Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 3 X 2 X 0.75 (2.44X 0.9 EP) 10 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Others Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Others CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 7.46E-03 4.86E-04 3.09E-04 4.86E-04 2.20E-04 8.96E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 83.25 5.42 3.45 5.42 2.46 100.00 832500 54200 34500 54200 24600 1000000 38.96 2.54 1.61 2.54 1.15 46.80 PPM 389577 25363 16145 25363 11512 467960 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7.38 E-03 1.78 E-04 9.09 E-06 2.27 E-06 7.57 E-03 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 38.56 0.93 0.05 0.01 39.55 PPM 385634 9295 475 119 395522 Internal / External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 3.04 E-05 2.28 E-06 7.61 E-07 3.35 E-05 Percentage (%) PPM Percentage (%) 90.9 6.8 2.3 100.00 909091 68182 22727 1000000 0.16 0.01 0.00 0.17 PPM 1589 119 40 1748 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 5.76 E-06 Percentage (%) PPM Percentage (%) 99.99 1000000 0.03 PPM 301 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 2.47 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 12.88 PPM 128813 Die Attach Component Level Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Thermoset Other organic materials Others Others Subtotal Package Totals Substance Silver Acrylic resin Acrylate Polybutadiene derivative Epoxy resin Butadiene Copolymer Additive Peroxide CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Weight (g) 8.34 E-05 7.58 E-06 5.96 E-06 4.87 E-06 2.71 E-06 1.62 E-06 1.62 E-06 5.41 E-07 1.08 E-04 Percentage (%) PPM Percentage (%) 77.00 7.00 5.50 4.50 2.50 1.50 1.50 0.50 100.0 770000 70000 55000 45000 25000 15000 15000 5000 1000000 0.44 0.04 0.03 0.03 0.01 0.01 0.01 0.00 0.57 Weight (g) 1.91 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 4355 396 311 255 141 85 85 28 5656 PPM 1000000