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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Isolated Backside
4 X 4 X 0.85 (2.34 EP)
24
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
29.56
4.35
0.11
34.01
1.23E-02
1.81E-03
4.39E-05
1.42 E-02
PPM
295615
43470
1054
340139
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
53.05
1.28
0.07
0.02
54.41
2.21 E-02
5.32 E-04
2.72 E-05
6.80 E-06
2.27 E-02
PPM
530477
12786
653
163
544079
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.20
5.00 E-04
PPM
12011
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.75
7.30 E-04
PPM
17535
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.20
5.00 E-04
PPM
12011
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
6.82
2.84 E-03
PPM
68220
Die Attach
Homogeneous Material Level
Description
Thermoset
Others
Subtotal
Package Totals
Substance
Epoxy Resin
Polymeric Resin
CAS#
Proprietary
Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
66.00
34.00
100.0
660000
340000
1000000
0.40
0.20
0.60
1.65 E-04
8.50 E-05
2.50 E-04
Weight (g)
4.16 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
PPM
3963
2042
6005
PPM
1000000