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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched
10 X 10 X 0.85 (6.75 EP)
84
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
8.85E-02
1.30E-02
3.16E-04
1.02 E-01
Percentage (%)
PPM
Percentage (%)
86.9
12.8
0.3
100.00
869100
127800
3100
1000000
32.39
4.76
0.12
37.26
PPM
323858
47623
1155
372636
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Nickel
Silicon
Zinc
Silver
CAS#
7440-50-8
7440-02-0
7440-21-3
7440-66-6
7440-22-4
Component Level
Weight (g)
1.31 E-01
3.40 E-03
8.16 E-04
6.80 E-04
4.08 E-05
1.36 E-01
Percentage (%)
PPM
Percentage (%)
96.37
2.50
0.60
0.50
0.03
100.00
963700
25000
6000
5000
300
1000000
47.97
1.24
0.30
0.25
0.01
49.78
PPM
479705
12444
2987
2489
149
497775
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
5.96 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.22
PPM
2181
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
4.59 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.68
PPM
16800
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Component Level
Weight (g)
3.64 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.33
PPM
13323
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
2.54 E-02
Percentage (%)
PPM
Percentage (%)
100.0
1000000
9.28
PPM
92784
Die Attach 2
Description
Thermoset
Others
Subtotal
Package Totals
Substance
Epoxy Resin
Polymeric Resin
CAS#
Weight (g)
Proprietary
Proprietary
8.12 E-04
4.18 E-04
1.23 E-03
Weight (g)
2.73 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Homogeneous Material Level
Percentage (%)
PPM
66.00
660000
34.00
340000
100.0
1000000
Component Level
Percentage (%)
0.30
0.15
0.45
Percentage (%)
100
PPM
2971
1531
4502
PPM
1000000