Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 5 X 5 X 0.85 (3.1 EP) 20 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 22.87 3.36 0.08 26.31 1.71E-02 2.51E-03 6.09E-05 1.97E-02 PPM 228680 33627 816 263123 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 47.65 1.15 0.06 0.01 48.88 3.56 E-02 8.58 E-04 4.38 E-05 1.10 E-05 3.65 E-02 PPM 476533 11486 587 147 488752 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals CAS# 7440-22-4 Silver Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.75 5.60 E-04 PPM 7499 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.67 1.25 E-03 PPM 16738 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.67 1.25 E-03 PPM 16738 Chip Component Level Homogeneous Material Level Description O h iinorganic Other i materials i l Substance Doped D d Silicon Sili CAS# 7440-21-3 440 21 3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 12.43 9.28 9 28 E-03 E 03 PPM 124264 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other inorganic materials Others Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary 96-48-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 6.08 1.52 0.23 0.23 0.23 8.29 4.54 E-03 1.14 E-03 1.70 E-04 1.70 E-04 1.70 E-04 6.19 E-03 Weight (g) 7.47 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100 PPM 60839 15210 2279 2279 2279 82887 PPM 1000000