Product / Package Information Environmental Information Package Body Size (mm) LeadCount Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant LFCSP - Punch 12 X 12 X 0.85 (6.9 EP) 100 100 Sn Yes Yes Yes Level A & B Compliant Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 1.52E-01 2.23E-02 5.41E-04 1.74E-01 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 39.46 5.80 0.14 45.40 PPM 394600 58025 1408 454033 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Nickel Silicon Zinc 7440-50-8 7440-02-0 7440-21-3 7440-66-6 Component Level Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 45.81 1.19 0.29 0.24 47.52 1.76 E-01 4.57 E-03 1.10 E-03 9.13 E-04 1.83 E-01 PPM 458099 11883 2853 2377 475212 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance CAS# 7440-22-4 Silver Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.30 1.14 E-03 PPM 2957 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.39 5.36 E-03 PPM 13947 Bond Wires B d Wi Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.13 4.33 E-03 PPM 11258 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 3.66 1.41 E-02 PPM 36641 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other inorganic materials Others Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary 96-48-0 Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 0.44 0.11 0.02 0.02 0.02 0.60 1.68 E-03 4.19 E-04 6.29 E-05 6.29 E-05 6.29 E-05 2.29 E-03 Weight (g) 3.84 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100 PPM 4368 1092 164 164 164 5951 PPM 1000000