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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched
5 X 5 X 0.85 (3.1 EP)
20
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.9
12.8
0.3
100.00
869100
127800
3100
1000000
22.87
3.36
0.08
26.31
1.71E-02
2.51E-03
6.09E-05
1.97E-02
PPM
228680
33627
816
263123
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
47.65
1.15
0.06
0.01
48.88
3.56 E-02
8.58 E-04
4.38 E-05
1.10 E-05
3.65 E-02
PPM
476533
11486
587
147
488752
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
CAS#
7440-22-4
Silver
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.75
5.60 E-04
PPM
7499
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.67
1.25 E-03
PPM
16738
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.67
1.25 E-03
PPM
16738
Chip
Component Level
Homogeneous Material Level
Description
O h iinorganic
Other
i materials
i l
Substance
Doped
D
d Silicon
Sili
CAS#
7440-21-3
440 21 3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
12.43
9.28
9 28 E-03
E 03
PPM
124264
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other inorganic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
96-48-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
73.40
18.35
2.75
2.75
2.75
100.0
734000
183500
27500
27500
27500
1000000
6.08
1.52
0.23
0.23
0.23
8.29
4.54 E-03
1.14 E-03
1.70 E-04
1.70 E-04
1.70 E-04
6.19 E-03
Weight (g)
7.47 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100
PPM
60839
15210
2279
2279
2279
82887
PPM
1000000