Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 10 X 10 X 0.85 (6.75 EP) 84 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 8.85E-02 1.30E-02 3.16E-04 1.02 E-01 Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 32.39 4.76 0.12 37.26 PPM 323858 47623 1155 372636 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Nickel Silicon Zinc Silver CAS# 7440-50-8 7440-02-0 7440-21-3 7440-66-6 7440-22-4 Component Level Weight (g) 1.31 E-01 3.40 E-03 8.16 E-04 6.80 E-04 4.08 E-05 1.36 E-01 Percentage (%) PPM Percentage (%) 96.37 2.50 0.60 0.50 0.03 100.00 963700 25000 6000 5000 300 1000000 47.97 1.24 0.30 0.25 0.01 49.78 PPM 479705 12444 2987 2489 149 497775 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 5.96 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.22 PPM 2181 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 4.59 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.68 PPM 16800 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Component Level Weight (g) 3.64 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.33 PPM 13323 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 2.54 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 9.28 PPM 92784 Die Attach 2 Description Thermoset Others Subtotal Package Totals Substance Epoxy Resin Polymeric Resin CAS# Weight (g) Proprietary Proprietary 8.12 E-04 4.18 E-04 1.23 E-03 Weight (g) 2.73 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Homogeneous Material Level Percentage (%) PPM 66.00 660000 34.00 340000 100.0 1000000 Component Level Percentage (%) 0.30 0.15 0.45 Percentage (%) 100 PPM 2971 1531 4502 PPM 1000000