PDF

Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
6 X 6 X 0.75 (4.5 EP)
40
NiPdAu
MS010714B
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Others
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Others
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
83.25
5.42
3.45
5.42
2.46
100.00
832500
54200
34500
54200
24600
1000000
47.09
3.07
1.95
3.07
1.39
56.57
4.28E-02
2.79E-03
1.77E-03
2.79E-03
1.26E-03
5.14E-02
PPM
470913
30659
19515
30659
13915
565661
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
38.89
0.94
0.05
0.01
39.89
3.54 E-02
8.52 E-04
4.35 E-05
1.09 E-05
3.63 E-02
PPM
388942
9375
479
120
398915
Internal / External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.3
2.3
0.5
100.00
972697
22621
4683
1000000
0.96
0.02
0.005
0.99
8.75 E-04
2.03 E-05
4.21 E-06
8.99 E-04
PPM
9623
224
46
9893
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.21
1.93 E-04
PPM
2128
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.76
1.60 E-03
PPM
17552
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Acrylic resin
Acrylate
Polybutadiene derivative
Epoxy resin
Butadiene Copolymer
Additive
Peroxide
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
77.00
7.00
5.50
4.50
2.50
1.50
1.50
0.50
100.0
770000
70000
55000
45000
25000
15000
15000
5000
1000000
0.45
0.04
0.03
0.03
0.01
0.01
0.01
0.003
0.59
4.10 E-04
3.72 E-05
2.93 E-05
2.39 E-05
1.33 E-05
7.98 E-06
7.98 E-06
2.66 E-06
5.32 E-04
Weight (g)
9.09 E-02
Percentage (%)
100.00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
4505
410
322
263
146
88
88
29
5851
PPM
1000000