
5000
1000000
0.23
0.02
0.02
0.01
0.01
0.00
0.00
0.00
0.30
1.20 E-04
1.10 E-05
8.61 E-06
7.04 E-06
3.91 E-06
2.35 E-06
2.35 E-06
7.82 E-07
1.56 E-04
Weight (g)
5.13 E-02
Percentage (%)
100.00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
2348
213
168
137
76
46
46
15
3049
PPM
1000000