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Product / Package Information
Environmental Information
Package
Body Size (mm)
LeadCount
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
LFCSP - Punch
12 X 12 X 0.85 (6.9 EP)
100
100 Sn
Yes
Yes
Yes
Level A & B Compliant
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
1333-86-4
1.52E-01
2.23E-02
5.41E-04
1.74E-01
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.9
12.8
0.3
100.00
869100
127800
3100
1000000
39.46
5.80
0.14
45.40
PPM
394600
58025
1408
454033
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Nickel
Silicon
Zinc
7440-50-8
7440-02-0
7440-21-3
7440-66-6
Component Level
Percentage (%)
PPM
Percentage (%)
96.40
2.50
0.60
0.50
100.00
963989
25006
6004
5001
1000000
45.81
1.19
0.29
0.24
47.52
1.76 E-01
4.57 E-03
1.10 E-03
9.13 E-04
1.83 E-01
PPM
458099
11883
2853
2377
475212
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
CAS#
7440-22-4
Silver
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.30
1.14 E-03
PPM
2957
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.39
5.36 E-03
PPM
13947
Bond
Wires
B d Wi
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.13
4.33 E-03
PPM
11258
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.66
1.41 E-02
PPM
36641
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other inorganic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
96-48-0
Weight (g)
Percentage (%)
PPM
Percentage (%)
73.40
18.35
2.75
2.75
2.75
100.0
734000
183500
27500
27500
27500
1000000
0.44
0.11
0.02
0.02
0.02
0.60
1.68 E-03
4.19 E-04
6.29 E-05
6.29 E-05
6.29 E-05
2.29 E-03
Weight (g)
3.84 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100
PPM
4368
1092
164
164
164
5951
PPM
1000000