Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP 3X3 16 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 9.90E-03 6.89E-04 6.89E-04 1.72E-04 3.44E-05 1.15E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.00 862000 60000 60000 15000 3000 1000000 48.76 3.39 3.39 0.85 0.17 56.57 PPM 487600 33940 33940 8485 1697 565661 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 38.89 0.94 0.05 0.01 39.89 7.90 E-03 1.90 E-04 9.72 E-06 2.43 E-06 8.10 E-03 PPM 388942 9375 479 120 398915 Internal / External Leadframe Plating Component Level Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 97.3 2.2 0.5 100.00 973000 22000 5000 1000000 0.96 0.02 0.005 0.99 1.95 E-04 4.42 E-06 1.00 E-06 2.01 E-04 PPM 9626 218 49 9893 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.21 4.32 E-05 PPM 2128 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.76 3.56 E-04 PPM 17552 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.00 3.00 0.50 100.0 805000 100000 30000 30000 30000 5000 1000000 0.47 0.06 0.02 0.02 0.02 0.00 0.59 9.56 E-05 1.19 E-05 3.56 E-06 3.56 E-06 3.56 E-06 5.94 E-07 1.19 E-04 Weight (g) 2.03 E-02 Percentage (%) 100.00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 4710 585 176 176 176 29 5851 PPM 1000000