Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 6 X 6 X 0.75 (4.5 EP) 40 NiPdAu MS010714B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Others Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Others CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 83.25 5.42 3.45 5.42 2.46 100.00 832500 54200 34500 54200 24600 1000000 47.09 3.07 1.95 3.07 1.39 56.57 4.28E-02 2.79E-03 1.77E-03 2.79E-03 1.26E-03 5.14E-02 PPM 470913 30659 19515 30659 13915 565661 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 38.89 0.94 0.05 0.01 39.89 3.54 E-02 8.52 E-04 4.35 E-05 1.09 E-05 3.63 E-02 PPM 388942 9375 479 120 398915 Internal / External Leadframe Plating Component Level Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 97.3 2.3 0.5 100.00 972697 22621 4683 1000000 0.96 0.02 0.005 0.99 8.75 E-04 2.03 E-05 4.21 E-06 8.99 E-04 PPM 9623 224 46 9893 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.21 1.93 E-04 PPM 2128 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.76 1.60 E-03 PPM 17552 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Thermoset Other organic materials Others Others Subtotal Package Totals Substance Silver Acrylic resin Acrylate Polybutadiene derivative Epoxy resin Butadiene Copolymer Additive Peroxide CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 77.00 7.00 5.50 4.50 2.50 1.50 1.50 0.50 100.0 770000 70000 55000 45000 25000 15000 15000 5000 1000000 0.45 0.04 0.03 0.03 0.01 0.01 0.01 0.003 0.59 4.10 E-04 3.72 E-05 2.93 E-05 2.39 E-05 1.33 E-05 7.98 E-06 7.98 E-06 2.66 E-06 5.32 E-04 Weight (g) 9.09 E-02 Percentage (%) 100.00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 4505 410 322 263 146 88 88 29 5851 PPM 1000000