Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Isolated Backside 4 X 4 X 0.85 (2.34 EP) 24 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 29.56 4.35 0.11 34.01 1.23E-02 1.81E-03 4.39E-05 1.42 E-02 PPM 295615 43470 1054 340139 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 53.05 1.28 0.07 0.02 54.41 2.21 E-02 5.32 E-04 2.72 E-05 6.80 E-06 2.27 E-02 PPM 530477 12786 653 163 544079 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.20 5.00 E-04 PPM 12011 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.75 7.30 E-04 PPM 17535 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.20 5.00 E-04 PPM 12011 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 6.82 2.84 E-03 PPM 68220 Die Attach Homogeneous Material Level Description Thermoset Others Subtotal Package Totals Substance Epoxy Resin Polymeric Resin CAS# Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 66.00 34.00 100.0 660000 340000 1000000 0.40 0.20 0.60 1.65 E-04 8.50 E-05 2.50 E-04 Weight (g) 4.16 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 3963 2042 6005 PPM 1000000